公开(公告)号：US11939492B2

公开(公告)日：2024-03-26

申请号：US17744191

申请日：2022-05-13

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Hirokazu Iizuka ,  Kunihiro Takei ,  Yuiko Maruyama ,  Yuki Sato

IPC分类号： C09J7/20 ,  B32B37/12 ,  B32B38/00 ,  C09J7/30 ,  C09J123/26 ,  C09J151/06 ,  C09J163/04

CPC分类号： C09J123/26 ,  B32B37/12 ,  B32B38/0036 ,  C09J7/20 ,  C09J7/30 ,  C09J151/06 ,  C09J163/04 ,  C08L2201/56 ,  Y10T428/287 ,  C09J151/06 ,  C08L63/04

摘要： The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.

公开(公告)号：US11904577B2

公开(公告)日：2024-02-20

申请号：US17034334

申请日：2020-09-28

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Kunihiro Takei ,  Yuiko Maruyama ,  Hirokazu Iizuka

IPC分类号： B32B7/12 ,  B32B27/08 ,  B29C48/08 ,  B29C48/21 ,  B29C48/00 ,  B32B27/32 ,  B32B27/38 ,  C09J125/08 ,  C09J123/26 ,  C08L23/06 ,  C08L23/20 ,  C09J7/35 ,  B32B27/00 ,  C09J151/06 ,  C09J163/00 ,  C09J7/29 ,  B32B27/20 ,  B32B27/30 ,  B32B27/34 ,  B05D1/26 ,  B29K9/00 ,  B29K19/00 ,  B29K23/00 ,  B29K33/00 ,  B29K63/00 ,  B29K105/00

CPC分类号： B32B27/08 ,  B29C48/022 ,  B29C48/08 ,  B29C48/21 ,  B32B27/00 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B27/327 ,  B32B27/34 ,  B32B27/38 ,  C08L23/06 ,  C08L23/20 ,  C09J7/29 ,  C09J7/35 ,  C09J123/26 ,  C09J125/08 ,  C09J151/06 ,  C09J163/00 ,  B05D1/265 ,  B29K2009/00 ,  B29K2019/00 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2033/08 ,  B29K2063/00 ,  B29K2105/0097 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2270/00 ,  B32B2307/306 ,  B32B2405/00 ,  C09J2301/124 ,  C09J2301/304 ,  C09J2423/006 ,  C09J2451/00 ,  C09J2463/00 ,  Y10T428/2813 ,  Y10T428/2848 ,  C09J2451/00 ,  C09J2463/00 ,  C09J151/06 ,  C08L51/003 ,  C08L23/06 ,  C08L23/12 ,  C08L53/025 ,  C08L23/20 ,  C08L23/22 ,  C08L23/12

摘要： A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.

公开(公告)号：US20240050313A1

公开(公告)日：2024-02-15

申请号：US18494229

申请日：2023-10-25

申请人： Fujimori Kogyo Co., Ltd.

发明人： Atsushi Mio ,  Toyoaki Suzuki ,  Junpei Nomura ,  Kaho Toyabe ,  Hajime Okamoto

IPC分类号： A61J1/10 ,  A61J1/14 ,  B32B1/00 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32

CPC分类号： A61J1/10 ,  A61J1/1468 ,  B32B1/00 ,  B32B7/12 ,  B32B27/08 ,  B32B27/322 ,  B32B27/325 ,  B32B2250/242 ,  B32B2307/7246 ,  B32B2439/46 ,  B32B2439/80 ,  A61J1/1475 ,  Y10T428/1352 ,  Y10T428/1334 ,  Y10T428/1341 ,  Y10T428/1379

摘要： A package has a bag body, at least one mouth part member bonded to the bag body, and a contained product being a liquid housed in the bag body. The bag body is formed in a bag shape by using laminates each having a sealant layer and a water vapor barrier layer composed at least of a fluorine-based resin, and by bonding together the sealant layers opposing each other so that the sealant layers are to be located on the inside of the bag body. The mouth part member is sandwiched between the oppositely facing sealant layers and is bonded thereto. The volume V of the contained product housed in the bag body is 0.1-20 cm3, and the relation between the area S (cm2) where the bag body is in contact with the contained product housed in the bag body and the aforementioned volume V (cm3) satisfies 0.05≤V/S≤0.25 (formula (I)).

公开(公告)号：US20240024875A1

公开(公告)日：2024-01-25

申请号：US18254817

申请日：2021-11-26

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Masato ABE ,  Takao SATO ,  Tomoko WADA ,  Tomoka NAGASATO ,  Kazuya HOSOKAWA

IPC分类号： B01L3/00

CPC分类号： B01L3/502761 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2200/16 ,  B01L2300/0816 ,  B01L2300/069 ,  B01L2300/0663

摘要： A method for manufacturing a microchip for a blood coagulation test includes preparing a substrate which has, in the surface thereof, a groove serving as a flow channel, and has a first through-hole serving as an inlet and provided on one end side of the groove. A film having a surface coated with collagen and/or tissue thromboplastin is prepared so as to cover a region of a portion on the flow channel when the film is bonded to the surface, of the substrate, having the groove therein overlaps the surface, of the film, coated with the collagen and/or tissue thromboplastin.

公开(公告)号：US11845591B2

公开(公告)日：2023-12-19

申请号：US17289911

申请日：2019-10-24

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Matsutaro Ono

IPC分类号： B65D47/08 ,  B65D75/00 ,  B65D75/58

CPC分类号： B65D47/0885 ,  B65D75/008 ,  B65D75/5883 ,  B65D2575/586

摘要： To provide a pouring spout in which an open state of the closing member is maintained while contents are being transferred. The above-described problem is solved by a pouring spout (10) including a spout main body (10A) and a closing unit (20). The spout main body (10A) includes at least a bonded part (15), a tubular part (11), and a channel (18). The closing unit (20) includes a closing member (21), an attaching part (24), and a coupling member (23). The spout main body (10A) is formed with an attached part (40). The coupling member (23) couples a first surface of the closing member (21) on the attaching part (24) side and facing the pouch main body part side, and the attaching member (24). The closing member (21) includes a fixed region corresponding to an area of a second surface opposite to the first surface on the attaching part (24) side thereof in which the coupling member (23) is coupled, the fixed region being supported by a nozzle (58) of a packaging container, thereby holding an angle θ formed by the closing member (21) with an end surface of the bonded part (15) on the pouch main body part side at less than 90 degrees.

公开(公告)号：US11826991B2

公开(公告)日：2023-11-28

申请号：US17476409

申请日：2021-09-15

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Kunihiro Takei ,  Yuiko Maruyama ,  Hirokazu Iizuka

IPC分类号： B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  C09D123/26 ,  C09D5/00 ,  C09J123/26 ,  C09J201/00 ,  B32B27/00 ,  C09J151/06 ,  B32B37/00 ,  C09J7/29 ,  C09J7/35 ,  B32B27/20 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B37/12 ,  B32B37/18 ,  B05D5/10

CPC分类号： B32B27/08 ,  B32B27/00 ,  B32B27/20 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B37/00 ,  B32B37/12 ,  B32B37/185 ,  C09D5/00 ,  C09D123/26 ,  C09J7/29 ,  C09J7/35 ,  C09J123/26 ,  C09J151/06 ,  C09J201/00 ,  B05D5/10 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2323/10 ,  B32B2325/00 ,  B32B2363/00 ,  B32B2367/00 ,  B32B2377/00 ,  B32B2405/00 ,  C09J2301/124 ,  C09J2301/304 ,  C09J2301/414 ,  C09J2423/00 ,  C09J2423/006 ,  C09J2423/106 ,  C09J2451/00 ,  C09J2463/00 ,  C09J2467/006 ,  C09J2479/08 ,  Y10T428/287 ,  Y10T428/2813 ,  Y10T428/2848 ,  C09J2451/00 ,  C09J2463/00 ,  C09J151/06 ,  C08L51/003

摘要： The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

公开(公告)号：US20230364892A1

公开(公告)日：2023-11-16

申请号：US18029573

申请日：2021-10-25

申请人： Fujimori Kogyo Co., Ltd.

发明人： Toshihiko Mori ,  Naoto Fujikawa ,  Hiroshi Kuwabara

IPC分类号： B32B27/08 ,  B32B27/32 ,  B32B7/12 ,  B65D65/40 ,  B65D75/00 ,  B65D75/58

CPC分类号： B32B27/08 ,  B32B27/32 ,  B32B7/12 ,  B65D65/40 ,  B65D75/008 ,  B65D75/5883 ,  B32B2255/10 ,  B32B2255/28 ,  B32B2439/46 ,  B32B2307/4023 ,  B32B2250/242 ,  B32B2250/02

摘要： This laminate has an inner layer formed of a polyethylene-based resin, an outer layer formed of a polyethylene-based resin, and a barrier layer laminated between the inner layer and the outer layer. The inner layer is formed as a sealant layer that is an innermost layer of the laminate, and the barrier layer is laminated in contact with an outer surface of the inner layer. Accordingly, it is possible to provide a laminate and a package which are formed of a mono-material and have a barrier property.

公开(公告)号：US20230311115A1

公开(公告)日：2023-10-05

申请号：US18043311

申请日：2021-08-31

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Masato ABE ,  Tomoko WADA ,  Takao SATO ,  Kazuya HOSOKAWA

IPC分类号： B01L3/00

CPC分类号： B01L3/502707

摘要： A method for manufacturing a microchip for analyzing a component in a liquid sample by passing the sample through a flow path provided inside and performing a reaction in a reaction portion provided in a portion of the flow path, the method including: a step of providing a substrate including on the surface thereof a groove serving as a flow path and a reaction portion in a portion between the both ends of the groove; a step of applying an adhesive agent or a gluing agent on an area other than the groove on the grooved surface of the substrate; a step of providing a film on an area of which a reaction substance is applied; and a step of attaching the film on the substrate in a specific manner.

公开(公告)号：US20230294388A1

公开(公告)日：2023-09-21

申请号：US18014713

申请日：2021-07-08

申请人： Fujimori Kogyo Co., Ltd.

发明人： Chisato Nagami ,  Junko Fuchu ,  Atsushi Manabe ,  Takahisa Nagai

IPC分类号： B32B27/32 ,  B32B27/08 ,  B32B38/18 ,  B32B37/15

CPC分类号： B32B27/32 ,  B32B27/08 ,  B32B38/1808 ,  B32B37/153 ,  B32B2255/10 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2255/26 ,  B32B2307/7242 ,  B32B2307/7265 ,  B32B2037/243

摘要： There is provided a resin laminate including: at least a first layer; a second layer; and an intermediate layer laminated in contact with the first layer and the second layer, in which a surface of the first layer in contact with the intermediate layer is an oxidized surface, a surface of the intermediate layer in contact with the first layer is an oxidized surface, the first layer is a layer in which a thermoplastic resin is used as a forming material or a layer in which cellophane is used as a forming material, and the intermediate layer is made of polyethylene having a density of 0.915 g/cm3 or less.

公开(公告)号：US11710881B2

公开(公告)日：2023-07-25

申请号：US17198393

申请日：2021-03-11

申请人： FUJIMORI KOGYO CO., LTD.

发明人： Kunihiro Takei ,  Hirokazu Iizuka ,  Shunsuke Takeyama

IPC分类号： H01M50/571 ,  H01M50/562 ,  H01M50/553 ,  H01M50/197 ,  H01M50/198 ,  H01M50/186 ,  H01M50/193 ,  H01M50/178

CPC分类号： H01M50/571 ,  H01M50/178 ,  H01M50/186 ,  H01M50/193 ,  H01M50/197 ,  H01M50/198 ,  H01M50/553 ,  H01M50/562

摘要： Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.