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公开(公告)号：US20240218112A1
公开(公告)日：2024-07-04
申请号：US18286285
申请日：2022-04-21
申请人： DIC Corporation
发明人： Shinji Onda , Kunihiro Morinaga
摘要： Provided is a phenolic resin being a reaction product of a catechol compound and an ortho-xylylene skeleton-containing compound, and having a catechol skeleton derived from the catechol compound and an ortho-xylylene skeleton derived from the ortho-xylylene skeleton-containing compound. A cured product obtained by using an epoxy resin obtained by using this phenolic resin can exhibit high heat resistance and high bending properties (bending strength, bending elastic modulus, and the like) and is thus suitably used for fiber-reinforced composite materials and fiber-reinforced resin molded products.
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公开(公告)号：US11767424B2
公开(公告)日：2023-09-26
申请号：US17767241
申请日：2020-10-01
申请人： DIC Corporation
发明人： Shinji Onda , Kunihiro Morinaga
IPC分类号： C08G59/32 , C08L63/00 , C08J5/24 , B32B15/092 , B32B27/38 , H01L23/29 , C08L61/12 , C08G59/06 , C08G59/62
CPC分类号： C08L61/12 , C08G59/06 , C08J5/24 , C08J2361/12 , C08L2203/20
摘要： The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.
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公开(公告)号：US20220403154A1
公开(公告)日：2022-12-22
申请号：US17767241
申请日：2020-10-01
申请人： DIC Corporation
发明人： Shinji Onda , Kunihiro Morinaga
摘要： The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.
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