• 专利标题: POLYFUNCTIONAL PHENOLIC RESIN, POLYFUNCTIONAL EPOXY RESIN, CURABLE RESIN COMPOSITION CONTAINING THESE, AND CURED PRODUCT THEREOF
  • 申请号: US17767241
    申请日: 2020-10-01
  • 公开(公告)号: US20220403154A1
    公开(公告)日: 2022-12-22
  • 发明人: Shinji OndaKunihiro Morinaga
  • 申请人: DIC Corporation
  • 申请人地址: JP Tokyo
  • 专利权人: DIC Corporation
  • 当前专利权人: DIC Corporation
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2019-194330 20191025
  • 国际申请: PCT/JP2020/037395 WO 20201001
  • 主分类号: C08L61/12
  • IPC分类号: C08L61/12 C08G59/06 C08J5/24
POLYFUNCTIONAL PHENOLIC RESIN, POLYFUNCTIONAL EPOXY RESIN, CURABLE RESIN COMPOSITION CONTAINING THESE, AND CURED PRODUCT THEREOF
摘要:
The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.
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