公开(公告)号：US20250040854A1

公开(公告)日：2025-02-06

申请号：US18716164

申请日：2022-11-21

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Katsuma Kitazoe ,  Eiji Ishikawa

IPC: A61B5/291 ,  A61B5/256

Abstract: A brain wave measuring device (1) includes a frame (20) that is mounted on a head (99) of a subject, an electrode part (10) that comes into contact with the head (99), and an elastic electrode fixing member (70) that is attached to the frame (20) and to which the electrode part (10) is attached, in which the electrode fixing member (70) expands along a shape of the head (99) in a case where the frame (20) is mounted on the head (99) and the electrode part (10) is pushed against the head (99).

公开(公告)号：US20240390891A1

公开(公告)日：2024-11-28

申请号：US18685935

申请日：2022-08-29

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Kosuke Yakumaru

IPC: B01L3/00 ,  B29C45/00 ,  B29L31/00

Abstract: A microchannel chip (1) includes a resin substrate (2) manufactured using a mold formed by direct engraving, and including a channel groove (21) on one surface of the resin substrate (2); and a covering material (3) joined to the resin substrate (2) to cover the channel groove (21). In the resin substrate (2), the roundness of a corner (2c) formed at a boundary between a joint surface (2a) to the covering material (3) and an inner surface (2b) defining the channel groove (21) is R5 μm or less.

公开(公告)号：US12116479B2

公开(公告)日：2024-10-15

申请号：US18562020

申请日：2022-05-20

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Jun Yamamoto

IPC: C08L63/04 ,  C08G59/32 ,  C08G59/62 ,  C08K3/36 ,  C08L51/04 ,  H01L23/29

CPC classification number: C08L63/04 ,  C08G59/32 ,  C08G59/621 ,  C08K3/36 ,  C08L51/04 ,  H01L23/295 ,  C08G2190/00 ,  C08K2201/014 ,  C08L2203/206 ,  C08L2205/22 ,  C08L2207/53

Abstract: A sealing resin composition including an epoxy resin, a curing agent, an inorganic filler, and rubber particles, in which a toughness index of a cured product of the sealing resin composition at 25° C. is equal to or more than 80 and equal to or less than 100.

公开(公告)号：US20240225510A1

公开(公告)日：2024-07-11

申请号：US18562859

申请日：2022-05-18

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yoshiatsu Ono

IPC: A61B5/256 ,  A61N1/04

CPC classification number: A61B5/256 ,  A61N1/0408

Abstract: A brain wave measuring device (10) includes a band member (11) that is worn on a human head (99) by conforming to the shape of the human head, a plurality of electrode portions (13) that is provided on one surface of the band member (11), and conformance assisting portions (30) that assist the band member (11) in conforming to the shape of the head (99), in which each of the conformance assisting portions (30) has an ear attachment portion (40) that is attached to a human ear (80), an attachment portion (50) that is attached to the band member (11), and a connection member (60) that spans between the ear attachment portion (40) and the attachment portion (50).

公开(公告)号：US20240165861A1

公开(公告)日：2024-05-23

申请号：US18277517

申请日：2022-01-19

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Shunsuke MOCHIZUKI

IPC: B29C45/00 ,  B29C45/14

CPC classification number: B29C45/0001 ,  B29C45/14819 ,  B29K2063/00

Abstract: An encapsulating resin composition for injection molding of the present invention includes a thermosetting resin, a curing agent, an inorganic filler, and an imidazole catalyst, in which in a DSC curve obtained in a case where a temperature is raised from 30° C. to 330° C. by using a differential scanning calorimeter under a condition of a temperature rise rate of 10° C./min, a peak temperature of a maximum exothermic peak is equal to or higher than 155° C. and lower than 175° C., and width in a half value of the maximum exothermic peak, which is obtained by adopting a straight baseline that connects a point of a minimum heat flow before the maximum exothermic peak and a point of a minimum heat flow after the maximum exothermic peak, is equal to or lower than 32° C.

公开(公告)号：US11877764B2

公开(公告)日：2024-01-23

申请号：US16614970

申请日：2018-05-16

Applicant: SUMITOMO BAKELITE CO., LTD. ,  NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERSITY

Inventor： Hirokuni Arai ,  Toshifumi Sakate ,  Akira Kawamata ,  Shinetsu Harata

IPC: A61B17/30 ,  A61M39/10 ,  A61B17/00

CPC classification number: A61B17/30 ,  A61M39/10 ,  A61B2017/00477 ,  A61B2017/308 ,  A61B2217/005 ,  A61M2039/1038 ,  A61M2210/125

Abstract: The present invention provides a coronary artery bypass surgery treatment tool or the like including a flexible tube, a suction cup in which an opening portion is formed to communicate with the flexible tube and which is provided at a distal end of the flexible tube, a joint portion which has a suction path, a male connector which is provided in one of a proximal end of the flexible tube and a distal end of the suction path of the joint portion, and a female connector which is provided in the other thereof and is detachably connected to the male connector.

公开(公告)号：US11795427B2

公开(公告)日：2023-10-24

申请号：US16982802

申请日：2019-03-22

Applicant: Sumitomo Bakelite Co., Ltd. ,  Hitachi, Ltd.

Inventor： Ryohei Tsukada ,  Toru Yakabe ,  Haruo Okubo ,  Masaharu Kiyama ,  Midori Kato ,  Hikaru Saito

IPC: C12M1/00 ,  C12M1/12

CPC classification number: C12M29/06 ,  C12M23/06 ,  C12M23/38 ,  C12M29/20

Abstract: A culture vessel that can suppress foaming in a culture medium when a common nozzle is used to supply a liquid culture medium and a gas together. This culture vessel includes: a vessel body having an opening portion that communicates with a housing space; a lid that closes the opening portion; and a nozzle that passes through the and extends to the housing space, and supplies a liquid culture medium and a gas together. The nozzle has a vent opening portion that is formed so as to open in a side of the nozzle and serves as a movement path of the gas from inside of the nozzle into the housing space.

公开(公告)号：US20230331895A1

公开(公告)日：2023-10-19

申请号：US18024562

申请日：2021-08-25

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yuji Suzuki

IPC: C08G8/10

CPC classification number: C08G8/10

Abstract: Provided is a water soluble resol-type phenol resin, in which an unreacted phenol content is 0.1% by mass or less and an unreacted aldehyde content is 0.1% by mass or less.

公开(公告)号：US11765872B2

公开(公告)日：2023-09-19

申请号：US17786056

申请日：2020-11-19

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yuki Ochiai ,  Shunsuke Mochizuki ,  Shu Okasaka

IPC: H05K9/00

CPC classification number: H05K9/0045

Abstract: A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.

公开(公告)号：US20230256724A1

公开(公告)日：2023-08-17

申请号：US18025705

申请日：2021-07-09

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Masao Uesaka

IPC: B32B37/12 ,  B32B5/02 ,  B32B27/36 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B5/26 ,  B32B27/12 ,  B32B7/12 ,  B32B3/12

CPC classification number: B32B37/1207 ,  B32B3/12 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/302 ,  B32B2037/1223 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/0269 ,  B32B2305/024 ,  B32B2305/188 ,  B32B2307/54 ,  B32B2307/748 ,  B32B2307/7376 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2323/10 ,  B32B2355/00 ,  B32B2367/00 ,  B32B2377/00 ,  B32B2605/18 ,  B32B2607/00

Abstract: A method of manufacturing a sandwich panel (100) includes: a step of preparing a plurality of sheet-like prepregs (211); a step of performing a first heating and pressurization process through a release film (25) on upper and lower surfaces of a laminate where the plurality of prepregs (211) are laminated such that the laminate is integrated to obtain a composite facing material (40); and a step of disposing the composite facing material (40) on each of an upper surface side and a lower surface side of a sheet-like core layer (10) having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.