摘要:
A method of forming a cured epoxy material includes pre-reacting a phenylene ether oligomer with an anhydride hardener before adding an epoxy resin and a curing promoter, then curing the resulting composition. The method provides an improved balance of heat resistance and toughness relative to corresponding methods in which the phenylene ether oligomer is pre-reacted with the epoxy resin prior to addition of hardener, and in which all components are mixed simultaneously. The cured epoxy material can be used in the composite core of an aluminum conductor composite core reinforced cable.
摘要:
To provide an epoxy resin composition that is suitable for producing optical sheets which exhibit excellent transparency, heat resistance, strength, smoothness and light resistance, and a cured product thereof.An epoxy resin composition for optical sheets, the composition comprising a polyvalent carboxylic acid (A) represented by formula (I): (wherein, R1's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; q represents the number of substituent R1's, and represents an integer from 1 to 4; and P represents any one of the following x, y and z): (wherein, there may be a plural number of R2's per ring, and R2's each independently represent a hydrogen atom or a methyl group; and * represents a bonding site linked to the oxygen atom; y. A linear alkylene linker having 6 to 20 carbon atoms, with a main chain having 3 or more carbon atoms and being substituted with an alkyl group in at least one site); (wherein, R's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; and * represents a bonding site linked to the oxygen atom, and an epoxy resin (B) having an aliphatic cyclic structure in the molecule).
摘要:
Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.
摘要:
To provide an epoxy resin composition that is suitable for producing optical sheets which exhibit excellent transparency, heat resistance, strength, smoothness and light resistance, and a cured product thereof.An epoxy resin composition for optical3 sheets, the composition comprising a polyvalent carboxylic acid (A) represented by formula (I): (wherein, R1's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; q represents the number of substituent R1's, and represents an integer from 1 to 4; and P represents any one of the following x, y and z): (wherein, there may be a plural number of R2's per ring, and R2's each independently represent a hydrogen atom or a methyl group; and * represents a bonding site linked to the oxygen atom; y. A linear alkylene linker having 6 to 20 carbon atoms, with a main chain having 3 or more carbon atoms and being substituted with an alkyl group in at least one site); (wherein, R's each independently represent a hydrogen atom, an alkyl group having 1 to 15 carbon atoms, or a carboxyl group; and * represents a bonding site linked to the oxygen atom, and an epoxy resin (B) having an aliphatic cyclic structure in the molecule).
摘要:
The invention relates to heat-curing powder-lacquer compositions exhibiting a matte surface after curing of the coating, as well as to a simple method for production of the same.
摘要:
The invention relates to heat-curable powder coating compositions, which after the coating has cured result in a matt surface and to a simple method for producing same
摘要:
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and semiconductor die.The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要:
A dispersion of polymer microparticles in organic liquid, the polymer comprising the reaction product of i) from 2 to 40 parts by weight of a first polymer being polypropylene polymer having sufficient carboxylic acid and/or carboxylic acid anhydride groups equivalent to an acid value of from 2 to 50 mg KOH/g nv polymer and ii) from 60 to 98 parts by weight of a second polymer having a molar excess of functional groups capable of reacting with the carboxylic acid and/or carboxylic acid anhydride groups of the polypropylene polymer and wherein the organic liquid is chosen to be a good solvent for the second polymer and a poor solvent for the polypropylene polymer.
摘要翻译:聚合物微粒在有机液体中的分散体,所述聚合物包含i)2至40重量份的第一聚合物的反应产物,所述第一聚合物是具有相当于酸值为的酸值的足够羧酸和/或羧酸酐基团的聚丙烯聚合物 2至50mg KOH / g nv聚合物,和ii)60至98重量份具有摩尔过量的能够与聚丙烯聚合物的羧酸和/或羧酸酐基团反应的官能团的第二聚合物,其中 选择有机液体作为第二聚合物的良溶剂和用于聚丙烯聚合物的不良溶剂。
摘要:
The invention relates to heat-curing powder-lacquer compositions exhibiting a matte surface after curing of the coating, as well as to a simple method for production of the same.
摘要:
A powder coating composition based on including at least one specific kind of the polyuretdione resin having a carboxyl value in the range of 20 to 300 mg KOH/g which exhibits higher crosslinking density in thin films, high flexibility, and excellent weather resistance.