发明申请
US20170017152A1 PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
审中-公开
感光树脂组合物，耐焊锡组合物和覆盖印刷线路板
- 专利标题： PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
- 专利标题（中）： 感光树脂组合物，耐焊锡组合物和覆盖印刷线路板
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申请号： US15124469申请日： 2015-08-17
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公开(公告)号： US20170017152A1公开(公告)日： 2017-01-19
- 发明人: Yoshio SAKAI
- 申请人： GOO CHEMICAL CO., LTD.
- 优先权： JPPCT/JP2014/06157 20141210
- 国际申请： PCT/JP2015/004080 WO 20150817
- 主分类号： G03F7/031
- IPC分类号： G03F7/031 ; G03F7/038 ; H05K1/03 ; G03F7/26 ; H05K1/02 ; G03F7/004 ; G03F7/20
摘要：
This photosensitive resin composition includes: (A) a photopolymerizable compound including at least one of a photopolymerizable monomer and a photopolymerizable oligomer; (B) titanium dioxide; and (C) a photopolymerization initiator. The component (C) includes (C1) an acylphosphine oxide-containing photopolymerization initiator and (C2) a phenylglyoxylic acid-containing photopolymerization initiator.
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