公开(公告)号：US20240361518A1

公开(公告)日：2024-10-31

申请号：US18643258

申请日：2024-04-23

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Motoyuki FUKUHARA ,  Hisashi KANEDA ,  Kazunao YAMAMOTO

IPC: G02B6/036 ,  G02B6/12

CPC classification number: G02B6/036 ,  G02B6/12 ,  G02B2006/12061

Abstract: An optical waveguide device includes an optical waveguide substrate including a first cladding layer disposed on a support, a core layer disposed on the first cladding layer, and a second cladding layer selectively covering the core layer, and a silicon photonic chip including a silicon substrate and a silicon waveguide disposed on one side of the silicon substrate, wherein part or all of a thickness of one end of the silicon waveguide is embedded in the core layer exposed from the second cladding layer, wherein a thickness of the core layer in a place covered with the silicon substrate is less than that of the core layer in a place not covered with the silicon substrate, and wherein a width of the core layer at a point of contact with the silicon substrate is wider than that of the core layer in a place covered with the second cladding layer.

公开(公告)号：US12092858B2

公开(公告)日：2024-09-17

申请号：US18158198

申请日：2023-01-23

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Matthew J. Traverso ,  Mark C. Nowell

IPC: F21V8/00 ,  G02B6/12 ,  G02B6/38 ,  G02B6/42

CPC classification number: G02B6/0083 ,  G02B6/12 ,  G02B6/3863 ,  G02B6/4249

Abstract: Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.

公开(公告)号：US20240280755A1

公开(公告)日：2024-08-22

申请号：US18569866

申请日：2021-10-19

Applicant: University-Industry Cooperation Group Of Kyung Hee University

Inventor： Youngduck KIM ,  Min Hyun CHO

IPC: G02B6/293 ,  G02B6/12 ,  G02F1/03 ,  G02F1/035

CPC classification number: G02B6/2934 ,  G02B6/12 ,  G02F1/0316 ,  G02F1/035 ,  G02B2006/12035

Abstract: The present invention provides an optical device and a method for operating the same, the optical device including a substrate, an optical waveguide extending in a first direction on the substrate, and a ring resonator adjacent to the optical waveguide in a second direction intersecting the first direction on the substrate, wherein the ring resonator includes a first graphene layer and a second graphene layer on the substrate, a first insulating layer between the substrate and the first graphene layer, a second insulating layer between the first graphene layer and the second graphene layer, a first electrode and a second electrode connected to the first graphene layer, and a third electrode connected to the second graphene layer, wherein the first graphene layer, the second graphene layer, the first insulating layer, and the second insulating layer have a ring shape or a partially open ring shape.

公开(公告)号：US12055773B2

公开(公告)日：2024-08-06

申请号：US17414531

申请日：2019-12-03

Applicant: Nippon Telegraph and Telephone Corporation

Inventor： Toru Miura ,  Yoshiho Maeda ,  Hiroshi Fukuda

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/26

CPC classification number: G02B6/4231 ,  G02B6/12 ,  G02B6/26 ,  G02B6/4249 ,  G02B6/4292

Abstract: An alignment optical circuit includes: a plurality of grating couplers that are formed on a substrate and arranged on a line; a plurality of optical waveguides that are connected to the plurality of grating couplers, respectively. Further, the alignment optical circuit includes an optical sensor that is formed on the substrate and measures optical intensity at a first light-receiving spot and a second light-receiving spot on a line along an arrangement direction of the plurality of grating couplers.

公开(公告)号：US12023507B2

公开(公告)日：2024-07-02

申请号：US16591874

申请日：2019-10-03

Applicant: Lawrence Livermore National Security, LLC

Inventor： Susant Patra ,  Razi-Ul Muhammad Haque ,  Komal Kampasi

IPC: A61N5/06 ,  A61N1/36 ,  A61N1/372 ,  F21V8/00 ,  G02B6/12 ,  G02B6/28 ,  G02B6/42 ,  G02B6/43 ,  H01S5/183 ,  A61B18/00 ,  A61N5/067 ,  G02F1/00

CPC classification number: A61N1/37247 ,  A61N1/36125 ,  A61N1/37205 ,  A61N5/0601 ,  A61N5/0622 ,  G02B6/0008 ,  G02B6/12 ,  G02B6/4293 ,  G02B6/43 ,  H01S5/183 ,  A61B2018/00636 ,  A61B2562/028 ,  A61B2562/04 ,  A61B2562/228 ,  A61N5/067 ,  G02F1/0018

Abstract: An opto-electronic probe system is disclosed. The probe system has a probe element including at least one microelectrode, with the probe element being implantable in tissue of an anatomy to receive electrical signals generated within the anatomy. A subsystem is included for at least one of generating excitation signals to be used in stimulating the anatomy, or for receiving electrical signals received from the anatomy. An interface portion is included which is in communication with the subsystem for communicating at least one of electrical signals or optical signals indicative of the electrical signals received by the microelectrode.

公开(公告)号：US20240201458A1

公开(公告)日：2024-06-20

申请号：US18589180

申请日：2024-02-27

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Chen-Hao Huang ,  Sui-Ying Hsu ,  YuehYing Lee ,  Chia-Ping Lai ,  Chien-Ying Wu ,  Hau-Yan Lu

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/136 ,  G02B6/30 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/311 ,  H01L23/522 ,  H01L23/532 ,  H01L23/58

CPC classification number: G02B6/4248 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/136 ,  G02B6/4206 ,  G02B6/4274 ,  H01L23/53228 ,  G02B6/30 ,  G02B6/4228 ,  G02B6/4236 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/31116 ,  H01L23/5226 ,  H01L23/585

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

公开(公告)号：US20240176066A1

公开(公告)日：2024-05-30

申请号：US18434443

申请日：2024-02-06

Applicant: Lightmatter, Inc.

Inventor： Sukeshwar Kannan ,  Carl Ramey ,  Jon Elmhurst ,  Darius Bunandar ,  Nicholas C. Harris

IPC: G02B6/12 ,  G02B6/42 ,  H01L23/13 ,  H01L23/50 ,  H01L23/538 ,  H01L25/16 ,  H05K1/18

CPC classification number: G02B6/12 ,  H01L23/50 ,  H05K1/183 ,  G02B6/4274 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/167 ,  H01L2924/15153

Abstract: Described herein are photonic communication platforms and related packages. In one example, a photonic package includes a substrate carrier having a recess formed through the top surface of the substrate carrier. The substrate carrier may be made of a ceramic laminate. A photonic substrate including a plurality of photonic modules is disposed in the recess. The photonic modules may be patterned using a common photomask, and as a result, may share a same layer pattern. A plurality of electronic dies may be positioned on top of respective photonic modules. The photonic modules enable communication among the dies in the optical domain. Power delivery substrates may be used to convey electric power from the substrate carrier to the electronic dies and to the photonic substrate. Power delivery substrates may be implemented, for example, using bridge dies or interposers (e.g., silicon or organic interposers).

公开(公告)号：US11994757B2

公开(公告)日：2024-05-28

申请号：US17432276

申请日：2020-04-24

Applicant: ADVANCED MICRO FOUNDRY PTE. LTD

Inventor： Patrick Guo Qiang Lo ,  Shawn Yohanes Siew ,  Larry Lian Xi Jia

IPC: G02F1/035 ,  G02B6/12 ,  G02F1/025 ,  G02F1/225 ,  G02F1/355

CPC classification number: G02F1/035 ,  G02B6/12 ,  G02F1/025 ,  G02F1/225 ,  G02B2006/1204 ,  G02B2006/12047 ,  G02B2006/12097 ,  G02B2006/12142 ,  G02B2006/12176 ,  G02F1/3553 ,  G02F2201/063

Abstract: A hybrid photonic chip comprising a plurality of semiconductor materials arranged to define a chip providing a function, wherein at least a first part of the chip is formed of materials which can be fabricated using a CMOS technique; and at least a second part of the chip which comprises non-linear crystal material and is not subjected to etching process; wherein the second part of the chip in conjunction with the first part is configured to support a propagating low loss single mode.

公开(公告)号：US11892745B2

公开(公告)日：2024-02-06

申请号：US17294320

申请日：2019-11-13

Applicant: Nippon Telegraph and Telephone Corporation

Inventor： Takushi Kazama ,  Takahiro Kashiwazaki ,  Osamu Tadanaga ,  Koji Embutsu ,  Ryoichi Kasahara ,  Takeshi Umeki

IPC: G02F1/377 ,  G02F1/355 ,  G02B6/12 ,  G02B6/13 ,  G02B6/124 ,  G02B6/136 ,  G02F1/39

CPC classification number: G02F1/3775 ,  G02B6/12 ,  G02B6/13 ,  G02F1/3551 ,  G02F1/377 ,  G02B6/124 ,  G02B6/136 ,  G02F1/39 ,  G02F2202/20

Abstract: With a wavelength conversion device based on a nonlinear optical effect, when arrayed waveguides including an intended nonlinear waveguide are fabricated, unwanted slab waveguides are inevitably formed. The slab waveguides can cause an erroneous measurement in the selection of a waveguide having desired characteristics from the arrayed waveguides. The erroneous measurement can lead to redoing steps for fabricating the wavelength conversion device and a decrease in the yield and inhibit the evaluation of the characteristics in selection of the waveguide and the subsequent fabrication of the wavelength conversion device from being efficiently performed. A wavelength conversion device according to the present invention includes a plurality of waveguides formed on a substrate, and a plurality of slab waveguides that are arranged substantially in parallel with and spaced apart from the plurality of waveguides, and each of the slab waveguides has a grating structure that reflects light of a particular wavelength.

公开(公告)号：US11881678B1

公开(公告)日：2024-01-23

申请号：US17015766

申请日：2020-09-09

Applicant: Apple Inc.

Inventor： Michael J. Bishop ,  Kwan-Yu Lai ,  Alex Goldis ,  Alfredo Bismuto ,  Jeffrey Thomas Hill

IPC: H01S5/00 ,  H01S5/40 ,  G02B3/06 ,  G02B26/08 ,  G02B26/10 ,  G02B6/12

CPC classification number: H01S5/0071 ,  G02B3/06 ,  G02B6/12 ,  G02B26/0833 ,  G02B26/105 ,  H01S5/4043 ,  H01S5/4087

Abstract: Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.