公开(公告)号：US20240255696A1

公开(公告)日：2024-08-01

申请号：US18633331

申请日：2024-04-11

申请人： Raytheon Company

发明人： Ping Piu KUO

IPC分类号： G02B6/12 ,  G02B6/132

CPC分类号： G02B6/12004 ,  G02B6/132 ,  G02B2006/1204

摘要： A method of fabricating a photonics stack includes providing a silicon photonics structure having a silicon substrate, an oxide layer, and an epitaxial silicon layer with one or more active devices. The method also includes providing an interposer structure and attaching the silicon photonics structure and the interposer structure. The method further includes removing the silicon substrate from the silicon photonics structure and removing at least a portion of the oxide layer from the silicon photonics structure. In addition, the method includes disposing a thin film lithium niobate coupon on or within the silicon photonics structure and encapsulating the thin film lithium niobate coupon with an optical material.

公开(公告)号：US20240210620A1

公开(公告)日：2024-06-27

申请号：US18087792

申请日：2022-12-22

申请人： Nokia Solutions and Networks Oy

发明人： Jiabao Zheng ,  Alexandre Horth ,  Ruizhi Shi

IPC分类号： G02B6/122

CPC分类号： G02B6/1228 ,  G02B2006/1204

摘要： An optical device comprises a photonic integrated circuit having an optical mode coupler. The optical mode coupler optically couples a first planar optical waveguide having a first optical core at one horizontal plane to a second planar optical waveguide having a second optical core at a different second horizontal plane. The optical mode coupler comprises two or more intermediate optical layers stacked vertically between the horizontal planes of the optical cores, and intermediate optical layer comprises one or more optical rails. The optical mode coupler causes light received from the first planar optical waveguide to excite an optical mode and guide the light of the optical mode such that the optical mode substantially overlaps the first planar optical waveguide and the optical rails of at least two of the intermediate optical layers in a vertical cross-section of the photonic integrated circuit.

公开(公告)号：US12007602B2

公开(公告)日：2024-06-11

申请号：US17740027

申请日：2022-05-09

申请人： The Board of Trustees of the Leland Stanford Junior University

发明人： Amir H. Safavi-Naeini ,  Timothy Patrick McKenna ,  Hubert S. Stokowski

IPC分类号： G02B6/12 ,  G02B6/293

CPC分类号： G02B6/12004 ,  G02B6/12007 ,  G02B2006/1204 ,  G02B2006/12138 ,  G02B2006/12142 ,  G02B6/29344

摘要： In an integrated optical device, squeezed light is used internally to effectively increase an optical modulation effect. One exemplary device operates by squeezing the light at the input, then sending it through an electro-optic stage where its phase picks up the signal of interest, and finally anti-squeezing it to obtain a displaced coherent state. Thus the displacement is amplified by the level of squeezing that is achieved inside the device and it is thereby less sensitive to loss. Since this device behaves simply as an electro-optic modulator, albeit one with an exponentially enhanced sensitivity, no extra considerations are needed to integrate the modulator into a system. Such devices can be operated as modulators or as sensors, and can make use of optical phase shift effects other than the electro-optic effect.

公开(公告)号：US20240142809A1

公开(公告)日：2024-05-02

申请号：US17975090

申请日：2022-10-27

申请人： Newport Fab, LLC dba Tower Semiconductor Newport Beach

发明人： Edward Preisler ,  Oleg Martynov

IPC分类号： G02F1/035 ,  G02B6/136

CPC分类号： G02F1/035 ,  G02B6/136 ,  G02B2006/1204

摘要： A method of integrating an optoelectronic device comprising a Pockels material, such as lithium niobate (LiNbO3), includes forming an optoelectronic device layer over a semiconductor layer. The optoelectronic device layer includes a patterned optoelectronic device segment in an interlayer dielectric. A window is etched in the interlayer dielectric using the patterned optoelectronic device segment as a sacrificial etch stop. The patterned optoelectronic device segment is removed in the window. The optoelectronic device comprising the Pockels material is formed in place of the removed patterned optoelectronic device segment. The optoelectronic device comprising the Pockels material may be formed from an optoelectronic chiplet.

公开(公告)号：US11899293B2

公开(公告)日：2024-02-13

申请号：US16871658

申请日：2020-05-11

申请人： HyperLight Corporation

发明人： Mian Zhang ,  Kevin Luke

IPC分类号： G02F1/03 ,  G02F1/07 ,  G02B6/13 ,  G03F7/00 ,  G02F1/05 ,  G02B6/12

CPC分类号： G02F1/03 ,  G02B6/13 ,  G02F1/05 ,  G03F7/70008 ,  G02B2006/1204 ,  G02B2006/12045

摘要： An optical device is described. At least a portion of the optical device includes ferroelectric non-linear optical material(s) and is fabricated utilizing ultraviolet lithography. In some aspects the at least the portion of the optical device is fabricated using deep ultraviolet lithography. In some aspects, the short range root mean square surface roughness of a sidewall of the at least the portion of the optical device is less than ten nanometers. In some aspects, the at least the portion of the optical device has a loss of not more than 2 dB/cm.

公开(公告)号：US11852953B2

公开(公告)日：2023-12-26

申请号：US17779958

申请日：2019-12-03

申请人： Nippon Telegraph and Telephone Corporation

发明人： Takeshi Umeki ,  Takushi Kazama ,  Takahiro Kashiwazaki ,  Koji Embutsu ,  Osamu Tadanaga ,  Asuka Inoue ,  Ryoichi Kasahara

IPC分类号： G02F1/377 ,  G02F1/355 ,  G02B6/122 ,  G02B6/134 ,  G02B6/12

CPC分类号： G02F1/3775 ,  G02B6/1223 ,  G02B6/1342 ,  G02F1/3551 ,  G02B2006/1204 ,  G02B2006/12097

摘要： A highly-efficient ridge waveguide includes a base substrate of a single-crystal and a core substrate made of a nonlinear optical medium, the base substrate and the core substrate being directly bonded, and includes a thin film layer formed on a surface of the core substrate on the upper side of a periodically polarization-reversed structure, and becomes a wavelength conversion element. A direct bonding method through thermal diffusion is applied to bonding. The core substrate has a ridge structure formed in a light propagating direction and a reversed structure formed by processing this. A surface of the core substrate is ground and a thin film layer is formed on the ground surface. A core formed by digging a core layer of the core substrate in an unbonded state is provided on an upper surface of an undercladding layer of the base substrate in a bonded state. Two side surfaces of the core are in contact with an air layer.

公开(公告)号：US11675126B1

公开(公告)日：2023-06-13

申请号：US17221949

申请日：2021-04-05

申请人： National Technology & Engineering Solutions of Sandia, LLC

发明人： Ashok Kodigala ,  Anthony L. Lentine ,  Nicholas Boynton ,  Douglas Chandler Trotter ,  Thomas A. Friedmann ,  Phillip Harrison Weiner

IPC分类号： G02B6/12 ,  H01S5/026 ,  H01S5/02

CPC分类号： G02B6/12 ,  H01S5/021 ,  H01S5/026 ,  G02B2006/1204 ,  G02B2006/12121

摘要： A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide, and at least one III-V die is bonded to the exposed buried oxide. In embodiments, at least one waveguiding component is fabricated in the SiP functional layer. In embodiments, the SiP functional layer comprises a top waveguiding layer.

公开(公告)号：US20170131618A1

公开(公告)日：2017-05-11

申请号：US15318593

申请日：2015-06-29

申请人： DOLBY LABORATORIES LICENSING CORPORATION

发明人： Gregory David MILLER ,  Gennady IMESHEV

IPC分类号： G02F1/365 ,  G02F1/355 ,  G02F1/35 ,  H01S5/00 ,  H01S5/40

CPC分类号： G02F1/365 ,  G02B6/12004 ,  G02B6/13 ,  G02B2006/1204 ,  G02B2006/12045 ,  G02B2006/12054 ,  G02B2006/12097 ,  G02B2006/121 ,  G02F1/353 ,  G02F1/3551 ,  G02F1/377 ,  G02F2201/063 ,  G02F2202/20 ,  H01S5/0092 ,  H01S5/4012 ,  H01S5/4025

摘要： Novel methods and systems for waveguide fabrication and design are disclosed. Designs are described for fabricating ridge, buried and hybrid waveguides by a femtosecond pulsed laser. A laser system may combine a diode bar, a wavelength combiner and a waveguide. The waveguide may convert the electromagnetic radiation of an infrared laser into that the visible-wavelength range.

公开(公告)号：US09588359B2

公开(公告)日：2017-03-07

申请号：US14629992

申请日：2015-02-24

申请人： Fujitsu Optical Components Limited

发明人： Masaki Sugiyama

IPC分类号： G02F1/01 ,  G02F1/225 ,  G02B6/42 ,  G02F1/03 ,  G02F1/035 ,  G02F1/21

CPC分类号： G02F1/0121 ,  G02B6/125 ,  G02B6/132 ,  G02B6/2808 ,  G02B6/42 ,  G02B6/4246 ,  G02B2006/1204 ,  G02B2006/12142 ,  G02B2006/12159 ,  G02F1/0327 ,  G02F1/0356 ,  G02F1/2252 ,  G02F1/2255 ,  G02F2001/212

摘要： An optical module includes: a substrate; a first terminal; a plurality of second terminals; a plurality of third terminals; and a plurality of wirings. The plurality of second terminals are on the substrate. The plurality of third terminals are disposed closer to an electrode than the plurality of second terminals on the substrate. The plurality of wirings extend from the plurality of second terminals through a side opposite to the first terminal and reach the electrode.

摘要翻译： 光学模块包括：基板; 第一个终端; 多个第二端子; 多个第三端子; 和多个布线。 多个第二端子在基板上。 多个第三端子设置成比基板上的多个第二端子更靠近电极。 多个布线从多个第二端子延伸通过与第一端子相对的一侧并到达电极。

公开(公告)号：US20160070063A1

公开(公告)日：2016-03-10

申请号：US14735544

申请日：2015-06-10

申请人： HON HAI PRECISION INDUSTRY CO., LTD.

发明人： HSIN-SHUN HUANG

IPC分类号： G02B6/124 ,  G02B6/122 ,  G02B6/30 ,  G02B6/28 ,  G02B6/10 ,  G02B27/42 ,  G02B6/27 ,  G02B6/125 ,  G02B6/42

CPC分类号： G02B6/124 ,  G02B6/125 ,  G02B6/126 ,  G02B6/2726 ,  G02B6/276 ,  G02B6/30 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/428 ,  G02B27/4261 ,  G02B2006/1204 ,  G02B2006/12121 ,  G02B2006/12123 ,  G02B2006/1218

摘要： An optical communication device includes two photoelectric conversion devices, and an optical fiber connection between the photoelectric conversion devices. The photoelectric conversion devices include an optical coupling device, a light emitting device, and an optical receiver. The optical coupling device includes a substrate, a top surface, a bottom surface opposite to the top surface, a first waveguide a second waveguide and a grating, the first connecting portion and the second connecting portion are connected with each other at an overlap area and form a Y-shape, the grating is used to reflect transverse electric waves and passes transverse magnetic waves.

摘要翻译： 光通信装置包括两个光电转换装置和光电转换装置之间的光纤连接。 光电转换装置包括光耦合器件，发光器件和光接收器。 光耦合装置包括基板，顶表面，与顶表面相对的底表面，第一波导，第二波导和光栅，第一连接部分和第二连接部分在重叠区域处彼此连接， 形成Y形，光栅用于反射横向电波并通过横向磁波。