公开(公告)号：US10049902B2

公开(公告)日：2018-08-14

申请号：US15526363

申请日：2015-08-19

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Andreas Fehkuhrer

IPC: H01L21/683 ,  H01L21/762 ,  H01L21/67 ,  H01L21/687 ,  H01L21/673

Abstract: A substrate stack holder, a container comprising a plurality of substrate stack holders, and a method for parting a substrate stack. The substrate stack holder includes (a) a holding and separating device for (i) holding a substrate stack during a parting process in which the substrate stack is split into a first substrate stack part and a second substrate stack part, said substrate stack comprised of a first substrate, a second substrate, and a connecting region therebetween, and (ii) separating the first substrate stack part from the second substrate stack part after the parting process; and (b) a fixing device for receiving and fixing the separated first and second substrate stack parts.

公开(公告)号：US10475672B2

公开(公告)日：2019-11-12

申请号：US15546679

申请日：2015-11-03

Applicant: EV Group E. Thallner GmbH

Inventor： Andreas Fehkuhrer

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/683 ,  B26F3/00 ,  H01L21/677 ,  B05B1/20

Abstract: A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.

公开(公告)号：US20190148148A1

公开(公告)日：2019-05-16

申请号：US16074271

申请日：2016-02-16

Applicant: EV Group E. Thallner GmbH

Inventor： Thomas Wagenleitner ,  Andreas Fehkuhrer

IPC: H01L21/20 ,  H01L21/67 ,  B81C1/00

Abstract: A method and a device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.

公开(公告)号：US09786487B2

公开(公告)日：2017-10-10

申请号：US15118914

申请日：2015-01-09

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Andreas Fehkuhrer

IPC: H01L21/00 ,  H01L21/44 ,  H01L21/02 ,  H01L21/768 ,  B08B3/08 ,  B08B3/12 ,  B08B5/00 ,  B08B7/00

CPC classification number: H01L21/02057 ,  B08B3/08 ,  B08B3/12 ,  B08B5/00 ,  B08B7/0014 ,  B08B7/0035 ,  H01L21/76898

Abstract: A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.

公开(公告)号：US20240387202A1

公开(公告)日：2024-11-21

申请号：US18689465

申请日：2021-11-08

Applicant: EV Group E. Thallner GmbH

Inventor： Andreas Fehkuhrer

IPC: H01L21/67

Abstract: The present invention relates to a device for bonding a first substrate with a second substrate, comprising at least one deformation device for deforming at least one of the two substrates by means of a fluid, wherein the at least one deformation device is mobile. Moreover, the invention relates to a corresponding method.

公开(公告)号：US11101132B2

公开(公告)日：2021-08-24

申请号：US16880139

申请日：2020-05-21

Applicant: EV Group E. Thallner GmbH

Inventor： Thomas Wagenleitner ,  Andreas Fehkuhrer

IPC: H01L21/20 ,  H01L21/67 ,  B81C1/00

Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.

公开(公告)号：US10755930B2

公开(公告)日：2020-08-25

申请号：US16809651

申请日：2020-03-05

Applicant: EV Group E. Thallner GmbH

Inventor： Thomas Wagenleitner ,  Andreas Fehkuhrer

IPC: H01L21/20 ,  H01L21/67 ,  B81C1/00

Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.

公开(公告)号：US10755929B2

公开(公告)日：2020-08-25

申请号：US16074271

申请日：2016-02-16

Applicant: EV Group E. Thallner GmbH

Inventor： Thomas Wagenleitner ,  Andreas Fehkuhrer

IPC: H01L21/20 ,  H01L21/67 ,  B81C1/00

Abstract: A method and a device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.

公开(公告)号：US09922862B2

公开(公告)日：2018-03-20

申请号：US15108027

申请日：2014-01-28

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Andreas Fehkuhrer

IPC: H01L21/687 ,  B32B43/00 ,  H01L21/67

CPC classification number: H01L21/68728 ,  H01L21/67092 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944 ,  Y10T156/1978

Abstract: A device for detaching a first substrate from a second substrate in a detaching direction (L) with: at least two elements guided crosswise to the detaching direction (L) and in a radial direction (R) to the first substrate for clamping the first substrate crosswise to the detaching direction (L), a substrate holding device for holding the second substrate, and detaching means for detaching the first substrate from the second substrate by moving the first substrate, attached by the clamping elements, in the detaching direction (L) and/or by moving the substrate holding device opposite to the detaching direction (L). In addition, this invention relates to a corresponding method.

公开(公告)号：US09859246B2

公开(公告)日：2018-01-02

申请号：US14917318

申请日：2014-12-18

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Andreas Fehkuhrer

IPC: H01L21/00 ,  H01L23/00 ,  B32B37/00 ,  H01L21/18 ,  H01L21/304 ,  H01L21/67 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  H01L23/544 ,  B32B38/18

CPC classification number: H01L24/80 ,  B32B37/0046 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/08 ,  H01L24/74 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/0224 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/80 ,  H01L2224/80003 ,  H01L2224/80006 ,  H01L2224/8001 ,  H01L2224/80011 ,  H01L2224/8002 ,  H01L2224/80047 ,  H01L2224/80051 ,  H01L2224/80093 ,  H01L2224/80099 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80209 ,  H01L2224/80213 ,  H01L2224/80801 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2221/68304

Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.