公开(公告)号：US20240170474A1

公开(公告)日：2024-05-23

申请号：US18425205

申请日：2024-01-29

Applicant: EV Group E. Thallner GmbH

Inventor： Markus Wimplinger

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H05K13/04

CPC classification number: H01L25/50 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L25/0652 ,  H05K13/0404 ,  H01L2224/80003 ,  H01L2224/80011 ,  H01L2224/80013 ,  H01L2224/80894

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

公开(公告)号：US20160155721A1

公开(公告)日：2016-06-02

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji SUGAKAWA ,  Yuji MIMURA ,  Shuhei MATSUMOTO ,  Takahiro MASUNAGA ,  Makoto TSUKISHIMA

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

Abstract translation: 提供了将基板彼此接合的方法，其包括：将第一基板保持在第一保持部的下表面上; 通过温度调节部分调节第二基板的温度以变得高于第一基板的温度; 将第二基板保持在第二保持部的上表面上; 通过用第一成像部分对第二基板的多个参考点进行成像来检查第二基板的状态，测量参考点的位置，并将测量结果与预定的允许范围进行比较; 并且用按压部件按压所述第一基板的中央部，使所述第一基板的中央部与所述第二基板的中央部接触，并顺序地接合所述第一基板和所述第二基板。

公开(公告)号：US09741595B2

公开(公告)日：2017-08-22

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Sugakawa ,  Yuji Mimura ,  Shuhei Matsumoto ,  Takahiro Masunaga ,  Makoto Tsukishima

IPC: H01L21/67 ,  H01L21/66 ,  H01L23/00 ,  H01L21/68 ,  H01L21/822

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

公开(公告)号：US20160358881A1

公开(公告)日：2016-12-08

申请号：US14917318

申请日：2014-12-18

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Andreas FEHKUHRER

IPC: H01L23/00 ,  B32B37/00 ,  H01L21/683 ,  B32B38/18 ,  H01L23/544 ,  H01L25/00

CPC classification number: H01L24/80 ,  B32B37/0046 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/08 ,  H01L24/74 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/0224 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/80 ,  H01L2224/80003 ,  H01L2224/80006 ,  H01L2224/8001 ,  H01L2224/80011 ,  H01L2224/8002 ,  H01L2224/80047 ,  H01L2224/80051 ,  H01L2224/80093 ,  H01L2224/80099 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80209 ,  H01L2224/80213 ,  H01L2224/80801 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2221/68304

Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

Abstract translation: 一种用于将第一衬底与第二衬底结合的方法，其特征在于，在所述接合之前所述第一衬底和/或所述第二衬底被薄化。

公开(公告)号：US20180096962A1

公开(公告)日：2018-04-05

申请号：US15820907

申请日：2017-11-22

Applicant: EV Group E. Thallner GmbH

Inventor： Andreas Fehkuhrer

IPC: H01L23/00 ,  H01L25/00 ,  B32B37/00 ,  H01L23/544 ,  H01L21/683 ,  H01L21/67 ,  H01L21/304 ,  H01L21/18 ,  B32B38/18 ,  H01L25/065 ,  H01L21/78

CPC classification number: H01L24/80 ,  B32B37/0046 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/08 ,  H01L24/74 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/0224 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/80 ,  H01L2224/80003 ,  H01L2224/80006 ,  H01L2224/8001 ,  H01L2224/80011 ,  H01L2224/8002 ,  H01L2224/80047 ,  H01L2224/80051 ,  H01L2224/80093 ,  H01L2224/80099 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80209 ,  H01L2224/80213 ,  H01L2224/80801 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2221/68304

Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

公开(公告)号：US09142532B2

公开(公告)日：2015-09-22

申请号：US14397038

申请日：2013-04-24

Applicant: Tadatomo Suga ,  BONDTECH CO., LTD.

Inventor： Tadatomo Suga ,  Akira Yamauchi

IPC: H01L21/00 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  B23K31/02 ,  B23K37/00 ,  B23K37/04 ,  H01L21/66 ,  H01L25/10 ,  H01L23/10 ,  H01L21/683

CPC classification number: H01L25/0652 ,  B23K31/02 ,  B23K37/00 ,  B23K37/0408 ,  B23K2101/40 ,  H01L21/6836 ,  H01L22/10 ,  H01L23/10 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/74 ,  H01L24/742 ,  H01L24/743 ,  H01L24/75 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0384 ,  H01L2224/03845 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06134 ,  H01L2224/0615 ,  H01L2224/06177 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/09181 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13009 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14134 ,  H01L2224/1415 ,  H01L2224/14177 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27009 ,  H01L2224/2755 ,  H01L2224/27823 ,  H01L2224/2784 ,  H01L2224/27845 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73103 ,  H01L2224/74 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75283 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/7598 ,  H01L2224/80003 ,  H01L2224/8001 ,  H01L2224/80013 ,  H01L2224/80065 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80143 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/8022 ,  H01L2224/8023 ,  H01L2224/80447 ,  H01L2224/8083 ,  H01L2224/80907 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81065 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/8123 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/83002 ,  H01L2224/8301 ,  H01L2224/83013 ,  H01L2224/83048 ,  H01L2224/83051 ,  H01L2224/83065 ,  H01L2224/83091 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83136 ,  H01L2224/83143 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/8322 ,  H01L2224/8323 ,  H01L2224/83234 ,  H01L2224/83355 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2224/83894 ,  H01L2224/83907 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2224/80 ,  H01L2224/83 ,  H01L2924/00

Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.[Solution] A method for bonding plural chips each having a chip-side-bond-surface having metal regions to a substrate having plural bond portions has the step (S1) of subjecting the metal regions of the chip-side-bond-surface to surface activating treatment and hydrophilizing treatment; the step (S2) of subjecting the bond portions of the substrate to surface activating treatment and hydrophilizing treatment; the step (S3) of fitting the chips subjected to the surface activating treatment and the hydrophilizing treatment onto the corresponding bond portions of the substrate subjected to the surface activating treatment and the hydrophilizing treatment to bring the metal regions of the chips into contact with the bond portions of the substrate; and the step (S4) of heating the resultant structure, which includes the substrate, and the chips fitted onto the substrate.

Abstract translation: [问题]提供了一种将芯片有效地接合到晶片上以建立电连接并提高芯片和晶片之间或芯片之间的机械强度的技术，该芯片是在树脂和其它不期望的残留物的状态下彼此层压的芯片 不保留在它们之间的结合界面上。 [解决方案]将具有金属区域的具有芯片侧接合面的多个芯片接合到具有多个结合部的基板的方法具有将芯片侧接合面的金属区域 表面活化处理和亲水处理; 对所述基板的所述接合部进行表面活化处理和亲水化处理的工序（S2） 将经过表面活化处理和亲水化处理的芯片装配到经过表面活化处理的基板的相应接合部分和亲水化处理上以使芯片的金属区域与键接触的步骤（S3） 基板的一部分; 以及加热包括基板的所得结构和安装在基板上的芯片的步骤（S4）。

公开(公告)号：US11990463B2

公开(公告)日：2024-05-21

申请号：US17144655

申请日：2021-01-08

Applicant: EV Group E. Thallner GmbH

Inventor： Markus Wimplinger

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H05K13/04

CPC classification number: H01L25/50 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L25/0652 ,  H05K13/0404 ,  H01L2224/80003 ,  H01L2224/80011 ,  H01L2224/80013 ,  H01L2224/80894

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.

公开(公告)号：US11764198B2

公开(公告)日：2023-09-19

申请号：US16483077

申请日：2017-03-02

Applicant: EV Group E. Thallner GmbH

Inventor： Markus Wimplinger

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H05K13/04

CPC classification number: H01L25/50 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L25/0652 ,  H05K13/0404 ,  H01L2224/80003 ,  H01L2224/80011 ,  H01L2224/80013 ,  H01L2224/80894

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

公开(公告)号：US09859246B2

公开(公告)日：2018-01-02

申请号：US14917318

申请日：2014-12-18

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Andreas Fehkuhrer

IPC: H01L21/00 ,  H01L23/00 ,  B32B37/00 ,  H01L21/18 ,  H01L21/304 ,  H01L21/67 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  H01L23/544 ,  B32B38/18

CPC classification number: H01L24/80 ,  B32B37/0046 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/08 ,  H01L24/74 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/0224 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/80 ,  H01L2224/80003 ,  H01L2224/80006 ,  H01L2224/8001 ,  H01L2224/80011 ,  H01L2224/8002 ,  H01L2224/80047 ,  H01L2224/80051 ,  H01L2224/80093 ,  H01L2224/80099 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80209 ,  H01L2224/80213 ,  H01L2224/80801 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2221/68304

Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

公开(公告)号：US20170062393A1

公开(公告)日：2017-03-02

申请号：US15193323

申请日：2016-06-27

Applicant: Samsung Display Co., Ltd.

Inventor： Mugyeom Kim

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/06

CPC classification number: H01L24/97 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/95 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2224/03002 ,  H01L2224/04 ,  H01L2224/80003 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/80401 ,  H01L2224/80417 ,  H01L2224/80423 ,  H01L2224/80424 ,  H01L2224/80438 ,  H01L2224/80439 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80455 ,  H01L2224/80464 ,  H01L2224/80466 ,  H01L2224/80469 ,  H01L2224/80471 ,  H01L2224/80478 ,  H01L2224/8048 ,  H01L2224/80484 ,  H01L2224/81001 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81401 ,  H01L2224/81417 ,  H01L2224/81423 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81469 ,  H01L2224/81471 ,  H01L2224/81478 ,  H01L2224/8148 ,  H01L2224/81484 ,  H01L2224/92 ,  H01L2224/9222 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/95085 ,  H01L2224/951 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0106 ,  H01L2924/01003 ,  H01L2924/0102 ,  H01L2224/80 ,  H01L2224/81 ,  H01L2221/68304 ,  H01L21/78 ,  H01L2221/68381

Abstract: A method of manufacturing a display device includes: immersing a mask including openings, in a solution; seating light-emitting diode chips respectively in the openings of the mask; arranging a first flexible substrate including first wirings thereon, below the mask, and aligning the first wirings to respectively correspond to the openings of the mask; removing from the solution, the first flexible substrate with the first wirings corresponding to the openings of the mask together with the mask with the light-emitting diode chips seated in the openings thereof; bonding the light-emitting diode chips and the first wirings to each other; providing a second flexible substrate including second wirings thereon, and aligning the second wirings to respectively correspond to the light-emitting diode chips; and bonding the light-emitting diode chips and the second wirings to each other, to form the display device.

Abstract translation: 制造显示装置的方法包括：将包括开口的掩模浸入溶液中; 将座位发光二极管芯片分别放置在掩模的开口中; 在所述掩模下面布置包括第一布线的第一柔性基板，并且将所述第一布线对准于所述掩模的开口; 从溶液中除去第一柔性基板，其中第一布线对应于掩模的开口与掩模一起，发光二极管芯片位于其开口中; 将发光二极管芯片和第一布线彼此接合; 提供第二柔性基板，其上包括第二布线，并且将所述第二布线对准分别对应于所述发光二极管芯片; 并且将发光二极管芯片和第二布线彼此接合，以形成显示装置。