公开(公告)号：US20170062393A1

公开(公告)日：2017-03-02

申请号：US15193323

申请日：2016-06-27

Applicant: Samsung Display Co., Ltd.

Inventor： Mugyeom Kim

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/06

CPC classification number: H01L24/97 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/95 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2224/03002 ,  H01L2224/04 ,  H01L2224/80003 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/80401 ,  H01L2224/80417 ,  H01L2224/80423 ,  H01L2224/80424 ,  H01L2224/80438 ,  H01L2224/80439 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80455 ,  H01L2224/80464 ,  H01L2224/80466 ,  H01L2224/80469 ,  H01L2224/80471 ,  H01L2224/80478 ,  H01L2224/8048 ,  H01L2224/80484 ,  H01L2224/81001 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81401 ,  H01L2224/81417 ,  H01L2224/81423 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81469 ,  H01L2224/81471 ,  H01L2224/81478 ,  H01L2224/8148 ,  H01L2224/81484 ,  H01L2224/92 ,  H01L2224/9222 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/95085 ,  H01L2224/951 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0106 ,  H01L2924/01003 ,  H01L2924/0102 ,  H01L2224/80 ,  H01L2224/81 ,  H01L2221/68304 ,  H01L21/78 ,  H01L2221/68381

Abstract: A method of manufacturing a display device includes: immersing a mask including openings, in a solution; seating light-emitting diode chips respectively in the openings of the mask; arranging a first flexible substrate including first wirings thereon, below the mask, and aligning the first wirings to respectively correspond to the openings of the mask; removing from the solution, the first flexible substrate with the first wirings corresponding to the openings of the mask together with the mask with the light-emitting diode chips seated in the openings thereof; bonding the light-emitting diode chips and the first wirings to each other; providing a second flexible substrate including second wirings thereon, and aligning the second wirings to respectively correspond to the light-emitting diode chips; and bonding the light-emitting diode chips and the second wirings to each other, to form the display device.

Abstract translation: 制造显示装置的方法包括：将包括开口的掩模浸入溶液中; 将座位发光二极管芯片分别放置在掩模的开口中; 在所述掩模下面布置包括第一布线的第一柔性基板，并且将所述第一布线对准于所述掩模的开口; 从溶液中除去第一柔性基板，其中第一布线对应于掩模的开口与掩模一起，发光二极管芯片位于其开口中; 将发光二极管芯片和第一布线彼此接合; 提供第二柔性基板，其上包括第二布线，并且将所述第二布线对准分别对应于所述发光二极管芯片; 并且将发光二极管芯片和第二布线彼此接合，以形成显示装置。

公开(公告)号：US20140145328A1

公开(公告)日：2014-05-29

申请号：US14160136

申请日：2014-01-21

Applicant: Georgia Tech Research Corporation

Inventor： Rao Tummala ,  Venkatesh Sundaram ,  Markondeya Raj Pulugurtha ,  Tao Wang ,  Vanessa Smet

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/03424 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0805 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/11462 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/1605 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/273 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/3205 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80048 ,  H01L2224/80121 ,  H01L2224/80203 ,  H01L2224/80411 ,  H01L2224/80439 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80464 ,  H01L2224/80469 ,  H01L2224/80801 ,  H01L2224/80903 ,  H01L2224/81048 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3651 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/80

Abstract: The various embodiments of the present invention provide fine pitch, chip-to-substrate hybrid interconnect assemblies, as well as methods of making and using the assemblies. The hybrid assemblies generally include a semiconductor having a die pad disposed thereon, a substrate having a substrate pad disposed thereon, and a polymer layer disposed between the surface of the die pad and the surface of the substrate pad. In addition, at least a portion of the surface of the die pad is metallically bonded to at least a portion of the surface of the substrate pad and at least a portion of the surface of the die pad is chemically bonded to at least a portion of the surface of the substrate pad.

Abstract translation: 本发明的各种实施例提供细间距，芯片到衬底混合互连组件，以及制造和使用组件的方法。 混合组件通常包括其上设置有管芯焊盘的半导体，其上设置有衬底焊盘的衬底以及设置在管芯焊盘的表面和衬底焊盘的表面之间的聚合物层。 此外，芯片焊盘的表面的至少一部分金属地结合到衬底焊盘的表面的至少一部分，并且芯片焊盘的表面的至少一部分化学键合到至少一部分 衬底垫的表面。