公开(公告)号：US20170283144A1

公开(公告)日：2017-10-05

申请号：US15459420

申请日：2017-03-15

Applicant: Infineon Technologies AG

Inventor： Franco Mariani ,  Christoph Ahamer ,  Corneleus Esguerra Caunan

IPC: B65D73/02 ,  H01L23/10 ,  H01L23/053

CPC classification number: B65D73/02 ,  H01L23/053 ,  H01L23/10 ,  H01L24/75 ,  H01L2224/75601 ,  H05K13/0084

Abstract: A carrier tape comprises a flexible body portion having a top surface. The flexible body portion comprises a plurality of pockets. Each of the plurality of pockets comprises pocket side walls, a base bottom portion fully circulating a raised bottom portion of a pedestal. The pedestal is made up of the raised bottom portion and pedestal side walls. The pedestal sidewalls, the base bottom portion and a lower part of the pocket side walls constitute a trench fully circulating the pedestal.

公开(公告)号：US20160155721A1

公开(公告)日：2016-06-02

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji SUGAKAWA ,  Yuji MIMURA ,  Shuhei MATSUMOTO ,  Takahiro MASUNAGA ,  Makoto TSUKISHIMA

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

Abstract translation: 提供了将基板彼此接合的方法，其包括：将第一基板保持在第一保持部的下表面上; 通过温度调节部分调节第二基板的温度以变得高于第一基板的温度; 将第二基板保持在第二保持部的上表面上; 通过用第一成像部分对第二基板的多个参考点进行成像来检查第二基板的状态，测量参考点的位置，并将测量结果与预定的允许范围进行比较; 并且用按压部件按压所述第一基板的中央部，使所述第一基板的中央部与所述第二基板的中央部接触，并顺序地接合所述第一基板和所述第二基板。

公开(公告)号：US20150228613A1

公开(公告)日：2015-08-13

申请号：US14691643

申请日：2015-04-21

Applicant: Zen Voce Corporation

Inventor： Tu-Chen Lee

IPC: H01L23/00 ,  B23K3/06

CPC classification number: B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/742 ,  H01L24/75 ,  H01L2224/03828 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/75102 ,  H01L2224/75601 ,  H01L2224/75611 ,  H01L2224/75621 ,  H01L2924/014

Abstract: An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.

公开(公告)号：US20190067243A1

公开(公告)日：2019-02-28

申请号：US16075829

申请日：2017-02-09

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Neil DAVIES ,  Richard David PRICE ,  Stephen DEVENPORT ,  Stuart Philip SPEAKMAN

IPC: H01L23/00

CPC classification number: H01L24/97 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/75601 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75651 ,  H01L2224/7598 ,  H01L2224/81192 ,  H01L2224/95115 ,  H01L2224/97 ,  H01L2924/00014

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

公开(公告)号：US09873555B2

公开(公告)日：2018-01-23

申请号：US15459420

申请日：2017-03-15

Applicant: Infineon Technologies AG

Inventor： Franco Mariani ,  Christoph Ahamer ,  Corneleus Esguerra Caunan

IPC: H01L23/02 ,  B65D85/00 ,  B65D73/02 ,  H01L23/053 ,  H01L23/10

CPC classification number: B65D73/02 ,  H01L23/053 ,  H01L23/10 ,  H01L24/75 ,  H01L2224/75601 ,  H05K13/0084

Abstract: A carrier tape comprises a flexible body portion having a top surface. The flexible body portion comprises a plurality of pockets. Each of the plurality of pockets comprises pocket side walls, a base bottom portion fully circulating a raised bottom portion of a pedestal. The pedestal is made up of the raised bottom portion and pedestal side walls. The pedestal sidewalls, the base bottom portion and a lower part of the pocket side walls constitute a trench fully circulating the pedestal.

公开(公告)号：US09741595B2

公开(公告)日：2017-08-22

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Sugakawa ,  Yuji Mimura ,  Shuhei Matsumoto ,  Takahiro Masunaga ,  Makoto Tsukishima

IPC: H01L21/67 ,  H01L21/66 ,  H01L23/00 ,  H01L21/68 ,  H01L21/822

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

公开(公告)号：US09120170B2

公开(公告)日：2015-09-01

申请号：US14069453

申请日：2013-11-01

Applicant: Zen Voice Corporation

Inventor： Tu-Chen Lee

IPC: B23K31/02 ,  B23K3/06 ,  H01L23/00

CPC classification number: B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/742 ,  H01L24/75 ,  H01L2224/03828 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/75102 ,  H01L2224/75601 ,  H01L2224/75611 ,  H01L2224/75621 ,  H01L2924/014

Abstract: An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.

Abstract translation: 用于在集成电路基板上放置和安装焊球的装置包括：固定装置，抽真空装置，引导板和储存罐。 固定装置包括限定在其中的多个第一凹槽，该真空装置设置在固定装置上方，并且包括具有空气孔的真空室，使得当空气经由空气孔从真空室中抽出时，多个焊球 并且当空气从空气孔进入真空室时，多个焊球被释放。 引导板固定在固定装置的下方，储槽布置在引导板的下方并被施加以容纳多个焊球。 由此，提高了将多个焊球放置并安装在集成电路基板上的生产成本。

公开(公告)号：US20150122873A1

公开(公告)日：2015-05-07

申请号：US14069453

申请日：2013-11-01

Applicant: Tu-Chen Lee

Inventor： Tu-Chen Lee

IPC: B23K3/06 ,  H01L23/00

CPC classification number: B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/742 ,  H01L24/75 ,  H01L2224/03828 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/75102 ,  H01L2224/75601 ,  H01L2224/75611 ,  H01L2224/75621 ,  H01L2924/014

Abstract: An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.

Abstract translation: 用于在集成电路基板上放置和安装焊球的装置包括：固定装置，抽真空装置，引导板和储存罐。 固定装置包括限定在其中的多个第一凹槽，该真空装置设置在固定装置上方，并且包括具有空气孔的真空室，使得当空气经由空气孔从真空室中抽出时，多个焊球 并且当空气从空气孔进入真空室时，多个焊球被释放。 引导板固定在固定装置的下方，储槽布置在引导板的下方并被施加以容纳多个焊球。 由此，提高了将多个焊球放置并安装在集成电路基板上的生产成本。