公开(公告)号：US20160081241A1

公开(公告)日：2016-03-17

申请号：US14948385

申请日：2015-11-23

Applicant: SHINKAWA LTD.

Inventor： KOHEI SEYAMA

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/04 ,  H01L21/67144 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27318 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75734 ,  H01L2224/75744 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81 ,  H01L2224/81048 ,  H01L2224/81815 ,  H01L2224/83048 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83948 ,  H01L2224/83986 ,  H01L2224/9211 ,  H01L2224/97 ,  H05K3/30 ,  H05K2203/1105 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/83

Abstract: Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.

Abstract translation: 提供了一种用于将芯片（400）安装到基板（200）的倒装芯片安装装置，并且该装置包括分为加热部分（452）和非加热部分（456）的至少一个分段安装台（45） 所述加热部用于加热固定在所述加热部的前表面的基板（200），所述非加热部不加热被吸附到所述非加热部的前表面的基板（200）。 由此，能够提供简单且能够有效地安装大量电子部件的电子部件安装装置。

公开(公告)号：US08916419B2

公开(公告)日：2014-12-23

申请号：US13494814

申请日：2012-06-12

Applicant: Chin-Liang Chen ,  Wei-Ting Lin ,  Yu-Chih Liu ,  Kuan-Lin Ho ,  Jason Shen

Inventor： Chin-Liang Chen ,  Wei-Ting Lin ,  Yu-Chih Liu ,  Kuan-Lin Ho ,  Jason Shen

IPC: H01L21/00

CPC classification number: H01L21/56 ,  H01L21/565 ,  H01L24/27 ,  H01L24/743 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75611 ,  H01L2924/16152 ,  H01L2924/00

Abstract: A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.

Abstract translation: 一种半导体封装组装工艺，包括将一个或多个管芯附接到衬底; 通过具有印模式分配头的粘合剂分配器将粘合剂材料施加在基材的周边上; 通过具有印模式分配头的TIM分配器将热界面材料（TIM）施加在模具的顶表面上; 以及将盖子定位在所述一个或多个模具上，并且通过盖子载体将所述盖子放置在所述粘合剂材料和所述TIM的顶部上以封装所述一个或多个模具。

公开(公告)号：US20130016205A1

公开(公告)日：2013-01-17

申请号：US13224511

申请日：2011-09-02

Applicant: Yoshiaki MAKITA ,  Shingo Fukasawa

Inventor： Yoshiaki MAKITA ,  Shingo Fukasawa

IPC: H04N7/18

CPC classification number: H01L24/75 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75611 ,  H01L2224/75753 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on −Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction.

Abstract translation: 公开了一种芯片焊接机，其不需要移动用于捕获与粘合剂应用相关的图像的识别相机，并以高通量实现高可靠性。 芯片焊接机包括引线框架; 位于引线框架上方的注射器，并在其中封装有糊状粘合剂; 注射器侧面的识别摄像机; 配置在识别照相机附近的照明灯; 以及与照明灯相对设置的反射板。 所述反射板适于在所述糊状粘合剂的使用表面处将来自所述照明灯的光反射到所述引线框架上。 识别照相机，照明灯和反射板以反射板设置在-Y侧，并且识别照相机和照明灯相对于位于引导框架上方的注射器位于+ Y侧 在X方向。

公开(公告)号：US11972956B2

公开(公告)日：2024-04-30

申请号：US16881632

申请日：2020-05-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chin-Liang Chen ,  Wei-Ting Lin ,  Yu-Chih Liu ,  Kuan-Lin Ho ,  Jason Shen

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/56 ,  H01L24/27 ,  H01L24/743 ,  H01L24/75 ,  H01L21/565 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75611 ,  H01L2924/16152 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.

公开(公告)号：US20230260950A1

公开(公告)日：2023-08-17

申请号：US18306840

申请日：2023-04-25

Applicant: Google LLC

Inventor： ChanWei Chiu ,  Naiyong Chen ,  Yencheng Chen ,  Guangjun Huang ,  Michael J. Lombardi ,  Nael Hannan

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L25/16 ,  H01L24/73 ,  H01L24/16 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/26175 ,  H01L2924/19041 ,  H01L2224/75611 ,  H01L24/75

Abstract: This document describes apparatuses and techniques for disposing an underfill dam on a device adjacent to a mounting location for an integrated circuit to direct a flow of underfill toward the mounting location so that the underfill does not flow in undesired directions that may undesirably affect adjacent components.

公开(公告)号：US20160086830A1

公开(公告)日：2016-03-24

申请号：US14489651

申请日：2014-09-18

Applicant: Kwok Yuen CHEUNG ,  Kwok Wah TONG ,  Jin Hui MENG ,  Wan Yin YAU ,  Man Kit CHOW

Inventor： Kwok Yuen CHEUNG ,  Kwok Wah TONG ,  Jin Hui MENG ,  Wan Yin YAU ,  Man Kit CHOW

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L24/75 ,  H01L22/12 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75251 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75611 ,  H01L2224/75702 ,  H01L2224/75745 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83862 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.

Abstract translation: 公开了一种芯片焊接工具，其包括：刚体; 以及具有模具保持部的夹头; 其中所述夹头通过柔性元件机械地联接到所述刚体，所述柔性元件构造成在将力矩施加到所述夹头和/或由所述夹头保持的模具上时相对于所述刚性体成角度地偏转。 还公开了一种管芯接合系统，其包括管芯接合工具和用于管芯接合系统的粘合剂分配器。

公开(公告)号：US20150228613A1

公开(公告)日：2015-08-13

申请号：US14691643

申请日：2015-04-21

Applicant: Zen Voce Corporation

Inventor： Tu-Chen Lee

IPC: H01L23/00 ,  B23K3/06

CPC classification number: B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/742 ,  H01L24/75 ,  H01L2224/03828 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/75102 ,  H01L2224/75601 ,  H01L2224/75611 ,  H01L2224/75621 ,  H01L2924/014

Abstract: An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.

公开(公告)号：US20240038716A1

公开(公告)日：2024-02-01

申请号：US17873318

申请日：2022-07-26

Applicant: Western Digital Technologies, Inc.

Inventor： Choo Par Tan ,  Ee May Lim ,  Chee Ern NG

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L24/83 ,  H01L24/81 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2924/3511 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75901 ,  H01L2224/75611 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83908 ,  G01B11/0608

Abstract: A method of dispensing an underfill material on a semiconductor device package. A substrate having a semiconductor chip electrically connected thereto and offset from the substrate by solder joints is provided. The semiconductor chip has a footprint defined by a length and width of the semiconductor chip. Standoff heights between the substrate and the semiconductor chip are calculated and used to determine a volume of underfill material needed to substantially fill a space between the substrate and the semiconductor chip. The determined volume of underfill material is dispensed on the substrate such that the space between the substrate and the semiconductor chip is substantially filled by the underfill material. The method may allow for improved dispensing an underfill material to substantially fill the space between the substrate and semiconductor chip when variations in standoff height are present.

公开(公告)号：US20230420406A1

公开(公告)日：2023-12-28

申请号：US17865200

申请日：2022-07-14

Applicant: KULICKE AND SOFFA HI-TECH CO., LTD.

Inventor： Lu-Min Chen ,  Tsung-Lin Tsai

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/56

CPC classification number: H01L24/75 ,  H01L21/67126 ,  H01L21/56 ,  H01L24/83 ,  H01L24/32 ,  H01L2224/32221 ,  H01L2224/75611 ,  H01L2224/75901 ,  H01L2924/351 ,  H01L2224/83908 ,  H01L2224/83862 ,  H01L2224/83825 ,  H01L24/743

Abstract: One embodiment of the present invention discloses an intelligent dispensing adjustment system and the method thereof. The system can dynamically detect the fluid dispensing amount of a fluid dispensing unit via a calculating unit having an intelligent dispensing mechanism and keeps monitoring the dispensing situation of the fluid material so as to automatically adjust the fluid dispensing amount of the fluid dispensing unit. The system can adjust the fluid dispensing amount of the fluid dispensing unit by obtaining the information of the state of previously dispensing the fluid material via a closed loop, which can solve the problems, of prior art, that the defects of products may be incurred because the state of the fluid material is hard to control (e.g., the fluid material is insufficient or overflows).

公开(公告)号：US20180130683A1

公开(公告)日：2018-05-10

申请号：US15570188

申请日：2016-04-26

Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

Inventor： Rob Jacob Hendriks ,  Daan Anton Van den Ende ,  Edsger Constant Pieter Smits

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/683

CPC classification number: H01L21/67356 ,  H01L21/67751 ,  H01L21/683 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2021/60007 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/7526 ,  H01L2224/75502 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).