公开(公告)号：US20240105480A1

公开(公告)日：2024-03-28

申请号：US18093085

申请日：2023-01-04

Applicant: Taiwan Semiconductor Manufacturing Company

Inventor： Ming-Sze Chen ,  Yuan-Hsin Chi ,  Hung-Chih Wang ,  Sheng-Yuan Lin

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67265 ,  H01L21/67326 ,  H01L21/67751

Abstract: A wafer storage elevator and method for detecting wafer position shift. The elevator includes a first storage elevator sidewall, a second storage elevator sidewall, and a storage seat positioned between the first and second storage elevator sidewalls. A first mirror block is coupled to a front side of the storage seat having a mirror positioned on a top surface of the block, and a second mirror block is coupled to the front side of the storage seat having a mirror that is positioned on the top surface of the second mirror block. The mirror of the first mirror block reflects a laser beam from an emission sensor to the second mirror block, and the mirror of the second mirror block reflects the laser beam from the mirror of the first mirror block to a receive sensor. A wafer misalignment is determined based upon an output of the receive sensor.

公开(公告)号：US20230420279A1

公开(公告)日：2023-12-28

申请号：US18244557

申请日：2023-09-11

Applicant: Applied Materials, Inc.

Inventor： Masato ISHII ,  Richard O. COLLINS ,  Richard GILJUM ,  Alexander BERGER

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/673 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67778 ,  H01L21/67751 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/67346 ,  H01L21/67748 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/68757 ,  H01L21/68735 ,  H01L21/67126 ,  H01L21/67115 ,  H01L21/67109 ,  H01L21/67017 ,  H01L21/67248 ,  H01L21/68 ,  H01L21/67207 ,  H01L21/67739

Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

公开(公告)号：US11804394B2

公开(公告)日：2023-10-31

申请号：US17460390

申请日：2021-08-30

Applicant: Taiwan Semiconductor Manufacturing Company Limited

Inventor： Yen-Fu Shen

IPC: H01L21/677

CPC classification number: H01L21/67751 ,  H01L21/67712 ,  H01L21/67733 ,  H01L21/67769 ,  H01L21/67736

Abstract: Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.

公开(公告)号：US11784076B2

公开(公告)日：2023-10-10

申请号：US17866152

申请日：2022-07-15

Applicant: Applied Materials, Inc.

Inventor： Masato Ishii ,  Richard O. Collins ,  Richard Giljum ,  Alexander Berger

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/673 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67778 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67126 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67248 ,  H01L21/67346 ,  H01L21/67739 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/68 ,  H01L21/68707 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68757

Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

公开(公告)号：US11710654B2

公开(公告)日：2023-07-25

申请号：US17398422

申请日：2021-08-10

Applicant: SEMES CO., LTD.

Inventor： Ki Won Han ,  Byoung Doo Choi

IPC: H01L21/677 ,  H01L21/683 ,  G03F7/00 ,  G03F7/16 ,  H01L21/687

CPC classification number: H01L21/6838 ,  G03F7/162 ,  G03F7/70733 ,  H01L21/67751 ,  H01L21/68742

Abstract: A substrate transport apparatus includes transport hands that clamp substrates by vacuum pressures, respectively, and that are located at different heights, a vacuum pressure supply unit that supplies the vacuum pressures to the transport hands, and a controller that controls the vacuum pressure supply unit to supply the vacuum pressures to the transport hands or interrupt the supply of the vacuum pressures to the transport hands. The controller controls the vacuum pressure supply unit such that the vacuum pressures of the transport hands are turned off at the same height from a substrate support member.

公开(公告)号：US11688617B2

公开(公告)日：2023-06-27

申请号：US17299840

申请日：2019-11-22

Applicant: Rorze Corporation

Inventor： Yoshiki Fukuzaki

IPC: G01R1/30 ,  G01R17/16 ,  G01R19/00 ,  H01L21/67 ,  G01B7/14 ,  H01L21/677 ,  H01L21/683 ,  G01R19/22 ,  G01R1/20

CPC classification number: H01L21/67265 ,  G01B7/14 ,  G01R1/30 ,  G01R17/16 ,  G01R19/0092 ,  H01L21/67766 ,  H01L21/67778 ,  G01R1/203 ,  G01R19/0023 ,  G01R19/22 ,  H01L21/67751 ,  H01L21/6838

Abstract: Provided is an electrostatic capacitance sensor which can remove an influence of a noise occurring from a static eliminator or a driving source and accurately perform measurement even on electrostatic capacitance detected by a thin-type detection unit which can be passed to a finger surface of a wafer transfer robot. The present invention is provided with an AC supply source which supplies an AC voltage to a detection unit, a parasitic capacitance compensation circuit, an operational amplifier, a differential amplifier, a phase detection means, and a low pass filter. An operational amplification output terminal is connected to an inversion input terminal of the differential amplifier through a first band pass filter, the AC supply source is connected to a non-inversion input terminal of the differential amplifier through a second band pass filter, an output terminal of the differential amplifier is connected to an input terminal of the phase detection means, and the phase detection means takes, as a reference signal, an AC signal output from the AC supply source.

公开(公告)号：US10077504B2

公开(公告)日：2018-09-18

申请号：US15450873

申请日：2017-03-06

Applicant: EBARA CORPORATION

Inventor： Yoshio Minami ,  Ryuya Koizumi

IPC: C23C18/16 ,  C25D17/06 ,  C25D17/00 ,  C25D21/12 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L23/00

CPC classification number: C25D17/001 ,  C23C18/1628 ,  C23C18/163 ,  C23C18/1632 ,  C23C18/1675 ,  C25D17/06 ,  C25D21/12 ,  H01L21/6723 ,  H01L21/67751 ,  H01L21/68721 ,  H01L24/743 ,  H01L24/83 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.

公开(公告)号：US20180218924A1

公开(公告)日：2018-08-02

申请号：US15883481

申请日：2018-01-30

Applicant: Tokyo Electron Limited

Inventor： Koji TANAKA ,  Toshiyuki SHIOKAWA ,  Koji YAMASHITA ,  Hiroyuki MASUTOMI ,  Hitoshi KOSUGI ,  Takao INADA ,  Takashi IKEDA ,  Tsukasa HIRAYAMA

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67086 ,  H01L21/67034 ,  H01L21/67057 ,  H01L21/67309 ,  H01L21/67313 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67757

Abstract: A substrate liquid treatment apparatus includes an inner tank configured to store a treatment liquid and having an upper opening, an outer tank disposed outside the inner tank, and a lid movable between a close position for closing the upper opening of the inner tank and an open position for opening the upper opening of the inner tank. The lid includes a main portion that covers the upper opening of the inner tank when the lid is positioned at the close position, and a splash shielding portion connected to the main portion. When the lid is positioned at the close position, the splash shielding portion extends from a position higher than an upper end of a side wall of the inner tank adjacent to the splash shielding portion to a position which is lower than the upper end of the side wall and which is on the outer tank side of the side wall.

公开(公告)号：US09624594B2

公开(公告)日：2017-04-18

申请号：US14194514

申请日：2014-02-28

Applicant: EBARA CORPORATION

Inventor： Yoshio Minami ,  Ryuya Koizumi

IPC: C25D17/00 ,  C25D17/06 ,  C23C18/16 ,  H01L21/02 ,  C25D21/12 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: C25D17/001 ,  C23C18/1628 ,  C23C18/163 ,  C23C18/1632 ,  C23C18/1675 ,  C25D17/06 ,  C25D21/12 ,  H01L21/6723 ,  H01L21/67751 ,  H01L21/68721 ,  H01L24/743 ,  H01L24/83 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.

公开(公告)号：US09603195B2

公开(公告)日：2017-03-21

申请号：US14314348

申请日：2014-06-25

Applicant: CANON ANELVA CORPORATION

Inventor： Kaori Mashimo ,  Masami Shibagaki

IPC: H05B3/00 ,  H01L21/687 ,  H01L21/67 ,  C23C16/458 ,  H01L21/677

CPC classification number: H05B3/0038 ,  C23C16/4585 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67751 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68785 ,  H05B3/0047 ,  H05B3/009

Abstract: An apparatus includes a C-shaped susceptor including a first substrate placement portion capable of placing the substrate, and an opening portion, a substrate stage including a second substrate placement portion capable of placing the substrate, and a susceptor support portion configured to support the susceptor, and a complementary portion formed separately from the susceptor support portion, engaged with the susceptor support portion, and configured to complement an opening portion of the susceptor to form the susceptor into an annular shape in a state in which the susceptor support portion supports the susceptor. When the substrate is placed on the second substrate placement portion and the second substrate placement portion is located at a predetermined distant position with respect to the heat radiation surface, the susceptor forms the annular shape together with the complementary portion to surround the substrate.