公开(公告)号：US20190237445A1

公开(公告)日：2019-08-01

申请号：US16381982

申请日：2019-04-11

Applicant: Rohinni, LLC

Inventor： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC: H01L25/075 ,  H01L21/683 ,  G02F1/1335 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L33/62 ,  H01L21/67 ,  H01L23/544 ,  H01L21/48 ,  H01L23/532

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.

公开(公告)号：US09165902B2

公开(公告)日：2015-10-20

申请号：US14567031

申请日：2014-12-11

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： Matthew B. Wasserman ,  Michael P. Schmidt-Lange ,  Thomas J. Colosimo, Jr.

IPC: B23K31/02 ,  H01L23/00 ,  B23K1/00 ,  B23K31/12 ,  H01L21/66

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/00 ,  B23K3/04 ,  B23K3/08 ,  B23K31/12 ,  H01L21/00 ,  H01L22/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75001 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/75841 ,  H01L2224/75842 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/81121 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81986 ,  H05K3/34 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.

Abstract translation: 提供了一种操作用于接合半导体元件的接合机的方法。 该方法包括以下步骤：（a）在模型接合过程期间测量接合头组件的基于时间的z轴高度测量特性; （b）基于测量的基于时间的z轴高度测量特性确定用于随后的接合过程的z轴调节轮廓; 和（c）使用z轴调整轮廓在随后的接合过程期间用z轴运动系统来调整接合头组件的z轴位置。

公开(公告)号：US20170365586A1

公开(公告)日：2017-12-21

申请号：US15691657

申请日：2017-08-30

Applicant: Rohinni, LLC

Inventor： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC: H01L25/075 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00 ,  H01L33/62 ,  H01L21/67 ,  H01L21/48

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: An elongated light circuit includes an elongated circuit trace and a plurality of micro-sized, unpackaged LEDs disposed sequentially on the circuit trace. A height of the LEDs ranges from about 12.5 microns to about 200 microns. The elongated circuit trace and the LEDs are coated with a protective coating.

公开(公告)号：US20170256523A1

公开(公告)日：2017-09-07

申请号：US15600611

申请日：2017-05-19

Applicant: Rohinni, LLC

Inventor： ANDREW HUSKA ,  CODY PETERSON ,  CLINTON ADAMS ,  SEAN KUPCOW

IPC: H01L25/075 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/544 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L33/62 ,  H01L21/48

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.

公开(公告)号：US09478516B2

公开(公告)日：2016-10-25

申请号：US14855848

申请日：2015-09-16

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： Matthew B. Wasserman ,  Michael P. Schmidt-Lange ,  Thomas J. Colosimo, Jr.

IPC: B23K37/00 ,  H01L23/00 ,  B23K1/00 ,  B23K31/12 ,  H01L21/66 ,  B23K3/00 ,  H05K3/34 ,  H01L21/00 ,  B23K3/04 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/00 ,  B23K3/04 ,  B23K3/08 ,  B23K31/12 ,  H01L21/00 ,  H01L22/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75001 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/75841 ,  H01L2224/75842 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/81121 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81986 ,  H05K3/34 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.

公开(公告)号：US20130122610A1

公开(公告)日：2013-05-16

申请号：US13460901

申请日：2012-05-01

Applicant: Jun-Wei Chung ,  Wei-Cheng Lou ,  Jung-Kun Wu ,  Chung-I Chiang

Inventor： Jun-Wei Chung ,  Wei-Cheng Lou ,  Jung-Kun Wu ,  Chung-I Chiang

IPC: H01L21/66 ,  B32B41/00 ,  B32B38/18

CPC classification number: H01L24/97 ,  H01L21/6838 ,  H01L24/75 ,  H01L33/0095 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75842 ,  H01L2224/7598 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T156/1702 ,  H01L2924/00

Abstract: A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.

Abstract translation: 提供了一种芯片接合装置和芯片接合方法，其能够将多个模具从第一放置区域同时接合到布置在第二放置区域上的基板上。 芯片接合装置包括可移动地位于第一放置区域上方的模具吸附装置和第二放置区域。 模具吸引装置包括多个喷嘴。 喷嘴可以吸附设置在第一放置区域上的模具，然后同时将模具结合到基板上。

公开(公告)号：US20180261581A1

公开(公告)日：2018-09-13

申请号：US15978093

申请日：2018-05-12

Applicant: Rohinni, LLC

Inventor： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC: H01L25/075 ,  H01L21/677 ,  H01L21/48 ,  H01L21/687 ,  H01L33/62 ,  H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  H01L23/544 ,  H01L21/683 ,  H01L21/68

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A system for performing a direct transfer of a plurality of semiconductor die from a first substrate to a second substrate based on map data of the location of the semiconductor die. A first conveyance mechanism conveys the first substrate. A second conveyance mechanism conveys the second substrate. A transfer mechanism is disposed adjacent to the first conveyance mechanism to effectuate the direct transfer. A controller causes one or more processors to perform operations including: determining positions of the plurality of semiconductor die based at least in part on map data, conveying at least one of the first substrate or the second substrate such that the first substrate, the second substrate, and the transfer mechanism are in a direct transfer position, and activating the transfer mechanism to perform the direct transfer of the plurality of semiconductor die.

公开(公告)号：US20170256524A1

公开(公告)日：2017-09-07

申请号：US15600637

申请日：2017-05-19

Applicant: Rohinni, LLC

Inventor： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC: H01L25/075 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/544 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L33/62 ,  H01L21/48

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

公开(公告)号：US20170140959A1

公开(公告)日：2017-05-18

申请号：US15418573

申请日：2017-01-27

Applicant: Rohinni, LLC

Inventor： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/48 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. The apparatus includes a first frame to hold the first substrate, and a second frame to hold the second substrate adjacent to the first side of the first substrate. A needle is disposed adjacent to the first frame and extends in a direction toward the second side of the first substrate. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the first substrate to press the semiconductor device die into contact with the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.

公开(公告)号：US09406640B2

公开(公告)日：2016-08-02

申请号：US14743050

申请日：2015-06-18

Applicant: Shinkawa Ltd.

Inventor： Kohei Seyama

IPC: B23K31/02 ,  B23K37/00 ,  H01L23/00 ,  B23K3/00 ,  B23K37/04 ,  B23K1/00

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/00 ,  B23K37/04 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/75701 ,  H01L2224/75703 ,  H01L2224/75744 ,  H01L2224/75801 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/81815 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Provided is a flip chip bonder including: a base (12); a bonding stage (20); a plurality of vertical-position adjustment support mechanisms (30) attached to the base (12), and respectively configured to support, in a vertical direction, the bonding stage (20) at a plurality of supporting points being provided on a lower surface (22) of the bonding stage (20), and to adjust positions of the supporting points in the vertical direction; and a leaf spring mechanism (40) configured to connect the base (12) with the bonding stage (20). The leaf spring mechanism (40) restrains movement of the bonding stage (20) relative to the base (12) in an X axis along a surface (21) of the bonding stage (20) and a Y axis perpendicular to the X axis, and allows first twisting about the X axis and second twisting about the Y axis of the bonding stage (20) relative to the base (12), and movement of the bonding stage (20) relative to the base (12) in the vertical direction. This provides the flip chip bonder with improved bonding quality and increased bonding speed.

Abstract translation: 提供一种倒装芯片接合器，包括：基座（12）; 接合台（20）; 多个垂直位置调整支撑机构（30），其安装在所述基座（12）上，并且分别构造成在垂直方向上支撑在多个支撑点处的接合台（20），所述多个支撑点设置在下表面 22），并且调整支撑点在垂直方向上的位置; 以及板弹簧机构（40），其构造成将所述基座（12）与所述接合台（20）连接。 板簧机构（40）沿着接合台（20）的表面（21）和垂直于X轴的Y轴在X轴上限制接合台（20）相对于基座（12）的移动， 并且允许围绕X轴的第一扭转和关于接合台（20）的Y轴相对于基部（12）的第二扭转，以及接合台（20）相对于基座（12）在垂直方向上的移动 。 这提供了具有改进的接合质量和增加的接合速度的倒装焊接机。