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公开(公告)号:US20170256523A1
公开(公告)日:2017-09-07
申请号:US15600611
申请日:2017-05-19
Applicant: Rohinni, LLC
Inventor: ANDREW HUSKA , CODY PETERSON , CLINTON ADAMS , SEAN KUPCOW
IPC: H01L25/075 , H01L23/00 , H01L21/67 , H01L21/683 , H01L23/544 , H01L21/677 , H01L21/68 , H01L21/687 , H01L21/66 , H01L33/62 , H01L21/48
CPC classification number: H01L25/0753 , G02F1/133603 , G02F1/133605 , G02F1/133606 , G02F2001/133612 , H01L21/4853 , H01L21/67132 , H01L21/67144 , H01L21/67196 , H01L21/67265 , H01L21/67715 , H01L21/67778 , H01L21/681 , H01L21/6836 , H01L21/68742 , H01L22/12 , H01L22/20 , H01L23/53242 , H01L23/544 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/89 , H01L33/62 , H01L2221/68322 , H01L2221/68327 , H01L2221/68354 , H01L2221/68363 , H01L2221/68381 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54486 , H01L2224/16238 , H01L2224/75252 , H01L2224/75261 , H01L2224/75262 , H01L2224/75303 , H01L2224/7531 , H01L2224/75314 , H01L2224/75317 , H01L2224/75651 , H01L2224/75753 , H01L2224/75824 , H01L2224/75842 , H01L2224/75843 , H01L2224/81191 , H01L2224/81205 , H01L2224/81224 , H01L2224/83224 , H01L2924/12041 , H01L2924/405 , H01L2933/0066 , H01L2924/00014
Abstract: A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.