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公开(公告)号：US11769749B2
公开(公告)日：2023-09-26
申请号：US17427098
申请日：2020-04-08
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama , Tetsuya Utano
CPC classification number: H01L24/75 , H05K13/046 , H05K13/0409 , H01L24/73 , H01L2224/73204 , H01L2224/7555 , H01L2224/7598 , H01L2224/75745
Abstract: A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.
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公开(公告)号：US11749541B2
公开(公告)日：2023-09-05
申请号：US17602279
申请日：2020-04-07
Applicant: SHINKAWA LTD.
Inventor： Shigeyuki Sekiguchi , Yuji Eguchi , Kohei Seyama
IPC: H01L21/67 , H05K13/04 , H01L23/00 , H01L21/683
CPC classification number: H01L21/67144 , H01L21/67132 , H01L24/75 , H05K13/0419 , H01L21/6838 , H01L2224/7565 , H05K13/0409
Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.
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公开(公告)号：US11508688B2
公开(公告)日：2022-11-22
申请号：US16087087
申请日：2017-03-24
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama , Yuji Eguchi , Shoji Wada
IPC: H01L23/00 , H01L21/52 , H01L25/065 , H01L25/10
Abstract: The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.
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4.发明授权公开(公告)号：US11469125B2
公开(公告)日：2022-10-11
申请号：US16650871
申请日：2018-08-28
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama , Tetsuya Utano , Yuichiro Noguchi
IPC: H01L21/677 , H01L21/52 , H02K41/02 , G05B19/19
Abstract: A device for linearly moving bases with respect to an object, includes first and second bases, a linear scale provided with graduations at pitches in the moving direction, first and second encoder heads attached to the first and second bases, and a control unit. The control unit maintains an interval between the first and second encoder heads to be constant, and moves the first and second bases while sequentially detects a first and second graduation numbers, and calculates a distance on the scale between the first and second encoder heads by multiplying a difference between the first and second graduation numbers by the pitch, and calculates a position correction coefficient of the scale as a ratio of the interval with respect to the calculated distance, and controls the movement amount of the first movable body and the second movable body based on the position correction coefficient.
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公开(公告)号：US10568245B2
公开(公告)日：2020-02-18
申请号：US15680207
申请日：2017-08-18
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama
Abstract: Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.
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Patent Agency Ranking
公开(公告)号：US12176317B2
公开(公告)日：2024-12-24
申请号：US17611172
申请日：2020-11-12
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama
Abstract: A semiconductor device manufacturing device (10) comprises: a stage (16) on which a substrate (100) is loaded; a bonding head (14) that is disposed facing the stage (16) and that bonds a semiconductor chip (110) to the substrate (100); and a controller (18). The bonding head (14) includes: an attachment (33) that holds the semiconductor chip (110) by suctioning; and a heating part (31) that detachably holds the attachment (33) and that heats the attachment (33). The heating part (31) has a first heating area (32a) and a second heating area (32b) that surrounds the first heating area (32a) in the horizontal direction. The controller (18) controls the temperatures of the first heating area (32a) and the second heating area (32b) independently.
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公开(公告)号：US11616041B2
公开(公告)日：2023-03-28
申请号：US16768694
申请日：2018-11-28
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama , Tetsuya Utano
Abstract: A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.
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公开(公告)号：US11410866B2
公开(公告)日：2022-08-09
申请号：US16650372
申请日：2018-08-28
Applicant: SHINKAWA LTD.
Inventor： Kohei Seyama , Tetsuya Utano , Yuichiro Noguchi
Abstract: The present invention is provided with: a base moving linearly relative to a substrate and having a first and second positions that are spaced apart from each other by a predetermined interval a in the movement direction; a linear scale where a plurality of graduations having a predetermined pitch are provided along the movement direction; encoder heads which respectively are disposed at the first and second positions of the base and detect first and second graduation numbers of the linear scale with respect to the first and second positions, wherein, as the base is moved along the linear scale, the first and second graduation numbers are detected in this order in the respective encoder heads, and the movement amount of the base is controlled on the basis of the ratio between the predetermined interval and the distance between the first graduation number and the second graduation number on the scale.
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公开(公告)号：US10477697B2
公开(公告)日：2019-11-12
申请号：US15396997
申请日：2017-01-03
Applicant: Shinkawa Ltd.
Inventor： Kohei Seyama
Abstract: A mounting apparatus includes a Y-axis movable base 36 movable in a Y-axis direction, a Z-axis movable base 40 attached to the Y-axis movable base 36 and movable in a Z-axis direction, a mounting head 12 attached to the Z-axis movable base 40 and including a mounting tool 16 for sucking and holding a semiconductor chip, a pressurizing mechanism 20 attached to the Y-axis movable base 36 and arranged to apply a force in the Z-axis direction to the mounting head 12, and a pressure receiving member 22 provided independently of the Y-axis and Z-axis movable bases 36 and 40 and installed in proximity to the pressurizing mechanism 20 to receive a reaction force in the Z-axis direction from the pressurizing mechanism 20, the pressurizing mechanism 20 slidable on the pressure receiving member 22. This prevents the mounting apparatus from being increased in the total size while maintaining the mounting accuracy high.
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公开(公告)号：US10350692B2
公开(公告)日：2019-07-16
申请号：US14597635
申请日：2015-01-15
Applicant: Shinkawa Ltd.
Inventor： Kohei Seyama , Yasuhiro Chida , Osamu Kakutani
Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
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