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US09406640B2 Flip chip bonder and method of correcting flatness and deformation amount of bonding stage 有权
倒角焊接机及矫正平台度和焊接阶段变形量的方法

Flip chip bonder and method of correcting flatness and deformation amount of bonding stage
Abstract:
Provided is a flip chip bonder including: a base (12); a bonding stage (20); a plurality of vertical-position adjustment support mechanisms (30) attached to the base (12), and respectively configured to support, in a vertical direction, the bonding stage (20) at a plurality of supporting points being provided on a lower surface (22) of the bonding stage (20), and to adjust positions of the supporting points in the vertical direction; and a leaf spring mechanism (40) configured to connect the base (12) with the bonding stage (20). The leaf spring mechanism (40) restrains movement of the bonding stage (20) relative to the base (12) in an X axis along a surface (21) of the bonding stage (20) and a Y axis perpendicular to the X axis, and allows first twisting about the X axis and second twisting about the Y axis of the bonding stage (20) relative to the base (12), and movement of the bonding stage (20) relative to the base (12) in the vertical direction. This provides the flip chip bonder with improved bonding quality and increased bonding speed.
Abstract(Chinese):

提供一种倒装芯片接合器，包括：基座（12）; 接合台（20）; 多个垂直位置调整支撑机构（30），其安装在所述基座（12）上，并且分别构造成在垂直方向上支撑在多个支撑点处的接合台（20），所述多个支撑点设置在下表面 22），并且调整支撑点在垂直方向上的位置; 以及板弹簧机构（40），其构造成将所述基座（12）与所述接合台（20）连接。 板簧机构（40）沿着接合台（20）的表面（21）和垂直于X轴的Y轴在X轴上限制接合台（20）相对于基座（12）的移动， 并且允许围绕X轴的第一扭转和关于接合台（20）的Y轴相对于基部（12）的第二扭转，以及接合台（20）相对于基座（12）在垂直方向上的移动 。 这提供了具有改进的接合质量和增加的接合速度的倒装焊接机。

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