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12 条记录 (耗时 0.018 秒)

    PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS
    1.
    发明申请
    PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS 有权

    公开(公告)号：US20220127496A1

    公开(公告)日：2022-04-28

    申请号：US17504272

    申请日：2021-10-18

    申请人： Brewer Science, Inc.

    发明人： Rama Puligadda ,  Xiao Liu ,  Luke M. Prenger ,  Xavier Martinez

    IPC分类号： C09J5/06 ,  H01L21/683 ,  C08G73/02

    摘要： A method is described for debonding a carrier and device substrate using a high-intensity, pulsed, broadband light system that is suitable for wafer-level packaging applications. The carrier substrate is a transparent wafer with a light absorbing layer on one side of the wafer. This method utilizes the high intensity light to rapidly heat up the light absorbing layer to decompose or melt a bonding material layer that is adjacent to the light absorbing layer. After exposure to light, the carrier substrate can be lifted off the surface of the device wafer with little or no force.

    MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING
    5.
    发明申请
    MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING 有权

    公开(公告)号：US20210332188A1

    公开(公告)日：2021-10-28

    申请号：US17241174

    申请日：2021-04-27

    申请人： Brewer Science, Inc.

    发明人： Luke M. Prenger ,  Qi Wu ,  Xiao Liu

    IPC分类号： C08G73/00 ,  C09J179/00 ,  B32B43/00 ,  B32B7/12 ,  B32B17/06 ,  H01L21/683

    摘要： The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

    LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
    6.
    发明申请
    LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS 审中-公开

    公开(公告)号：US20200234993A1

    公开(公告)日：2020-07-23

    申请号：US16747271

    申请日：2020-01-20

    申请人： Brewer Science, Inc.

    发明人： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

    IPC分类号： H01L21/683 ,  C08G73/02 ,  B32B43/00 ,  H01L21/56

    摘要： Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

    Laser-releasable bonding materials for 3-D IC applications
    7.
    发明授权
    Laser-releasable bonding materials for 3-D IC applications 有权

    公开(公告)号：US11610801B2

    公开(公告)日：2023-03-21

    申请号：US16747271

    申请日：2020-01-20

    申请人： Brewer Science, Inc.

    发明人： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

    IPC分类号： H01L21/683 ,  C08G73/02 ,  H01L21/56 ,  B32B43/00

    摘要： Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

    TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF METAL CONNECTION IN THERMOCOMPRESSION BONDING
    10.
    发明申请
    TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF METAL CONNECTION IN THERMOCOMPRESSION BONDING 有权

    公开(公告)号：US20220262755A1

    公开(公告)日：2022-08-18

    申请号：US17672020

    申请日：2022-02-15

    申请人： Brewer Science, Inc.

    发明人： Chia-Hsin Lee ,  Alice Guerrero ,  Arthur O. Southard ,  Chen-Yu Wu ,  Xiao Liu

    IPC分类号： H01L23/00

    摘要： Achieving homogeneous and heterogeneous integration for 2.5D and 3D integrated circuit, chip-to-wafer, chip-to-substrate, or wafer-to-wafer bonding is an essential technology. The landing wafer or substrate is bonded with a carrier by using a temporary bonding material before thinning the landing wafer to the desired thickness. Upon completion of redistribution layer formation, Cu pad formation, or other backside processing, dies or wafers with through-silicon vias are stacked onto the landing substrate before molding and singulation. As the landing wafer usually has interconnection metals in the bond line, and those interconnection metals are typically made from lead-free solder alloys, deformation of those solder alloys during thermocompression bonding becomes an issue for manufacturers. To address this issue, a polymeric material with desired strengths is coated on the device wafer to form a conformal protective layer on top of solder alloys, thus enabling temporary bonding and debonding processes.