- 专利标题： LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
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申请号： US18162028申请日： 2023-01-31
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公开(公告)号： US20230187257A1公开(公告)日： 2023-06-15
- 发明人: Luke Prenger , Arthur O. Southard , Qi Wu , Xiao Liu
- 申请人： Brewer Science, Inc.
- 申请人地址： US MO Rolla
- 专利权人： Brewer Science, Inc.
- 当前专利权人： Brewer Science, Inc.
- 当前专利权人地址： US MO Rolla
- 分案原申请号： US16747271 2020.01.20
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; C08G73/02 ; H01L21/56 ; B32B43/00
摘要：
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
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