公开(公告)号：US20150333032A1

公开(公告)日：2015-11-19

申请号：US14731431

申请日：2015-06-05

Applicant: SHINKAWA LTD.

Inventor： OSAMU KAKUTANI ,  TAKATOSHI KAWAMURA ,  KOHEI SEYAMA ,  AKIRA SATO

IPC: H01L23/00 ,  B29C65/18 ,  B32B37/08 ,  B32B37/06 ,  B29C65/44

CPC classification number: H01L24/75 ,  B29C65/18 ,  B29C65/44 ,  B29K2701/10 ,  B29L2031/3406 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2307/202 ,  B32B2457/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/75744 ,  H01L2224/75802 ,  H01L2224/75803 ,  H01L2224/75824 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/00012

Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.

Abstract translation: 一种焊接工具冷却装置（10），设置在包括框架（12）的接合台附近; 包括接地板（14）的冷却构件（16），所述接地板（14）具有接地工具（61）的前边缘表面接地的接地表面（14a），和散热片（15） 所述接地板（14）到达所述地面（14a），其中所述冷却构件（16）通过支撑机构（200）支撑在所述框架（12）上，使得所述冷却构件（16）能够围绕两个轴线旋转， 即沿着地面（14a）延伸的X轴和沿地面（14a）延伸的Y轴。 粘合工具的冷却时间可以降低。

公开(公告)号：US20150121692A1

公开(公告)日：2015-05-07

申请号：US14391489

申请日：2013-03-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD

Inventor： Hideki Eifuku

IPC: H05K3/34

CPC classification number: H05K3/341 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75272 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83862 ,  H01L2224/92143 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53174 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an electronic component mounting method including the steps of: placing an electronic component having a primary surface on which a first electrode is formed, on a circuit member having a primary surface on which a second electrode corresponding to the first electrode is formed, with solder and a bonding material including a thermosetting resin interposed between the first and second electrodes; subjecting the thermosetting resin to a first heating at a temperature lower than the melting point of the solder and thus causing the resin to cure, while pressing the electronic component against the circuit member, and then releasing pressure applied for the pressing; and subjecting the solder interposed between the first and second electrodes to a second heating with the pressure released, and thus melting the solder to electrically connect the first and second electrodes.

Abstract translation: 提供一种电子部件安装方法，包括以下步骤：将具有形成有第一电极的主表面的电子部件放置在具有与形成有第一电极的第二电极相对应的主表面的电路部件上， 焊料和包含置于第一和第二电极之间的热固性树脂的接合材料; 在低于焊料的熔点的温度下对热固性树脂进行第一次加热，从而使树脂固化，同时将电子部件压靠在电路部件上，然后释放施加的压力; 并且将放置在第一和第二电极之间的焊料进行第二加热，释放压力，从而使焊料熔化以电连接第一和第二电极。

公开(公告)号：US20120312863A1

公开(公告)日：2012-12-13

申请号：US13561460

申请日：2012-07-30

Applicant: Kuniaki Sueoka

Inventor： Kuniaki Sueoka

IPC: B23K31/12

CPC classification number: B23K3/0471 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/755 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00

Abstract: An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (μm) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 μm and 125 μm.

Abstract translation: 一种装置包括：工具头，其构造成用于在具有约50微米（μm）或更小的厚度的硅芯片与衬底之间建立100个或更多个电气和机械连接，其中设置在多个触点上的100个或更多个焊料凸块 在硅芯片上或多个基板上的触点通过在硅芯片的多个触点和基板之间的加热而熔化，并且其中熔融的焊料凸起通过冷却使得从硅芯片周围流动的空气的强制对流而固化 。 工具头包括被配置为直接与硅芯片接触并且具有在约75μm和125μm之间的厚度的热解石墨片。

公开(公告)号：US08286853B2

公开(公告)日：2012-10-16

申请号：US13275843

申请日：2011-10-18

Applicant: Naoki Akiyama ,  Masahiko Sugiyama ,  Michikazu Nakamura

Inventor： Naoki Akiyama ,  Masahiko Sugiyama ,  Michikazu Nakamura

IPC: B23K31/02 ,  B23K37/04

CPC classification number: H01L24/81 ,  H01L21/67092 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13117 ,  H01L2224/16145 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7526 ,  H01L2224/75283 ,  H01L2224/75303 ,  H01L2224/75312 ,  H01L2224/75314 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/75901 ,  H01L2224/75985 ,  H01L2224/81001 ,  H01L2224/81204 ,  H01L2224/8122 ,  H01L2225/06513 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01032

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract translation: 接合装置包括一体地结合在一起的热处理单元和接合单元。 热处理单元包括用于支撑和热处理叠加的基板的第一热处理板。 接合单元包括用于支撑和热处理在热处理单元中处理的叠加基板的第二热处理板，以及用于将叠置的基板压靠在第二热处理板上的按压机构。 第一热处理板包括用于冷却放置在第一加热板上的重叠基板的冷却机构。 每个单元可以将内部气氛减压到一定的真空度。 热处理单元具有用于在两个单元之间输送晶片的多个承载机构。

公开(公告)号：US20120091187A1

公开(公告)日：2012-04-19

申请号：US13275843

申请日：2011-10-18

Applicant: Naoki AKIYAMA ,  Masahiko SUGIYAMA ,  Michikazu NAKAMURA

Inventor： Naoki AKIYAMA ,  Masahiko SUGIYAMA ,  Michikazu NAKAMURA

IPC: B23K31/02 ,  B23K37/04

CPC classification number: H01L24/81 ,  H01L21/67092 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13117 ,  H01L2224/16145 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7526 ,  H01L2224/75283 ,  H01L2224/75303 ,  H01L2224/75312 ,  H01L2224/75314 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/75901 ,  H01L2224/75985 ,  H01L2224/81001 ,  H01L2224/81204 ,  H01L2224/8122 ,  H01L2225/06513 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01032

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract translation: 接合装置包括一体地结合在一起的热处理单元和接合单元。 热处理单元包括用于支撑和热处理叠加的基板的第一热处理板。 接合单元包括用于支撑和热处理在热处理单元中处理的叠加基板的第二热处理板，以及用于将叠置的基板压靠在第二热处理板上的按压机构。 第一热处理板包括用于冷却放置在第一加热板上的重叠基板的冷却机构。 每个单元可以将内部气氛减压到一定的真空度。 热处理单元具有用于在两个单元之间输送晶片的多个承载机构。

公开(公告)号：US06453537B1

公开(公告)日：2002-09-24

申请号：US09431751

申请日：1999-11-10

Applicant: Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

Inventor： Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

IPC: B23P1902

CPC classification number: H01L24/81 ,  H01L23/3672 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/755 ,  H01L2224/75745 ,  H01L2224/7999 ,  H01L2224/81801 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/225 ,  H05K3/3494 ,  H05K2201/0116 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/0776 ,  H05K2203/081 ,  H05K2203/1121 ,  H05K2203/176 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/4973 ,  Y10T29/49815 ,  Y10T29/49821 ,  Y10T29/53174 ,  H01L2224/0401

Abstract: A method for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.

Abstract translation: 一种在返工过程中冷却基板上的电气部件的方法。 用液体饱和的多孔导热材料块被定位在待冷却的电气部件上。 在相邻电气部件的返工处理期间，多孔导热块中的液体蒸发，从而将电气部件的温度保持在其回流温度以下。 与多孔导热块热接触的第二导热块以及待冷却的电子部件所附接的基板位于待冷却的电子部件和正在进行返工的电子部件之间。 向多孔导热块提供液体供应，以将待冷却的电子部件的温度保持在预定水平一段指定的时间。

公开(公告)号：US5086337A

公开(公告)日：1992-02-04

申请号：US243796

申请日：1988-09-13

Applicant: Takanobu Noro ,  Kunio Matsumoto ,  Muneo Oshima ,  Naoya Kanda ,  Suguru Sakaguchi ,  Akira Murata

Inventor： Takanobu Noro ,  Kunio Matsumoto ,  Muneo Oshima ,  Naoya Kanda ,  Suguru Sakaguchi ,  Akira Murata

IPC: H01L21/60 ,  H01L23/433 ,  H01L23/48 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L23/4338 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/72 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75314 ,  H01L2224/755 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85181 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K3/326 ,  Y02P70/613

Abstract: This invention relates to a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate, its production method and an electronic device using the former. The present invention is particularly useful for connecting electrically a plurality of chips, for which an absorption function of the difference of thermal expansion in a horizontal direction and capability of displacement in a vertical direction are requisite, to a substrate. Moreover, the connecting structure of the present invention can simplify the fabrication process, has high reliability and can be applied to high performance electronic appliances and apparatuses such as electronic computers.

Abstract translation: 本发明涉及一种用于将诸如LSI芯片的电子部件电连接到基板的连接结构，其制造方法和使用前者的电子装置。 本发明特别适用于电连接多个芯片，其中水平方向上的热膨胀差异的吸收函数和垂直方向上的位移能力是必需的。 此外，本发明的连接结构可以简化制造工艺，具有高可靠性并且可以应用于诸如电子计算机的高性能电子设备和设备。

公开(公告)号：US09929121B2

公开(公告)日：2018-03-27

申请号：US15228083

申请日：2016-08-04

Applicant: Kulicke and Soffa Industries, Inc.

Inventor： Thomas J. Colosimo, Jr. ,  Daniel P. Buergi ,  Horst Clauberg ,  Matthew B. Wasserman

IPC: B23K31/02 ,  H01L23/00 ,  H01L21/683 ,  B23K1/00

CPC classification number: H01L24/75 ,  B23K1/0016 ,  H01L21/6838 ,  H01L2224/751 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/75803 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/75981 ,  H01L2224/81203 ,  H01L2224/83203

Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.

公开(公告)号：US20170229424A1

公开(公告)日：2017-08-10

申请号：US15514598

申请日：2015-09-21

Applicant: DANFOSS SILICON POWER GMBH

Inventor： Ronald Eisele ,  Holger Ulrich

IPC: H01L23/00 ,  B22F3/14 ,  H05K3/32

CPC classification number: H01L24/83 ,  B22F3/14 ,  B22F2301/10 ,  B22F2301/255 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/7511 ,  H01L2224/7525 ,  H01L2224/75315 ,  H01L2224/755 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83095 ,  H01L2224/83101 ,  H01L2224/83201 ,  H01L2224/83204 ,  H01L2224/8384 ,  H01L2224/83911 ,  H01L2224/83948 ,  H05K3/32 ,  H05K2203/0278 ,  H05K2203/1131 ,  H05K2203/1157 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/00012

Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

公开(公告)号：US20150083786A1

公开(公告)日：2015-03-26

申请号：US14497424

申请日：2014-09-26

Applicant: NIKON CORPORATION

Inventor： Kazuya OKAMOTO ,  Isao SUGAYA ,  Naohiko KURATA ,  Masashi OKADA ,  Hajime MITSUISHI

IPC: H01L23/00 ,  B23K37/04 ,  H01L21/66 ,  H01L21/68

CPC classification number: H01L24/75 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/68 ,  H01L22/12 ,  H01L22/20 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/758 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81047 ,  H01L2224/8109 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/8115 ,  H01L2224/8116 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

Abstract translation: 一种将第一基板和第二基板结合在一起的基板接合装置，包括将第一基板和第二基板连接在一起的接合部分，彼此对准以便堆叠; 检测部，其在由所述接合部接合之前，检测所述第一基板和所述第二基板中的至少一个上的不均匀状态; 以及确定部，其确定由所述检测部检测到的所述不均匀状态是否满足预定条件，其中如果由所述确定部确定所述接合部不接合所述第一基板和所述第二基板，所述不均匀状态不满足 预定条件。