公开(公告)号：US5862588A

公开(公告)日：1999-01-26

申请号：US514703

申请日：1995-08-14

Applicant: Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

Inventor： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC: B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

Abstract: A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

Abstract translation: 一种制造互连结构和电路板的方法，包括将布置在背板上的基板上的相应金属触点上具有连接凸块的区域阵列部件放置在一起，提供与凸块和触点相连通的热固化连接材料，直接接触气体喷嘴 到围绕组件的基板的一部分，以将衬底压在喷嘴和背板之间，以限制衬底的包裹，加热组件，接合材料和接近金属触点的衬底，同时将喷嘴保持在衬底上以固化 接合材料，并冷却组件，接合材料和基底。 选择的部件也可以利用气体喷嘴进行更换，以限制基材的包装。

公开(公告)号：US6059170A

公开(公告)日：2000-05-09

申请号：US104572

申请日：1998-06-24

Applicant: Lisa J. Jimarez ,  Craig G. Heim

Inventor： Lisa J. Jimarez ,  Craig G. Heim

IPC: B23K1/018 ,  H01L21/60 ,  H05K3/34 ,  B23K31/00 ,  B23K1/00

CPC classification number: H01L24/81 ,  B23K1/018 ,  H01L24/75 ,  H05K3/3494 ,  B23K2201/40 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K2201/10371 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/304 ,  H05K3/3436

Abstract: Method and apparatus removing a component having a solder ball grid array to a circuitized substrate. The solder balls have a first temperature at which they melt. The component has a second temperature, greater than the first temperature, over which the component is damaged. The method has a step of placing a thermal shield over the component. In a next step, the circuitized substrate and the component having the solder ball grid array are heated to a third temperature lower than the first temperature. In a next step, a stream of hot gas of a fourth temperature is directed for a predetermined time about the periphery of the thermal shield such that the solder balls reach the first temperature thereby reflowing the solder joints or balls, while other parts of the component reach less than the second temperature. At this point, the component is either attached to the circuitized substrate or permitted to be removed therefrom. Similar methods are also provided for attaching a component having a solder ball grid array from a circuitized substrate.

Abstract translation: 将具有焊球栅格阵列的部件移除到电路化基板的方法和装置。 焊球具有熔化的第一温度。 组件具有大于第一温度的第二温度，组件被损坏。 该方法具有将热屏蔽件放置在部件上的步骤。 在下一步骤中，电路化基板和具有焊球栅格阵列的部件被加热到低于第一温度的第三温度。 在下一步骤中，将第四温度的热气流围绕热屏蔽的周边定向预定时间，使得焊球达到第一温度，从而回流焊接点或球，而组件的其它部分 达到小于第二温度。 在这一点上，组件或者附接到电路化的衬底或被允许从其移除。 还提供了类似的方法用于从电路化的衬底附接具有焊球栅格阵列的部件。

公开(公告)号：US06453537B1

公开(公告)日：2002-09-24

申请号：US09431751

申请日：1999-11-10

Applicant: Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

Inventor： Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

IPC: B23P1902

CPC classification number: H01L24/81 ,  H01L23/3672 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/755 ,  H01L2224/75745 ,  H01L2224/7999 ,  H01L2224/81801 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/225 ,  H05K3/3494 ,  H05K2201/0116 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/0776 ,  H05K2203/081 ,  H05K2203/1121 ,  H05K2203/176 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/4973 ,  Y10T29/49815 ,  Y10T29/49821 ,  Y10T29/53174 ,  H01L2224/0401

Abstract: A method for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.

Abstract translation: 一种在返工过程中冷却基板上的电气部件的方法。 用液体饱和的多孔导热材料块被定位在待冷却的电气部件上。 在相邻电气部件的返工处理期间，多孔导热块中的液体蒸发，从而将电气部件的温度保持在其回流温度以下。 与多孔导热块热接触的第二导热块以及待冷却的电子部件所附接的基板位于待冷却的电子部件和正在进行返工的电子部件之间。 向多孔导热块提供液体供应，以将待冷却的电子部件的温度保持在预定水平一段指定的时间。

公开(公告)号：US6068175A

公开(公告)日：2000-05-30

申请号：US162739

申请日：1998-09-29

Applicant: Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

Inventor： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC: B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  B23K37/02 ,  B23K1/00 ,  B23K5/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract translation: 用于使用接合材料将第一区域阵列部件连接到基板的装置。 该装置具有将第一区域阵列部件和第一区域阵列部件下方的基板部分朝着第二区域阵列部件的两个热导向的喷嘴，以熔化接合材料。 弹性密封件接触基板并防止热量影响与第一区域阵列部件相邻的其他部件。 喷嘴被压靠在基板上以抑制基板的翘曲，这可能是由第一区域阵列部件的加热引起的，并且防止损坏基板。 喷嘴可以倾斜使其符合基板的表面。 允许第一区域阵列部件在加热期间在熔融接合材料的表面张力下在基板的平面方向上自由移动以使第一区域阵列部件居中。

公开(公告)号：US06179196B2

公开(公告)日：2001-01-30

申请号：US09499863

申请日：2000-02-07

Applicant: Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

Inventor： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC: B23K100

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  B23K2101/40 ,  B23K2101/42 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H01L2224/16225 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265 ,  C08L2666/04 ,  C08L23/00

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract translation: 用于使用接合材料将第一区域阵列部件连接到基板的装置。 该装置具有将第一区域阵列部件和第一区域阵列部件下方的基板部分朝着第二区域阵列部件的两个热导向的喷嘴，以熔化接合材料。 弹性密封件接触基板并防止热量影响与第一区域阵列部件相邻的其他部件。 喷嘴被压靠在基板上以抑制基板的翘曲，这可能是由第一区域阵列部件的加热引起的，并且防止损坏基板。 喷嘴可以倾斜使其符合基板的表面。 允许第一区域阵列部件在加热期间在熔融接合材料的表面张力下在基板的平面方向上自由移动以使第一区域阵列部件居中。

公开(公告)号：US6034875A

公开(公告)日：2000-03-07

申请号：US98977

申请日：1998-06-17

Applicant: Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

Inventor： Craig G. Heim ,  Wade Leslie Hooker ,  Ajit Kumar Trivedi

IPC: H01L21/60 ,  H01L23/367 ,  H05K3/22 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L24/81 ,  H01L23/3672 ,  H01L24/75 ,  H05K3/3494 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/755 ,  H01L2224/75745 ,  H01L2224/7999 ,  H01L2224/81801 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0116 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/0776 ,  H05K2203/081 ,  H05K2203/1121 ,  H05K2203/176 ,  H05K2203/304 ,  H05K3/225 ,  Y10T29/4913 ,  Y10T29/4973 ,  Y10T29/49815 ,  Y10T29/49821 ,  Y10T29/53174

Abstract: A method and apparatus for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.

Abstract translation: 一种用于在返工过程中冷却基板上的电气部件的方法和设备。 用液体饱和的多孔导热材料块被定位在待冷却的电气部件上。 在相邻电气部件的返工处理期间，多孔导热块中的液体蒸发，从而将电气部件的温度保持在其回流温度以下。 与多孔导热块热接触的第二导热块以及待冷却的电子部件所附接的基板位于待冷却的电子部件和正在进行返工的电子部件之间。 向多孔导热块提供液体供应，以将待冷却的电子部件的温度保持在预定水平一段指定的时间。