公开(公告)号：US20160365267A1

公开(公告)日：2016-12-15

申请号：US15247947

申请日：2016-08-26

Applicant: SHINKAWA LTD.

Inventor： OSAMU KAKUTANI ,  TAITO KOBAYASHI ,  YASUSHI SATO

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67703 ,  H01L21/67721 ,  H01L21/68785 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.

Abstract translation: 一种接合装置，包括：中间台; 传送单元，被配置为传送半导体芯片并将半导体芯片放置在中间台上; 以及第一接合单元和第二接合单元，每个配置用于从中间层拾取半导体芯片，并将半导体芯片接合到电路基板。 中间台在第一位置和第二位置之间移动。 第一位置是允许第一接合单元拾取半导体芯片的位置，第二位置是允许第二接合单元拾取半导体芯片的位置。 由此，能够提供能够减少每个电路基板的处理时间并抑制空间增加的接合装置，以及这种接合方法。

公开(公告)号：US20170053889A1

公开(公告)日：2017-02-23

申请号：US15255111

申请日：2016-09-01

Applicant: SHINKAWA LTD.

Inventor： OSAMU KAKUTANI ,  HIDEHIRO TAZAWA ,  MASAHITO TUJI

IPC: H01L23/00

CPC classification number: H01L24/741 ,  H01L24/75 ,  H01L2224/75651 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75804 ,  H01L2224/75841

Abstract: Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.

Abstract translation: 提供了一种接合装置，其包括相对于基座（41）沿Y轴方向可移动地设置的工作台（52），第一反作用部件（58A）和第二反作用部件（58B）。 第一反作用构件和第二反作用构件被构造成当工作台沿Y轴方向移动时沿与Y工作台相反的方向移动。 从X轴方向观察，第一反应构件和第二反应构件分别设置在工作台的两侧，工作台位于第一和第二反应构件之间，使得第一和第二反应的重心 构件基于桌子的重心定位。 因此，接合装置能够抑制空间的增加，能够提高基座上的重量平衡。

公开(公告)号：US20150333032A1

公开(公告)日：2015-11-19

申请号：US14731431

申请日：2015-06-05

Applicant: SHINKAWA LTD.

Inventor： OSAMU KAKUTANI ,  TAKATOSHI KAWAMURA ,  KOHEI SEYAMA ,  AKIRA SATO

IPC: H01L23/00 ,  B29C65/18 ,  B32B37/08 ,  B32B37/06 ,  B29C65/44

CPC classification number: H01L24/75 ,  B29C65/18 ,  B29C65/44 ,  B29K2701/10 ,  B29L2031/3406 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2307/202 ,  B32B2457/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/75744 ,  H01L2224/75802 ,  H01L2224/75803 ,  H01L2224/75824 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/00012

Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.

Abstract translation: 一种焊接工具冷却装置（10），设置在包括框架（12）的接合台附近; 包括接地板（14）的冷却构件（16），所述接地板（14）具有接地工具（61）的前边缘表面接地的接地表面（14a），和散热片（15） 所述接地板（14）到达所述地面（14a），其中所述冷却构件（16）通过支撑机构（200）支撑在所述框架（12）上，使得所述冷却构件（16）能够围绕两个轴线旋转， 即沿着地面（14a）延伸的X轴和沿地面（14a）延伸的Y轴。 粘合工具的冷却时间可以降低。