公开(公告)号：US20160365267A1

公开(公告)日：2016-12-15

申请号：US15247947

申请日：2016-08-26

Applicant: SHINKAWA LTD.

Inventor： OSAMU KAKUTANI ,  TAITO KOBAYASHI ,  YASUSHI SATO

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67703 ,  H01L21/67721 ,  H01L21/68785 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.

Abstract translation: 一种接合装置，包括：中间台; 传送单元，被配置为传送半导体芯片并将半导体芯片放置在中间台上; 以及第一接合单元和第二接合单元，每个配置用于从中间层拾取半导体芯片，并将半导体芯片接合到电路基板。 中间台在第一位置和第二位置之间移动。 第一位置是允许第一接合单元拾取半导体芯片的位置，第二位置是允许第二接合单元拾取半导体芯片的位置。 由此，能够提供能够减少每个电路基板的处理时间并抑制空间增加的接合装置，以及这种接合方法。