-
公开(公告)号：US09744613B2
公开(公告)日：2017-08-29
申请号：US15033258
申请日：2014-06-13
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama , Yuta Saito
IPC: B23K3/00 , B23K37/00 , B23K3/08 , B23K1/00 , B23K1/008 , B23K1/20 , B23K3/06 , B23K35/362 , B01D47/06 , B01D47/16 , B01D53/26 , B23K101/42
CPC classification number: B23K3/08 , B01D47/06 , B01D47/16 , B01D53/265 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/0638 , B23K3/0653 , B23K35/362 , B23K2101/42
Abstract: A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.
-
公开(公告)号：US11235407B2
公开(公告)日：2022-02-01
申请号：US16788738
申请日：2020-02-12
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama
Abstract: Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.
-
公开(公告)号：US10293439B2
公开(公告)日：2019-05-21
申请号：US15576293
申请日：2016-02-17
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Takashi Sugihara , Hiroshi Taguchi , Tsutomu Hiyama
Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.
-
公开(公告)号：US10252364B2
公开(公告)日：2019-04-09
申请号：US14906660
申请日：2013-07-23
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuke Kimoto
Abstract: A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber (40) in which a work (1) is solderable under vacuum environment, an operation part (21) that inputs and sets vacuum pressure in the chamber (40), a pump (23) that performs vacuum drawing on the interior of the chamber (40), a pressure sensor (24) that detects pressure in the chamber (40), and a control portion (61) that adjusts the set vacuum pressure in the chamber (40) based on a pressure detection signal (S24) output from the pressure sensor (24), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG. 4.
-
公开(公告)号：US11007591B2
公开(公告)日：2021-05-18
申请号：US16618903
申请日：2018-05-08
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Koichiro Hosokawa , Tsutomu Hiyama
Abstract: A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.
-
Patent Agency Ranking
公开(公告)号：US10792607B2
公开(公告)日：2020-10-06
申请号：US16807390
申请日：2020-03-03
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama
Abstract: To provide a flux recovery device which can remove a flux in a pipe and a method for removing a flux. A flux recovery device 200 according to the present invention recovers a flux from a gaseous mixture containing a flux component, the flux recovery device 200 including: a separation unit 400 configured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux; a pipe 500 including a second connection port 540, an inclined portion 580, and a first connection port 520, the water containing the flux flowing into the pipe 500 from the second connection port 540, the inclined portion 580 being positioned on a downstream side of the second connection port 540, and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection port 520 being positioned on an upstream side of the inclined portion 580; and a pump 220 configured to supply water from the first connection port 520.
-
公开(公告)号：US20180141168A1
公开(公告)日：2018-05-24
申请号：US15576293
申请日：2016-02-17
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Takashi Sugihara , Hiroshi Taguchi , Tsutomu Hiyama
CPC classification number: B23K37/0408 , B23K1/00 , B23K1/008 , B23K3/00 , H05K3/34
Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.
-
公开(公告)号：US20160279726A1
公开(公告)日：2016-09-29
申请号：US15033258
申请日：2014-06-13
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Yuta Saito
CPC classification number: B23K3/08 , B01D47/06 , B01D47/16 , B01D53/265 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/0638 , B23K3/0653 , B23K35/362 , B23K2101/42
Abstract: A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.
Abstract translation: 从气体混合物中回收助焊剂组分的助焊剂回收装置。 助熔剂回收装置包括第一喷水单元，其将水喷入含有助熔剂组分的气态混合物中;分离单元，其包括用于引入从第一喷水单元喷射水的气体混合物的引入口， 在分离单元内形成沉淀流的喷水单元。 分离单元使用旋流将气体混合物中的助熔剂组分分离。 冷凝单元冷却在分离单元中产生的水蒸气以将水蒸汽变为水滴，从而除去水蒸气。 在分离单元中产生的水蒸气由冷凝单元冷却，以水滴的形式回收并重新使用。
-
公开(公告)号：US20160256946A1
公开(公告)日：2016-09-08
申请号：US14906660
申请日：2013-07-23
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuk Kimoto
CPC classification number: B23K1/008 , H05K3/3494 , H05K2203/085 , H05K2203/163
Abstract: A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber (40) in which a work (1) is solderable under vacuum environment, an operation part (21) that inputs and sets vacuum pressure in the chamber (40), a pump (23) that performs vacuum drawing on the interior of the chamber (40), a pressure sensor (24) that detects pressure in the chamber (40), and a control portion (61) that adjusts the set vacuum pressure in the chamber (40) based on a pressure detection signal (S24) output from the pressure sensor (24), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG. 4.
Abstract translation: 一种焊接设备，其可以将室内部保持在特定的真空压力并且可以在真空压力被最佳地调节的情况下在腔室中进行焊接，其中工件（1）可焊接在其中 在真空环境下，在所述室（40）中输入和设定真空压力的操作部（21），在所述室（40）的内部进行抽真空的泵（23），检测 基于从压力传感器（24）输出的压力检测信号（S24），调节室（40）中的设定真空压力的控制部（61），并保持设定真空 压力达预定时间段，如图1所示。 4。
-
公开(公告)号：US11819952B2
公开(公告)日：2023-11-21
申请号：US17328197
申请日：2021-05-24
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Nobuhiro Kojima
IPC: B23K3/08 , B23K3/04 , G01M3/30 , B23K101/42
CPC classification number: B23K3/08 , B23K3/04 , G01M3/30 , B23K2101/42
Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
-
-
-
-
-
-
-
-
-
Search Results
19
records
(took 0.033 seconds)
