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公开(公告)号：US20160256946A1
公开(公告)日：2016-09-08
申请号：US14906660
申请日：2013-07-23
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuk Kimoto
CPC classification number: B23K1/008 , H05K3/3494 , H05K2203/085 , H05K2203/163
Abstract: A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber (40) in which a work (1) is solderable under vacuum environment, an operation part (21) that inputs and sets vacuum pressure in the chamber (40), a pump (23) that performs vacuum drawing on the interior of the chamber (40), a pressure sensor (24) that detects pressure in the chamber (40), and a control portion (61) that adjusts the set vacuum pressure in the chamber (40) based on a pressure detection signal (S24) output from the pressure sensor (24), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG. 4.
Abstract translation: 一种焊接设备，其可以将室内部保持在特定的真空压力并且可以在真空压力被最佳地调节的情况下在腔室中进行焊接，其中工件（1）可焊接在其中 在真空环境下，在所述室（40）中输入和设定真空压力的操作部（21），在所述室（40）的内部进行抽真空的泵（23），检测 基于从压力传感器（24）输出的压力检测信号（S24），调节室（40）中的设定真空压力的控制部（61），并保持设定真空 压力达预定时间段，如图1所示。 4。
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Patent Agency Ranking
公开(公告)号：US09676048B2
公开(公告)日：2017-06-13
申请号：US15108039
申请日：2013-12-25
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuke Kimoto , Tomotake Kagaya
IPC: B23K37/00 , B23K3/08 , B23K1/00 , B23K1/008 , B23K1/20 , H05K3/34 , F04D27/02 , F04D19/04 , B23K101/42
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K2101/42 , F04D19/04 , F04D27/0261 , H05K3/3494 , H05K2203/043 , H05K2203/085 , H05K2203/1178
Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients θ plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient θ in the evacuation control property.
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公开(公告)号：US20160339531A1
公开(公告)日：2016-11-24
申请号：US15108039
申请日：2013-12-25
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuke Kimoto , Tomotake Kagaya
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K2101/42 , F04D19/04 , F04D27/0261 , H05K3/3494 , H05K2203/043 , H05K2203/085 , H05K2203/1178
Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients θ plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient θ in the evacuation control property.
Abstract translation: 在真空焊接装置及其控制方法中，为了防止当通过将室抽真空至目标真空度来使空隙脱泡和/或从熔融焊料脱气时的焊剂散射或焊料散射，以便能够 执行简单的疏散，执行泵的评估控制。 执行泵的评价控制，其中，具有梯度θ的多个抽真空控制特性（＃1至＃4）绘制真空度（压力P）相对于抽空时间（时间t）时的排气时间（时间t） 预先确定的泵输出; 根据撤离控制特性中的初始设定的梯度θ，将控制从小泵输出的抽空控制特性改变为大泵输出的排气控制特性。
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公开(公告)号：US10894294B2
公开(公告)日：2021-01-19
申请号：US16767873
申请日：2018-11-27
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Ryoichi Suzuki , Yasuji Kawashima , Shigeo Komine , Takashi Sugihara , Hiroyuki Inoue
Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
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公开(公告)号：US20200290143A1
公开(公告)日：2020-09-17
申请号：US16767873
申请日：2018-11-27
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Ryoichi Suzuki , Yasuji Kawashima , Shigeo Komine , Takashi Sugihara , Hiroyuki Inoue
Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
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公开(公告)号：US10252364B2
公开(公告)日：2019-04-09
申请号：US14906660
申请日：2013-07-23
Applicant: Senju Metal Industry Co., Ltd.
Inventor： Tsutomu Hiyama , Hiroyuki Inoue , Shunsuke Kimoto
Abstract: A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber (40) in which a work (1) is solderable under vacuum environment, an operation part (21) that inputs and sets vacuum pressure in the chamber (40), a pump (23) that performs vacuum drawing on the interior of the chamber (40), a pressure sensor (24) that detects pressure in the chamber (40), and a control portion (61) that adjusts the set vacuum pressure in the chamber (40) based on a pressure detection signal (S24) output from the pressure sensor (24), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG. 4.
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