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公开(公告)号：US09828239B2
公开(公告)日：2017-11-28
申请号：US14845926
申请日：2015-09-04
发明人： Heikki Kuisma , Sami Nurmi
IPC分类号： H01L23/528 , B81B7/00 , H01L25/16 , H01L25/18 , B81C1/00 , H01L23/00 , G01P1/02 , H01L23/538 , G01L19/14 , G01P15/08 , G01C19/5783 , H01L25/00 , H01L21/56 , H01L27/146 , G01L19/00
CPC分类号： B81B7/0074 , B81B2201/0235 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/036 , B81B2207/012 , B81B2207/095 , B81C1/00333 , G01C19/5783 , G01L19/0084 , G01L19/148 , G01P1/023 , G01P1/026 , G01P15/0802 , H01L21/568 , H01L23/528 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/14618 , H01L2223/6677 , H01L2224/12105 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/8312 , H01L2224/8319 , H01L2224/92125 , H01L2224/97 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.
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公开(公告)号：US09647171B2
公开(公告)日：2017-05-09
申请号：US14479100
申请日：2014-09-05
发明人： John A. Rogers , Ralph Nuzzo , Hoon-sik Kim , Eric Brueckner , Sang Il Park , Rak Hwan Kim
IPC分类号： H01L33/50 , H01L33/00 , H01L25/075 , H01L23/00 , H01L21/683 , H01L25/00 , H01L33/48 , H01L33/54 , H01L33/62
CPC分类号： H01L25/0753 , H01L21/6835 , H01L24/83 , H01L24/95 , H01L25/50 , H01L33/0079 , H01L33/32 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68386 , H01L2224/8312 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2924/01322 , H01L2924/05432 , H01L2924/06 , H01L2924/12033 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/2064 , H01L2924/20641 , H01L2933/0041 , H01L2933/005 , Y10S438/977 , H01L2924/00
摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
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公开(公告)号：US20160276310A1
公开(公告)日：2016-09-22
申请号：US14660949
申请日：2015-03-18
发明人： Ranjan RAJOO , Kai Chong CHAN
IPC分类号： H01L25/065 , H01L21/768 , H01L23/48 , H01L25/00 , H01L21/304
CPC分类号： H01L25/0657 , H01L21/304 , H01L21/76898 , H01L24/08 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/08145 , H01L2224/32145 , H01L2224/33181 , H01L2224/73251 , H01L2224/80203 , H01L2224/8312 , H01L2224/83203 , H01L2224/83801 , H01L2224/83805 , H01L2224/83862 , H01L2224/83874 , H01L2224/8389 , H01L2224/92 , H01L2224/9202 , H01L2224/9222 , H01L2224/92242 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2924/10156 , H01L2924/1461 , H01L2924/00014 , H01L2224/80 , H01L2224/83 , H01L2224/08 , H01L2224/32 , H01L2224/0231 , H01L2224/03 , H01L2224/11
摘要： Semiconductor devices and methods of forming a semiconductor device are disclosed. The device includes a wafer with top and bottom surfaces. The wafer includes edge and non-edge regions. The wafer includes a plurality of devices and partially processed TSV contacts disposed in the non-edge region and a groove disposed at the edge region. The groove enables edges of the wafer to be automatically trimmed off as the wafer is subject to a back-grinding planarization process to expose the TSV contacts in the non-edge region of the wafer.
摘要翻译： 公开了形成半导体器件的半导体器件和方法。 该装置包括具有顶表面和底表面的晶片。 晶片包括边缘和非边缘区域。 晶片包括设置在非边缘区域中的多个器件和部分处理的TSV触点和设置在边缘区域处的凹槽。 当晶片进行背面磨削平坦化处理以暴露晶片的非边缘区域中的TSV触点时，该凹槽使晶片的边缘自动修整。
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4.发明申请METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE 审中-公开制造系统级封装设备的方法和系统级封装设备公开(公告)号：US20150375996A1
公开(公告)日：2015-12-31
申请号：US14845926
申请日：2015-09-04
发明人： Heikki KUISMA
IPC分类号： B81B7/00
CPC分类号： B81B7/0074 , B81B2201/0235 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/036 , B81B2207/012 , B81B2207/095 , B81C1/00333 , G01C19/5783 , G01L19/0084 , G01L19/148 , G01P1/023 , G01P1/026 , G01P15/0802 , H01L21/568 , H01L23/528 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/14618 , H01L2223/6677 , H01L2224/12105 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/8312 , H01L2224/8319 , H01L2224/92125 , H01L2224/97 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.
摘要翻译： 公开了一种制造系统级封装器件的方法，以及一种系统级封装器件。 在该方法中，具有预定尺寸的至少一个第一种类模具，具有预定尺寸的至少一种第二种类模具，并且系统级装置中的至少一个其它部件包括在系统级封装装置中。 选择第一和第二种类模具中的至少一种用于重新定向，并且将材料添加到所选择的模具的至少一侧，使得添加的材料和所选择的模具形成重新定型的模具结构。 在重新定型的模具结构上形成连接层。 尺寸设计为重新定型的模具结构，以允许非选择的模具和至少一个另外的部件通过连接层与重新定向的模具结构接触。
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公开(公告)号：US20150270241A1
公开(公告)日：2015-09-24
申请号：US14667490
申请日：2015-03-24
CPC分类号： H01L24/81 , B23K1/0004 , B23K1/0016 , B23K3/047 , B23K3/0623 , B23K2101/42 , H01L23/4824 , H01L23/49844 , H01L23/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/13012 , H01L2224/13013 , H01L2224/13111 , H01L2224/13116 , H01L2224/1312 , H01L2224/16227 , H01L2224/29012 , H01L2224/29013 , H01L2224/29111 , H01L2224/29116 , H01L2224/2912 , H01L2224/32227 , H01L2224/8112 , H01L2224/81234 , H01L2224/81447 , H01L2224/81815 , H01L2224/8312 , H01L2224/83234 , H01L2224/83447 , H01L2224/83815 , H01L2924/1306 , H01L2924/1461 , H05K1/0265 , H05K2201/09672 , H05K2201/10166 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
摘要： A method and system for electrically connect a semiconductor device with a flip-chip form factor to a printed circuit board. An exemplary embodiment of the method comprises: aligning solder contacts on the device with a first copper contact and a second copper contact of the external circuitry, and, applying a supply current only directly to a buried layer of the first copper and not directly to the layer which is nearest the device, such that no current is sourced to the device through the layer nearest the device.
摘要翻译： 一种用于将半导体器件与倒装芯片形状电连接到印刷电路板的方法和系统。 该方法的示例性实施例包括：将器件上的焊接触点与外部电路的第一铜触点和第二铜触点对准，并且仅将电源电流直接施加到第一铜的掩埋层，而不是直接连接到 层，其最接近设备，使得没有电流通过最靠近设备的层来源到设备。
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6.发明申请Printed Assemblies of Ultrathin, Microscale Inorganic Light Emitting Diodes for Deformable and Semitransparent Displays 有权超薄型显微组件，微型无机发光二极管，可变形和半透明显示公开(公告)号：US20100317132A1
公开(公告)日：2010-12-16
申请号：US12778588
申请日：2010-05-12
申请人： John A. Rogers , Ralph Nuzzo , Hoon-sik Kim , Eric Brueckner , Sang Il Park , Rak Hwan Kim
发明人： John A. Rogers , Ralph Nuzzo , Hoon-sik Kim , Eric Brueckner , Sang Il Park , Rak Hwan Kim
CPC分类号： H01L25/0753 , H01L21/6835 , H01L24/83 , H01L24/95 , H01L25/50 , H01L33/0079 , H01L33/32 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68386 , H01L2224/8312 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2924/01322 , H01L2924/05432 , H01L2924/06 , H01L2924/12033 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/2064 , H01L2924/20641 , H01L2933/0041 , H01L2933/005 , Y10S438/977 , H01L2924/00
摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
摘要翻译： 这里描述了用于制造，组装和布置电子设备的可打印结构和方法。 本文描述的许多方法对于组装电子器件是有用的，其中一个或多个器件部件被嵌入在嵌入过程中被图案化的聚合物中，其中沟槽用于器件部件之间的电互连。 本文描述的一些方法可用于通过印刷方法组装电子装置，例如通过干式转印接触印刷方法。 本文还描述了GaN发光二极管以及用于制造和布置GaN发光二极管的方法，例如用于显示器或照明系统。
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公开(公告)号：US20080224279A1
公开(公告)日：2008-09-18
申请号：US12046651
申请日：2008-03-12
申请人： Terrence Caskey , Lawrence Douglas Andrews , Scott McGrath , Simon J.S. McElrea , Yong Du , Mark Scott
发明人： Terrence Caskey , Lawrence Douglas Andrews , Scott McGrath , Simon J.S. McElrea , Yong Du , Mark Scott
IPC分类号： H01L23/495 , H01L23/488 , H01L21/60
CPC分类号： H01L23/49811 , H01L24/01 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/80 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32014 , H01L2224/45014 , H01L2224/48229 , H01L2224/731 , H01L2224/8312 , H01L2224/83191 , H01L2224/838 , H01L2225/06551 , H01L2225/06575 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45015 , H01L2924/207
摘要： A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.
摘要翻译： 模具组件包括安装到支撑件的模具，其中支撑件具有形成在接合焊盘处的互连基座，并且模具具有突出超过模具边缘的相互连接端子到相应的基座。 另外，支架具有互连基座。 此外，用于将管芯电连接到支撑件的方法包括提供支撑件，其具有形成在支撑件的管芯安装表面上的接合焊盘处的互连基座，提供具有突出超过模具边缘的互连端子的管芯，将管芯相对于 所述支撑件使得端子与相应的基座对准，并且使模具和支撑件朝向彼此移动，使得端子与相应的基座接触。
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8.发明授权公开(公告)号：US11735689B2
公开(公告)日：2023-08-22
申请号：US17751090
申请日：2022-05-23
发明人： Daniel Brodoceanu , Oscar Torrents Abad , Jeb Wu , Zheng Sung Chio , Sharon Nannette Farrens , Ali Sengul , Tennyson Nguty
CPC分类号： H01L33/0095 , H01L24/75 , H01L24/83 , H01L25/0753 , H01L33/52 , H01L33/62 , G02B27/0172 , G02B2027/0178 , H01L2224/757 , H01L2224/7555 , H01L2224/75253 , H01L2224/75261 , H01L2224/75263 , H01L2224/75702 , H01L2224/8312 , H01L2224/83031 , H01L2224/83092 , H01L2224/83099 , H01L2224/83224 , H01L2224/83444 , H01L2224/83859 , H01L2224/83895 , H01L2224/83896 , H01L2924/12041 , H01L2933/005 , H01L2933/0033 , H01L2933/0066
摘要： The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.
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9.发明申请公开(公告)号：US20180159502A1
公开(公告)日：2018-06-07
申请号：US15828616
申请日：2017-12-01
发明人： Atsushi Takano
IPC分类号： H03H9/10 , H03H3/02 , H03H9/17 , H03H9/05 , H01L41/313 , H01L41/337 , H01L41/338 , H01L23/00
CPC分类号： H03H9/1035 , B23K1/0016 , B23K20/16 , B23K26/382 , B23K26/402 , B23K2101/36 , B23K2101/42 , B23K2103/172 , H01L21/187 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L41/313 , H01L41/337 , H01L41/338 , H01L2224/83096 , H01L2224/8312 , H01L2224/83825 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H03H3/02 , H03H9/0523 , H03H9/17 , H03H9/171 , H03H9/173 , H03H9/175 , H03H9/706 , H03H2003/021
摘要： Methods of preventing water from penetrating inside a pair of bonded wafers that are bonded to one another during manufacture of an electronic device. A method is provided for manufacturing an electronic device including a first substrate having a first side wall of a certain height formed along a periphery to surround an electronic circuit disposed on a bottom surface and a second substrate having a second side wall of a certain height formed along a periphery on a top surface, the second side wall being aligned and bonded with the first side wall. The method includes forming the first side wall on a bottom surface of a first wafer as the bottom surface of the first substrate and forming a first sealing portion of a certain height along a periphery; forming the second side wall on a top surface of a second wafer as the top surface of the second substrate and forming a second sealing portion of a certain height along a periphery; and aligning and bonding the first wafer and the second wafer with each other, the first sealing portion and the first side wall being bonded with the second sealing portion and the second side wall respectively by transient liquid phase bonding.
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公开(公告)号：US20180159493A1
公开(公告)日：2018-06-07
申请号：US15828625
申请日：2017-12-01
发明人： Atsushi Takano
CPC分类号： H03H9/1035 , B23K1/0016 , B23K20/16 , B23K26/382 , B23K26/402 , B23K2101/36 , B23K2101/42 , B23K2103/172 , H01L21/187 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L41/313 , H01L41/337 , H01L41/338 , H01L2224/83096 , H01L2224/8312 , H01L2224/83825 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H03H3/02 , H03H9/0523 , H03H9/17 , H03H9/171 , H03H9/173 , H03H9/175 , H03H9/706 , H03H2003/021
摘要： Methods of manufacturing an electronic device formed in a cavity may include providing a first substrate having a first side wall including a first metal formed along a periphery on a bottom surface thereof and surrounding an electronic circuit disposed on the bottom surface, providing a second substrate having a second side wall including a second metal and a third metal formed along a periphery on a top surface thereof, aligning the first substrate with the second substrate with the first side wall opposing and contacting the second side wall to internally define a cavity between the bottom surface of the first substrate, the top surface of the second substrate, the first side wall ,and the second side wall, and heating and bonding the first substrate and the second substrate by transient liquid phase bonding.
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