公开(公告)号：US20180218994A1

公开(公告)日：2018-08-02

申请号：US15926210

申请日：2018-03-20

申请人： DEXERIALS CORPORATION

发明人： Kouichi SATO ,  Yasushi AKUTSU

IPC分类号： H01L23/00 ,  B29C59/02 ,  G02F1/1345 ,  C09J9/02 ,  C09J7/00 ,  B32B33/00 ,  B32B27/38 ,  B32B27/36 ,  B32B27/30 ,  B32B27/20 ,  B32B27/08 ,  B32B7/12 ,  B32B3/30 ,  B32B3/08 ,  B29C71/04 ,  C08K3/08 ,  B29L31/34 ,  B29L9/00 ,  B29C35/08

CPC分类号： H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

摘要： To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US09570429B2

公开(公告)日：2017-02-14

申请号：US14694868

申请日：2015-04-23

申请人： Shanghai Lexvu Opto Microelectronics Technology Co., Ltd.

发明人： Jianhong Mao ,  Fengqin Han ,  Zhiwei Wang ,  Wenfen Chang

IPC分类号： H01L21/00 ,  H01L25/00 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L22/14 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/16147 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/811 ,  H01L2224/83121 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92 ,  H01L2224/92143 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/03 ,  H01L21/56 ,  H01L21/78 ,  H01L21/304

摘要： The present invention provides a method of fabricating a 3D stacked IC SiP which includes: providing a first semiconductor wafer having a plurality of first dies formed thereon, each having a first wire bond pad and a first dielectric layer, at least a portion of the first wire bond pad is not covered by the first dielectric layer and constitutes an exposed area of the first die; providing a plurality of second dies, each having a second wire bond pad and a second dielectric layer, at least a portion of the second wire bond pad is not covered by the second dielectric layer and constitutes an exposed area of the second die different in size from that of the first die; aligning the second dies with the first dies and bonding the second dielectric layer to the first dielectric layer; plating the first semiconductor wafer bonded with the second dies.

摘要翻译： 本发明提供了一种制造3D堆叠IC SiP的方法，其包括：提供第一半导体晶片，其具有形成在其上的多个第一裸片，每个具有第一引线键合焊盘和第一介电层，第一半导体晶片的至少一部分 引线接合焊盘不被第一介电层覆盖并构成第一裸片的暴露区域; 提供多个第二管芯，每个第二管芯具有第二引线接合焊盘和第二介电层，第二引线接合焊盘的至少一部分不被第二介电层覆盖，并且构成尺寸不同的第二裸片的暴露区域 从第一个死亡的; 将所述第二管芯与所述第一管芯对准并且将所述第二介电层接合到所述第一介电层; 电镀与第二模具结合的第一半导体晶片。

公开(公告)号：US20150235874A1

公开(公告)日：2015-08-20

申请号：US14183913

申请日：2014-02-19

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： CHEN-HUA YU ,  CHIH-FAN HUANG ,  CHUN-HUNG LIN ,  MING-DA CHENG ,  CHUNG-SHI LIU ,  MIRNG-JI LII

IPC分类号： H01L21/56 ,  G01N25/16 ,  H01L23/00 ,  H01L21/268 ,  H01L25/00

CPC分类号： H01L22/12 ,  H01L21/268 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L29/7847 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

摘要： A method includes followings operations. A substrate including a first surface and a second surface is provided. The substrate and a transparent film are heated to attach the transparent film on the first surface. A first coefficient of a thermal expansion (CTE) mismatch is between the substrate and the transparent film. The substrate and the transparent film are cooled. A polymeric material is disposed on the second surface. A second CTE mismatch is between the substrate and the polymeric material. The second CTE mismatch is counteracted by the first CTE mismatch.

摘要翻译： 一种方法包括以下操作。 提供了包括第一表面和第二表面的基板。 加热衬底和透明膜以将透明膜附着在第一表面上。 热膨胀（CTE）失配的第一系数在基片和透明薄膜之间。 将基板和透明膜冷却。 聚合材料设置在第二表面上。 第二个CTE不匹配在基材和聚合物材料之间。 第二个CTE不匹配被第一个CTE不匹配所抵消。

公开(公告)号：US20090283210A1

公开(公告)日：2009-11-19

申请号：US11922714

申请日：2006-06-22

申请人： Uwe Augst

发明人： Uwe Augst

IPC分类号： B32B37/12

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/90 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75262 ,  H01L2224/75263 ,  H01L2224/81801 ,  H01L2224/83871 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2224/0401

摘要： The invention relates to a method and an apparatus for permanently joining integrated circuits (1) to at least one substrate (2) arranged therebelow, by means of an adhesive (3) which is arranged therebetween and around the edges of the integrated circuits (1), wherein, in order to cure the adhesive (3), light (19) with a wavelength selected from a wavelength range of 280-900 nm is applied to the upper side and/or underside of the arrangement consisting of the substrate (2) and one of the integrated circuits (1), in order to polymerize the adhesive (3).

摘要翻译： 本发明涉及一种用于通过粘合剂（3）将集成电路（1）永久地连接到布置在其下方的至少一个基板（2）的方法和装置，所述粘合剂（3）布置在其间并且围绕集成电路（1）的边缘 ），其中为了固化粘合剂（3），将波长范围为280-900nm的波长的光（19）施加到由基板（2）组成的布置的上侧和/或下侧 ）和集成电路（1）中的一个，以便使粘合剂（3）聚合。

公开(公告)号：US11735556B2

公开(公告)日：2023-08-22

申请号：US17464098

申请日：2021-09-01

申请人： Mikuni Electron Corporation

发明人： Sakae Tanaka

IPC分类号： H01L23/00 ,  H01R4/02 ,  H01R4/04 ,  H01R43/24 ,  H01R13/405

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01R4/029 ,  H01R4/04 ,  H01R13/405 ,  H01R43/24 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/2782 ,  H01L2224/27334 ,  H01L2224/29499 ,  H01L2224/3011 ,  H01L2224/32227 ,  H01L2224/33106 ,  H01L2224/838 ,  H01L2224/83871 ,  H01L2224/83874

摘要： A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

公开(公告)号：US20170316987A1

公开(公告)日：2017-11-02

申请号：US15648032

申请日：2017-07-12

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： CHEN-HUA YU ,  CHIH-FAN HUANG ,  CHUN-HUNG LIN ,  MING-DA CHENG ,  CHUNG-SHI LIU ,  MIRNG-JI LII

IPC分类号： H01L21/66 ,  H01L21/56 ,  H01L25/00 ,  H01L21/268 ,  H01L23/00 ,  H01L29/78 ,  H01L23/31

CPC分类号： H01L22/12 ,  H01L21/268 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L29/7847 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

摘要： A method includes followings operations. A substrate including a first surface and a second surface is provided. The substrate and a transparent film are heated to attach the transparent film on the first surface. A first coefficient of a thermal expansion (CTE) mismatch is between the substrate and the transparent film. The substrate and the transparent film are cooled. A polymeric material is disposed on the second surface. A second CTE mismatch is between the substrate and the polymeric material. The second CTE mismatch is counteracted by the first CTE mismatch.

公开(公告)号：US20150327388A1

公开(公告)日：2015-11-12

申请号：US14715191

申请日：2015-05-18

申请人： Semprius, Inc.

发明人： Etienne Menard ,  Christopher Bower ,  Matthew Meitl ,  Philip Garrou

IPC分类号： H05K7/06 ,  H05K3/00 ,  H05K3/10

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/81192 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92143 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K3/0058 ,  H05K3/10 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

摘要翻译： 有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。 每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。 有源元件电连接到触点，并且底侧粘附到目标基板。 还讨论了相关的制造方法。

公开(公告)号：US09161448B2

公开(公告)日：2015-10-13

申请号：US13352876

申请日：2012-01-18

申请人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

发明人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

IPC分类号： H01L21/00 ,  H05K1/18 ,  H01L21/683 ,  H01L21/768 ,  H01L23/48 ,  H01L27/12 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/048 ,  H05K13/04 ,  H01L23/544 ,  H01L23/00 ,  H01S5/022

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/7806 ,  H01L23/481 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/799 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L24/98 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/043 ,  H01L31/048 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/9512 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/49124 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

摘要翻译： 打印可转移部件的方法包括在目标基板上按压包括至少一个可转移半导体部件的印模，使得至少一个可转印部件和目标基板的表面接触导电共晶层的相对表面。 在压印目标基板上的印模时，将至少一个可转印部件暴露于电磁辐射，该电磁辐射被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。

公开(公告)号：US20150132873A1

公开(公告)日：2015-05-14

申请号：US14479100

申请日：2014-09-05

申请人： The Board of Trustees of the University of Illinois

发明人： John A. ROGERS ,  Ralph NUZZO ,  Hoon-sik KIM ,  Eric BRUECKNER ,  Sang Il PARK ,  Rak Hwan KIM

IPC分类号： H01L33/00 ,  H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L25/00 ,  H01L33/50 ,  H01L33/48

CPC分类号： H01L25/0753 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/95 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/32 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68386 ,  H01L2224/8312 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2924/01322 ,  H01L2924/05432 ,  H01L2924/06 ,  H01L2924/12033 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10S438/977 ,  H01L2924/00

摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

摘要翻译： 这里描述了用于制造，组装和布置电子设备的可打印结构和方法。 本文描述的许多方法对于组装电子器件是有用的，其中一个或多个器件部件被嵌入在嵌入过程中被图案化的聚合物中，其中沟槽用于器件部件之间的电互连。 本文描述的一些方法可用于通过印刷方法组装电子装置，例如通过干式转印接触印刷方法。 本文还描述了GaN发光二极管以及用于制造和布置GaN发光二极管的方法，例如用于显示器或照明系统。

公开(公告)号：US20110198014A1

公开(公告)日：2011-08-18

申请号：US13097625

申请日：2011-04-29

申请人： Wingkeung MAK ,  Tinhoi Siu ,  Xiaoxi Liu ,  Gamboa Guillen ,  Dianjun Gong ,  Wei Si

发明人： Wingkeung MAK ,  Tinhoi Siu ,  Xiaoxi Liu ,  Gamboa Guillen ,  Dianjun Gong ,  Wei Si

IPC分类号： B32B37/12

CPC分类号： C09J5/00 ,  C09J2205/31 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83121 ,  H01L2224/83234 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/181 ,  H05K3/305 ,  Y02P70/613 ,  H01L2924/00

摘要： The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances.

摘要翻译： 本发明提供一种粘接方法，包括：提供待粘合的第一部件和第二部件和粘合剂; 将粘合剂定位在第一部件和第二部件之间，粘合剂与第一部件和第二部件接触; 提供至少一个聚光器; 并且提供光源并且使光源的至少部分光束依次通过聚光器和第一部件，然后照射到粘合剂上以固化粘合剂，以便粘合第一部件和第二部件。 本发明的粘合方法可以保持待粘合的部件之间的对准精度，从而优化产品的性能。