公开(公告)号：US12126147B2

公开(公告)日：2024-10-22

申请号：US17867398

申请日：2022-07-18

Applicant: Server Technology, Inc.

Inventor： Carrel W. Ewing ,  Andrew J. Cleveland ,  James P. Maskaly

IPC: G06F1/18 ,  H01R25/00 ,  H02B1/015 ,  H02B1/06 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K5/00 ,  H05K5/02 ,  H05K13/00

CPC classification number: H02B1/06 ,  G06F1/189 ,  H01R25/006 ,  H02B1/015 ,  H05K1/0262 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/144 ,  H05K5/0026 ,  H05K5/0247 ,  H05K13/00 ,  H05K2201/042 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

公开(公告)号：US09980025B2

公开(公告)日：2018-05-22

申请号：US15176363

申请日：2016-06-08

Applicant: Peiker Acustic GmbH & Co. KG

Inventor： Michael Klose

IPC: H04R1/04 ,  H01R43/24 ,  H04R31/00 ,  H01R12/58 ,  H01R13/66 ,  H01R13/405

CPC classification number: H04R1/04 ,  H01R12/585 ,  H01R13/405 ,  H01R13/6658 ,  H01R43/24 ,  H04R31/006 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49147

Abstract: The present invention relates to a method for producing a microphone unit, which can be contacted by a plug connector, and a microphone unit, wherein this comprises a housing, a circuit board having a microphone component and contacts, wherein the contacts are embodied on second contact ends as contact pins and wherein the contacts are connected at the first contact ends to the circuit board, wherein a multi-pole plug connector can be connected to the contact pins. The housing is embodied as a one-part injection molded part and the first contact ends are embodied as pressfit contacts.

公开(公告)号：US09699892B2

公开(公告)日：2017-07-04

申请号：US14021103

申请日：2013-09-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Masahiro Ozawa

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/538 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/186 ,  H05K1/188 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4635 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer.

公开(公告)号：US09521744B2

公开(公告)日：2016-12-13

申请号：US14628119

申请日：2015-02-20

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Troy A. Giese ,  James E. Blood ,  Michael J. Lyden ,  Robert M. Mohn

IPC: A61N1/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/32 ,  A61N1/375

CPC classification number: H05K1/0231 ,  A61N1/08 ,  A61N1/086 ,  A61N1/3754 ,  H05K1/115 ,  H05K1/181 ,  H05K3/10 ,  H05K3/32 ,  H05K3/4038 ,  H05K5/0247 ,  H05K5/04 ,  H05K2201/10015 ,  Y10T29/49139

Abstract: A filtered feedthrough assembly for an implantable medical device includes a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and a plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Abstract translation: 用于可植入医疗装置的经滤波的馈通组件包括套圈，通过连接元件耦合到套圈的电绝缘体，延伸穿过电绝缘体的多个馈通导体，印刷电路板（PCB）和多个电容器。 PCB耦合到套圈或电绝缘体，并且包括一个或多个接地层和多个通孔。 连接元件通过通孔电耦合到接地层。 电容器具有通过至少一个通孔电耦合到接地层的接地端子，以及电耦合到馈通导体的导体端子。

公开(公告)号：US09485878B2

公开(公告)日：2016-11-01

申请号：US13956293

申请日：2013-07-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Soo Lee

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K3/4697 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/181 ,  H05K1/185 ,  H05K3/3436 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.

Abstract translation: 本发明涉及具有电子部件的基板结构体和具有电子部件的基板结构体的制造方法，能够通过将第一电子部件的第一端子和第二端子的第二端子 第二电子部件彼此直接接触或通过焊料彼此直接接触，以使电子部件之间的路径最小化。

公开(公告)号：US09386702B2

公开(公告)日：2016-07-05

申请号：US14105900

申请日：2013-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bong Soo Kim

IPC: H05K1/16 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K3/4602 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139

Abstract: An electronic component embedded substrate and a method of manufacturing an electronic component embedded substrate, The substrate includes a first via passing through a part of an insulating portion of the substrate to an electrode of the electronic component, and a second via passing through a part of the insulating portion to the conductor pattern. The second via has a contact portion with a smaller cross-sectional area than the cross-sectional area of a contact portion of the first via.

Abstract translation: 一种电子部件嵌入式基板和电子部件嵌入式基板的制造方法。基板包括将基板的绝缘部的一部分通过电子部件的电极的第一通孔，以及经过部分 导体图案的绝缘部分。 第二通孔具有比第一通孔的接触部分的横截面面积小的横截面面积的接触部分。

公开(公告)号：US09282628B2

公开(公告)日：2016-03-08

申请号：US14157669

申请日：2014-01-17

Applicant: FUJIKURA LTD.

Inventor： Masahiro Okamoto

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/538 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K1/0206 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0154 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface of the electronic component; the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous; a via includes a plurality of heat radiation-dedicated vias which connects the rear surface of the electronic component and the heat radiation-dedicated wiring pattern; and the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

Abstract translation: 一种组件内置板，其中至少两层多个印刷布线基底设置在电子部件的背面侧; 所述印刷布线基板的至少两层包括设置在所述电子部件的后表面上方的散热专用布线图案; 热辐射专用布线图形形成为使得散热专用布线和信号专用布线是连续的; 通孔包括连接电子部件的后表面和散热专用布线图案的多个散热专用通孔; 并且热辐射专用布线图案从连接到要连接的散热专用通孔的地方连续地连接到设置在电子部件的外周侧的另一通孔。

公开(公告)号：US09231328B2

公开(公告)日：2016-01-05

申请号：US13318382

申请日：2010-05-27

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H05K1/11 ,  H05K1/00 ,  H05K7/00 ,  H01R4/58 ,  H01R12/00 ,  H01R13/24

CPC classification number: H01R13/2414 ,  H01R13/2485 ,  Y10T29/49139

Abstract: An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.

Abstract translation: 一种互连组件，包括具有从第一表面延伸到第二表面的多个通孔的弹性材料。 多个离散的，自由流动的导电颗粒位于通孔中。 导电颗粒优选基本上不含非导电材料。 多个第一接触尖端位于邻近第一表面的通孔中，并且多个第二接触末端位于与第二表面相邻的通孔中。 弹性材料提供所需的弹性，而导电颗粒提供基本上不含非导电材料的导电路径。

公开(公告)号：US09161458B2

公开(公告)日：2015-10-13

申请号：US14135625

申请日：2013-12-20

Applicant: NICHIA CORPORATION

Inventor： Tadaaki Miyata

IPC: F21V1/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/22 ,  H01L25/075 ,  H01L33/62 ,  H05K1/14

CPC classification number: H05K3/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16225 ,  H05K1/141 ,  H05K1/181 ,  H05K3/225 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2203/176 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.

Abstract translation: 发光装置包括具有通孔的第一基板，布置在第一基板上的多个第一发光元件，附接到第一基板以覆盖第一基板的通孔的第二基板 衬底和布置在第二衬底上的第二发光元件，并且电连接到第一衬底的布线。

公开(公告)号：US20150255902A1

公开(公告)日：2015-09-10

申请号：US14720167

申请日：2015-05-22

Applicant: Dell Products L.P.

Inventor： Lawrence Alan Kyle

IPC: H01R12/70 ,  G06F1/18

CPC classification number: H01R23/684 ,  G06F1/183 ,  H01L23/4006 ,  H01L2924/0002 ,  H01R12/7076 ,  H05K7/1007 ,  H05K7/1061 ,  H05K7/2049 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/53174 ,  H01L2924/00

Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.

Abstract translation: 组件装载系统包括具有插座的板。 第一基座构件通过多个第一散热器联接柱固定到板。 第一固定构件可移动地联接到第一基座构件。 第二基座构件通过多个第二散热器联接柱固定到板。 第二固定构件可移动地联接到第二基座构件。 装载构件可移动地联接到第一基座构件。 散热器可操作以联接到多个第一散热器联接柱和多个第二散热器联接柱。 通过使第一固定构件与第二基座构件相接合并使第二固定构件与第一基座构件啮合​​，装载构件可操作以固定到基板。