公开(公告)号：US20240250453A1

公开(公告)日：2024-07-25

申请号：US18624790

申请日：2024-04-02

申请人： Aptiv Technologies AG

发明人： John R. Morello ,  James M. Rainey

IPC分类号： H01R4/02 ,  H01R4/58

CPC分类号： H01R4/023 ,  H01R4/58

摘要： A coaxial cable assembly includes an inner conductor having an outer circumferential surface, wherein the inner conductor terminates in a tip having a planar surface substantially perpendicular to a longitudinal axis of the inner conductor. The coaxial cable assembly further includes an insulator located around the outer circumferential surface of the inner conductor and a contact welded to the planar surface of the tip of the inner conductor.

公开(公告)号：US20240189905A1

公开(公告)日：2024-06-13

申请号：US18584448

申请日：2024-02-22

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Ly M. CHEW ,  Gregory BERUBE ,  Seigi SUH

IPC分类号： B22F7/06 ,  B22F1/16 ,  B22F7/04 ,  H01L23/00 ,  H01R4/58

CPC分类号： B22F7/064 ,  B22F1/16 ,  B22F7/04 ,  H01L24/29 ,  H01R4/58 ,  B22F2301/255 ,  H01L2224/05639

摘要： A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises at least one silver salt of the formula CnH2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.

公开(公告)号：US11938543B2

公开(公告)日：2024-03-26

申请号：US17301642

申请日：2021-04-09

申请人： Heraeus Deutschland Gmbh & Co. KG

发明人： Ly M. Chew ,  Gregory Berube ,  Seigi Suh

IPC分类号： B22F7/06 ,  B22F1/16 ,  B22F7/04 ,  H01L23/00 ,  H01R4/58

CPC分类号： B22F7/064 ,  B22F1/16 ,  B22F7/04 ,  H01L24/29 ,  H01R4/58 ,  B22F2301/255 ,  H01L2224/05639

摘要： A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula CnH2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.

公开(公告)号：US11936152B2

公开(公告)日：2024-03-19

申请号：US16937082

申请日：2020-07-23

申请人： NEXANS

发明人： Helmut Steinberg

IPC分类号： H01R4/02 ,  B23K20/12 ,  H01R43/02 ,  B23K101/38 ,  B23K103/10 ,  B23K103/12 ,  H01R4/58

CPC分类号： H01R43/02 ,  B23K20/122 ,  H01R4/029 ,  B23K2101/38 ,  B23K2103/10 ,  B23K2103/12 ,  H01R4/58

摘要： A method is provided for electrically conductively connecting a contact part to a conductor having a multiplicity of individual wires includes inserting the conductor into a cavity in the contact part and lowering a tool for friction stir welding onto the contact part. The tool for friction stir welding is moved on the contact part in a plane, thus giving rise to a planar cohesive connection between the contact part and the conductor. In this way, a direct cohesive connection of a stranded conductor and a contact part is produced without the need for an additional part such as a sleeve, for example, to prevent the stranded conductor from “sticking out”.

公开(公告)号：US11647572B2

公开(公告)日：2023-05-09

申请号：US17352633

申请日：2021-06-21

申请人： Michael A. Tischler ,  Paul Palfreyman

发明人： Michael A. Tischler ,  Paul Palfreyman

IPC分类号： F21V21/005 ,  H05B45/345 ,  H05K1/02 ,  F21V23/00 ,  F21V23/06 ,  G09F13/22 ,  H01R25/14 ,  H01R13/24 ,  F21Y105/16 ,  F21Y115/10 ,  H01R4/58 ,  H05B45/46 ,  H05B47/19 ,  H05B47/185 ,  H05B45/325 ,  H05B45/00

CPC分类号： H05B45/345 ,  F21V21/005 ,  F21V23/001 ,  F21V23/003 ,  F21V23/06 ,  G09F13/22 ,  H01R13/2492 ,  H01R25/142 ,  H01R25/145 ,  H05K1/0274 ,  F21Y2105/16 ,  F21Y2115/10 ,  G09F2013/222 ,  H01R4/58 ,  H05B45/00 ,  H05B45/325 ,  H05B45/46 ,  H05B47/185 ,  H05B47/19

摘要： In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

公开(公告)号：US20230021593A1

公开(公告)日：2023-01-26

申请号：US17867934

申请日：2022-07-19

申请人： YAZAKI CORPORATION

发明人： Takahiro YUDATE ,  Tomoya SATOH

IPC分类号： H01R4/58 ,  H01R4/02 ,  H01R11/12 ,  H01R43/02

摘要： A terminal-equipped electric wire includes a terminal to be electrically connected to a connection target member, and an electric wire to be connected to the terminal by ultrasonic joining. The terminal includes a joint portion to be connected to the electric wire, a connection portion to be connected to the connection target member, and a plating layer on a surface of the terminal. The connection portion has an uneven shape on at least a part of a surface thereof. When the terminal-equipped electric wire is connected to the connection target member, an insulating coating of the plating layer covering at least a part of the surface of the connection portion is broken.

公开(公告)号：US20220209436A1

公开(公告)日：2022-06-30

申请号：US17594688

申请日：2020-05-01

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Kayla C. Niccum ,  Ankit Mahajan ,  Mikhail L. Pekurovsky ,  Nicholas T. Gabriel ,  Roger W. Barton ,  Kara A. Meyers ,  Saagar A. Shah ,  Jonathan W. Kemling ,  Richard C. Webb

IPC分类号： H01R4/58 ,  H01R12/61 ,  H01R12/62 ,  H01R43/00 ,  H05K3/36

摘要： Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.

公开(公告)号：US20220029399A1

公开(公告)日：2022-01-27

申请号：US17299460

申请日：2019-11-20

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Yusuke ISAJI ,  Ryoya OKAMOTO ,  Hiroshi SHIMIZU ,  Hitoshi TAKEDA

IPC分类号： H02G3/16 ,  H01R4/38 ,  H01R4/58

摘要： A circuit structure includes: an upper case having positioning holes; bus bars that are provided in an inductor disposed in the upper case and that have through holes; terminals that are connected to electric wires and that have bolts disposed thereon that penetrate the through holes; nuts that sandwich the bus bars between the nuts and the terminals by being screwed onto the bolts; and a lower case that is attached to the upper case. The lower case includes: front walls, left walls, and right walls that project upward from the lower case and position the terminals relative to the lower case by coming into contact with the terminals; and case positioning portions that project upward from the lower case and that are inserted into the positioning holes.

公开(公告)号：US11233341B2

公开(公告)日：2022-01-25

申请号：US17041549

申请日：2019-03-27

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Nobunori Koga ,  Hitoshi Horio

IPC分类号： H01R4/16 ,  H01R4/58 ,  H01R4/18 ,  H01R13/6591

摘要： A fitting-equipped conductive sheet including: a conductive sheet material in which a plurality of conductive strands are aligned planarly; and a plate-shaped conductive fitting attached to ends of the plurality of conductive strands, wherein the conductive fitting includes a folded-back portion, and a first sandwiching portion and a second sandwiching portion that are folded back with the folded-back portion as a starting point and the first sandwiching portion and the second sandwiching portion are opposed to each other.

公开(公告)号：US20210363755A1

公开(公告)日：2021-11-25

申请号：US17398146

申请日：2021-08-10

申请人： RMH Tech LLC

发明人： Dustin M.M. Haddock

IPC分类号： E04D3/362 ,  H01R4/58 ,  E04D13/00 ,  E04D3/363

摘要： A clip for electrically bonding a pair of adjacently-disposed metal panels is disclosed. One embodiment entails such a clip (104) including a first clip member (112) and an oppositely disposed second clip member (116). The surface (114) of the first clip member (112) that faces the second clip member (116) includes at least one grounding projection (128), while the surface (118) of the second clip member (116) that faces the first clip member (112) also includes at least one grounding projection (128). The clip (104) may be installed on a standing seam (102) of a panel assembly (100), with its first clip member (112) engaging one of the metal panels 82″ that define this stand seam (102) and with its second clip member (116) engaging the other of the metal panels 82″ that define this same standing seam (102).