公开(公告)号：US08895406B2

公开(公告)日：2014-11-25

申请号：US13071027

申请日：2011-03-24

申请人： John A. Rogers ,  Ralph G. Nuzzo ,  Matthew Meitl ,  Heung Cho Ko ,  Jongseung Yoon ,  Etienne Menard ,  Alfred J. Baca

发明人： John A. Rogers ,  Ralph G. Nuzzo ,  Matthew Meitl ,  Heung Cho Ko ,  Jongseung Yoon ,  Etienne Menard ,  Alfred J. Baca

IPC分类号： H01L21/30 ,  H01L21/302 ,  H01L21/469 ,  B82Y10/00 ,  B82Y20/00 ,  H01L29/15 ,  H01L31/0687 ,  H01L31/0725 ,  B81C1/00 ,  H01L29/20 ,  H01L21/78 ,  H01L31/072 ,  H01L31/068 ,  H01L33/00

CPC分类号： H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

公开(公告)号：US20130182333A1

公开(公告)日：2013-07-18

申请号：US13812100

申请日：2011-07-21

申请人： Matthew Meitl ,  Rudolph Bukovnik ,  Etienne Menard ,  Wolfgang Wagner ,  David Kneeburg ,  Jimmy Mark

发明人： Matthew Meitl ,  Rudolph Bukovnik ,  Etienne Menard ,  Wolfgang Wagner ,  David Kneeburg ,  Jimmy Mark

IPC分类号： G02B3/00

CPC分类号： G02B3/0031 ,  B29C33/3842 ,  B29C33/58 ,  B29C33/62 ,  G02B3/0025 ,  G02B3/0056

摘要： Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.

摘要翻译： 用可流动的可硬化聚合物涂层涂覆加工的模具产生光学光滑的表面，并保持向上指向特征的清晰度。 这些程序以快速和便宜的方式为高效平凸硅硅玻璃透镜阵列生产模具，其中端铣刀限定透镜的形状，并且涂层产生其平滑度。 端铣加工和具有可移动销的板中的透镜形状特征在具有布置在特征内的弹出特征的模具中，其形成用于透镜元件的模板，而不显着降低光学性能。 此外，具有可移动嵌件的机械加工和涂布板可以产生具有减小体积的透镜阵列的模具和每个透镜元件中的一个或几个环。

公开(公告)号：US08470701B2

公开(公告)日：2013-06-25

申请号：US12418071

申请日：2009-04-03

申请人： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

发明人： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

IPC分类号： H01L21/20

CPC分类号： H01L21/20 ,  B81B7/0093 ,  B81C1/0038 ,  B81C2201/0191 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/00

摘要： Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

摘要翻译： 公开了各种散热部件和制造散热部件的方法，其中与一个或多个发热部件热接触的金刚石能够散热，从而提供热调节部件。 导热金刚石以能够提供有效和最大的热传递的图案提供，远离可能易受高温损坏的部件。 这些器件和方法用于冷却易于产生显着热量的柔性电子器件，集成电路和其他复杂电子器件。 还提供了制造可在一系列装置和装置部件中使用的可印刷金刚石图案的方法。

公开(公告)号：US20130153934A1

公开(公告)日：2013-06-20

申请号：US13700411

申请日：2011-06-07

申请人： Matthew Meitl ,  Joseph Carr ,  Scott Burroughs

发明人： Matthew Meitl ,  Joseph Carr ,  Scott Burroughs

IPC分类号： H01L31/0232 ,  H01L31/173

CPC分类号： G09F27/007 ,  G09F9/3026 ,  G09F9/33 ,  G09F9/35 ,  H01L31/0543 ,  H02S40/22 ,  Y02E10/52

摘要： A concentrated photovoltaic and display apparatus includes a backplane substrate, a plurality of photovoltaic elements distributed over the backplane substrate, a plurality of display elements distributed over the backplane substrate between the photovoltaic elements, and an optical element positioned over the backplane substrate, the photovoltaic elements, and the display elements. The optical element is configured to concentrate incident light propagating in a direction substantially parallel to an optical axis thereof onto the photovoltaic elements. The optical element is further configured to direct light reflected or emitted from the display elements in a direction that is not substantially parallel to the optical axis of the optical element. Related fabrication methods and arrays including the apparatus are also discussed.

摘要翻译： 集中的光伏和显示装置包括背板基板，分布在背板基板上的多个光电元件，分布在光电元件之间的背板基板上的多个显示元件和位于背板基板上的光学元件，光电元件 ，和显示元素。 光学元件被配置为将在其基本上平行于其光轴的方向上传播的入射光集中到光伏元件上。 所述光学元件还被配置为在不基本上平行于所述光学元件的光轴的方向上引导从所述显示元件反射或发射的光。 还讨论了包括该装置的相关制造方法和阵列。

公开(公告)号：US08440546B2

公开(公告)日：2013-05-14

申请号：US13113504

申请日：2011-05-23

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L21/322

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US20120327608A1

公开(公告)日：2012-12-27

申请号：US13441598

申请日：2012-04-06

申请人： John A. ROGERS ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanging Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang

发明人： John A. ROGERS ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanging Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang

IPC分类号： H05K7/06

CPC分类号： H01L29/72 ,  H01L21/02422 ,  H01L21/02628 ,  H01L21/4846 ,  H01L21/8258 ,  H01L23/5387 ,  H01L27/12 ,  H01L29/0657 ,  H01L2924/12041 ,  H01L2924/13091 ,  H05K1/0283 ,  H05K3/20 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00

摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

摘要翻译： 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US08039847B2

公开(公告)日：2011-10-18

申请号：US12844492

申请日：2010-07-27

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

IPC分类号： H01L29/72 ,  H01L21/31 ,  B65C11/02 ,  C23F1/00

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20100236603A1

公开(公告)日：2010-09-23

申请号：US12702841

申请日：2010-02-09

申请人： Etienne Menard ,  Christopher Bower ,  Scott Burroughs ,  Joe Carr ,  Bob Conner ,  Sergiy Dets ,  Bruce Furman ,  Matthew Meitl ,  Michael Sullivan

发明人： Etienne Menard ,  Christopher Bower ,  Scott Burroughs ,  Joe Carr ,  Bob Conner ,  Sergiy Dets ,  Bruce Furman ,  Matthew Meitl ,  Michael Sullivan

IPC分类号： H01L31/052 ,  H01L31/18

CPC分类号： G02B19/0076 ,  G02B3/0056 ,  G02B19/0014 ,  G02B19/0042 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/52

摘要： CPV modules include a back plate having an array of 1 mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000× lens-to-cell light concentration to the array of solar cells. To achieve this 1000× lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.

摘要翻译： CPV模块包括其上具有1mm 2或更小的太阳能电池阵列的背板。 背板互连网络也设置在背板上。 该背板互连网络用于将太阳能电池阵列电连接在一起。 提供了与背板间隔开的前板。 该前板包括面向太阳能电池阵列的主镜阵列。 前板可以配置为向太阳能电池阵列提供大于1000倍的透镜到单元的光浓度。 为了实现这种1000×透镜到单元光的浓度，主透镜可以被配置为具有小于约4mm的透镜凹陷的平凸透镜。 还可以提供在主要透镜阵列和太阳能电池阵列之间延伸的次级光学元件阵列。

公开(公告)号：US20110316120A1

公开(公告)日：2011-12-29

申请号：US13228041

申请日：2011-09-08

申请人： John A. ROGERS ,  Ralph G. NUZZO ,  Matthew MEITL ,  Heung Cho KO ,  Jongseung YOON ,  Etienne MENARD ,  Alfred J. BACA

发明人： John A. ROGERS ,  Ralph G. NUZZO ,  Matthew MEITL ,  Heung Cho KO ,  Jongseung YOON ,  Etienne MENARD ,  Alfred J. BACA

IPC分类号： H01L29/20 ,  B32B38/10

CPC分类号： H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/6835 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2221/68368 ,  H01L2224/95001 ,  H01L2924/0002 ,  H01L2924/13091 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

公开(公告)号：US20110266561A1

公开(公告)日：2011-11-03

申请号：US13100774

申请日：2011-05-04

申请人： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred J. BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung-Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

发明人： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred J. BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung-Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L33/36 ,  H01L31/0224 ,  H01L21/56

CPC分类号： H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates.

摘要翻译： 本发明提供至少部分地通过基于印刷的装配和装置部件的集成制造的光学装置和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。 然而，本发明的光学系统除了在柔性，可塑性和/或可拉伸的基底上提供的装置和装置阵列外，还包括设置在常规刚性或半刚性基底上的装置和装置阵列。