公开(公告)号：US09960139B2

公开(公告)日：2018-05-01

申请号：US14428582

申请日：2013-09-17

申请人： DEXERIALS CORPORATION

发明人： Kouichi Sato ,  Yasushi Akutsu

IPC分类号： H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B23B3/30 ,  C09J9/02 ,  B29C59/02 ,  B32B33/00 ,  C09J7/00 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34 ,  B29C35/08

CPC分类号： H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

摘要： To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US09777197B2

公开(公告)日：2017-10-03

申请号：US14512535

申请日：2014-10-13

申请人： SunRay Scientific LLC

发明人： S. Kumar Khanna

IPC分类号： C09J9/02 ,  C09J9/00 ,  H05K13/04 ,  H05K3/30 ,  H05K3/32 ,  H01L23/00 ,  C08K9/02

CPC分类号： C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

摘要： Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

公开(公告)号：US20170077390A1

公开(公告)日：2017-03-16

申请号：US15233650

申请日：2016-08-10

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Masashi OTSUKA

IPC分类号： H01L43/02 ,  H01L27/22 ,  H01L43/12 ,  H01L43/08

CPC分类号： H01L43/10 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/82 ,  H01L2224/04042 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06562 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K9/0075 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a substrate, a magnetoresistive memory chip disposed on the substrate, and a sealing resin layer that seals the magnetoresistive memory chip. The magnetoresistive memory chip includes a magnetoresistive memory element layer and an organic resin layer that covers at least a portion of the magnetoresistive memory element layer and contains magnetic particles.

摘要翻译： 半导体器件包括衬底，设置在衬底上的磁阻存储器芯片以及密封磁阻存储器芯片的密封树脂层。 磁阻存储器芯片包括磁阻存储元件层和覆盖磁阻存储元件层的至少一部分并且包含磁性颗粒的有机树脂层。

公开(公告)号：US20160368103A1

公开(公告)日：2016-12-22

申请号：US15109115

申请日：2014-01-16

申请人： Ormet Circuitd, Inc.

发明人： Catherine A Shearer

IPC分类号： B23K35/26 ,  B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/264 ,  B23K35/266 ,  B23K35/268 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3033 ,  B23K35/3612 ,  B23K35/362 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29386 ,  H01L2224/29411 ,  H01L2224/29424 ,  H01L2224/29438 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29449 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/29473 ,  H01L2224/2948 ,  H01L2224/29484 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83825 ,  H01L2224/8384 ,  H05K3/3463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01052 ,  H01L2924/0108 ,  H01L2924/01034 ,  H01L2924/01084 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00012

摘要： Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.

摘要翻译： 本发明组合物是在高工作温度和步骤焊接应用中替代高熔点温度的焊膏和预制件。 在本发明的使用中，金属粉末的混合物在350摄氏度以下反应，形成不会在原始工艺温度下重熔的致密金属接头。

公开(公告)号：US09508680B1

公开(公告)日：2016-11-29

申请号：US14741757

申请日：2015-06-17

申请人： GLOBALFOUNDRIES INC.

发明人： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy M. Sullivan

IPC分类号： H01L23/00 ,  C09K5/06 ,  H01L21/56

CPC分类号： H01L24/98 ,  C09K5/06 ,  H01L21/56 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01074 ,  H01L2924/069 ,  H01L2924/05381 ,  H01L2924/0549 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/0537 ,  H01L2924/01025 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05442

摘要： Underfill materials and methods for removing an underfill material from beneath a chip in relation to removal of the chip from a substrate. The underfill material may a plurality of particles dispersed in a bulk matrix. The material constituting the particles may be capable of generating heat energy when exposed to a time-varying magnetic field. The bulk matrix of the underfill material between the chip and a substrate may be heated with heat energy transferred from the particles. While heated, the underfill material is removed. The heating of the underfill material may also be used to heat solder bumps connecting the chip with the substrate so that the solder bumps are liquefied.

摘要翻译： 用于从芯片下面去除底部填充材料的底部填充材料和方法相对于从衬底移除芯片。 底部填充材料可以分散在块状基质中的多个颗粒。 构成颗粒的材料可以在暴露于时变磁场时能够产生热能。 芯片和衬底之间的底部填充材料的主体矩阵可以用从颗粒转移的热能来加热。 加热时，去除底部填充材料。 底部填充材料的加热也可以用于加热将芯片与衬底连接的焊料凸块，使得焊料凸块液化。

公开(公告)号：US20150155186A1

公开(公告)日：2015-06-04

申请号：US14616983

申请日：2015-02-09

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Javier V. Goicochea ,  Cyrill Kuemin ,  Walter H. Riess ,  Heiko Wolf

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83886 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/053 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/3512

摘要： A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

摘要翻译： 用于将第一端子耦合到第二端子的桥接装置包括多个第一类型的颗粒，其形成在第一端子和第二端子之间的至少一个路径，其中第一类型的颗粒彼此附接; 多个第二类型的颗粒布置在第一类型的第一颗粒和第一类型的第二颗粒之间的接触区域附近，其中第二类型的多个颗粒的至少一部分附着到 第一类型的第一颗粒和第一类型的第二颗粒。

公开(公告)号：US08840811B2

公开(公告)日：2014-09-23

申请号：US12768778

申请日：2010-04-28

申请人： Yuusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Teiichi Inada

发明人： Yuusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Teiichi Inada

IPC分类号： H01B1/00 ,  H01B1/12 ,  H01L23/15 ,  C22C1/05 ,  H01L23/14 ,  H01L23/373 ,  H01L23/488 ,  H01L23/13 ,  H01L23/498 ,  B22F1/00 ,  H01L23/492 ,  H01B1/22 ,  H01L25/07 ,  H01L23/34 ,  B23K20/00 ,  B23K28/00 ,  B05D5/12 ,  H01L23/24 ,  H01L21/56 ,  H01L23/10 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L23/049

CPC分类号： B22F1/0074 ,  C22C1/05 ,  H01B1/22 ,  H01L21/565 ,  H01L23/049 ,  H01L23/10 ,  H01L23/13 ,  H01L23/142 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/3735 ,  H01L23/488 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/498 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/05147 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/27334 ,  H01L2224/29005 ,  H01L2224/2901 ,  H01L2224/29078 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29173 ,  H01L2224/29176 ,  H01L2224/29178 ,  H01L2224/29181 ,  H01L2224/29184 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29373 ,  H01L2224/29376 ,  H01L2224/29378 ,  H01L2224/29381 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/29893 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48739 ,  H01L2224/48755 ,  H01L2224/48839 ,  H01L2224/48855 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/832 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/0541 ,  H01L2924/0501 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/01018 ,  H01L2924/01007 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/2076 ,  H01L2924/01202 ,  H01L2224/83205

摘要： The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.

摘要翻译： 本发明提供一种接合材料和在不施加压力的情况下在较低温度下能够具有较高接合强度的接合界面处的金属接合方法，与平均粒径不大的金属颗粒的接合材料相比 超过100nm。 一种导电性接合材料，其包含（A）银颗粒，（B）氧化银，和（C）包含不超过30个碳原子的有机材料作为必要组分的分散剂，其中（A）银粉末， （B）氧化银粉末，（C）含有不超过30个碳原子的有机材料的分散剂的含量为99.0〜100重量％。 换句话说，不含树脂粘合剂。

公开(公告)号：US08555491B2

公开(公告)日：2013-10-15

申请号：US12175375

申请日：2008-07-17

申请人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

发明人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC分类号： H05K3/30 ,  H05K3/02 ,  H05K3/10

CPC分类号： H05K13/0465 ,  B22F1/0062 ,  H01L23/373 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0381 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/8321 ,  H01L2224/83211 ,  H01L2224/83438 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/8393 ,  H01L2224/83931 ,  H01L2224/8584 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  H01L2924/3512 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/01014

摘要： Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.

摘要翻译： 公开了将模具附接到基板的方法。 在某些实施例中，该方法包括在衬底上设置封盖的纳米材料，在设置的封盖的纳米材料上设置管芯，干燥所设置的封盖的纳米材料和所设置的管芯，并在300℃的温度下烧结经干燥的设置的管芯和干燥的封盖的纳米材料 ℃以下以将管芯附着到基板上。

公开(公告)号：US20110094827A1

公开(公告)日：2011-04-28

申请号：US12981085

申请日：2010-12-29

申请人： Toshio Takahashi ,  Masao Matsui ,  Satoshi Maruyama ,  Keiichi Araki

发明人： Toshio Takahashi ,  Masao Matsui ,  Satoshi Maruyama ,  Keiichi Araki

IPC分类号： E04B1/74

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29299 ,  H01L2224/2936 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929

摘要： A heat-conductive noise suppression sheet according to an embodiment includes first ferrite particles, second ferrite particles, a heat-conducting material, and a matrix material. The first ferrite particles are spherical particles having an average particle diameter in the range of 50 μm to 150 μm, the content of the first ferrite particles with respect to the total amount of solid components being in the range of 5 vol % to 25 vol %. The second ferrite particles are irregularly shaped particles having an average particle diameter in the range of 50 μm or less, the content of the second ferrite particles with respect the total amount of solid components being in the range of 5 vol % to 45 vol %.

摘要翻译： 根据实施例的导热噪声抑制片包括第一铁氧体颗粒，第二铁氧体颗粒，导热材料和基质材料。 第一铁氧体颗粒是平均粒径在50μm至150μm范围内的球形颗粒，第一铁氧体颗粒相对于固体组分总量的含量在5体积％至25体积％的范围内， 。 第二铁氧体颗粒是平均粒径在50μm以下的不规则形状的颗粒，第二铁氧体颗粒的含量相对于固体组分的总量在5体积％至45体积％的范围内。

公开(公告)号：US20080173398A1

公开(公告)日：2008-07-24

申请号：US11964827

申请日：2007-12-27

申请人： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

发明人： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC分类号： B32B5/16 ,  B29C65/02

CPC分类号： H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

摘要翻译： 包含涂覆有碳原子数为2〜8的有机物质的金属粒子的接合材料，其中所述金属粒子包含100nm以下的第一部分，大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。