公开(公告)号：US20170352716A1

公开(公告)日：2017-12-07

申请号：US15382077

申请日：2016-12-16

Applicant: Samsung Display Co., Ltd

Inventor： Chungseok LEE ,  Donghee PARK ,  Cheolgeun AN ,  Jihoon OH ,  Euiyun JANG ,  Jeongho HWANG

IPC: H01L27/32 ,  H01L51/00 ,  H01L23/00

CPC classification number: H01L27/3276 ,  H01L24/29 ,  H01L24/32 ,  H01L51/0096 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/271 ,  H01L2224/29005 ,  H01L2224/29028 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/294 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/743 ,  H01L2224/81191 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2251/5369 ,  H01L2924/07811 ,  H01L2924/1426 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

公开(公告)号：US20160151864A1

公开(公告)日：2016-06-02

申请号：US15017755

申请日：2016-02-08

Applicant: Henkel IP & Holding GmbH

Inventor： Louis P. Rector ,  Harry Richard Kuder ,  Juliet Grace Sanchez ,  Albert P. Perez ,  Kathryn Bearden

IPC: B23K35/30 ,  B23K35/362 ,  B23K35/26 ,  C22C38/52 ,  C22C9/00 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00 ,  C22C13/00 ,  C22C5/06 ,  B23K35/02 ,  C22C38/06

CPC classification number: B23K35/3006 ,  B22F1/0025 ,  B22F1/0059 ,  B22F3/10 ,  B22F3/1003 ,  B22F3/1035 ,  B22F3/23 ,  B22F7/08 ,  B23K35/0233 ,  B23K35/262 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/362 ,  B82Y30/00 ,  C22C1/0491 ,  C22C5/06 ,  C22C9/00 ,  C22C13/00 ,  C22C26/00 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/52 ,  C22C49/12 ,  C22C2026/002 ,  C23C24/106 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2711 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29372 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29413 ,  H01L2224/29418 ,  H01L2224/2942 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29447 ,  H01L2224/29449 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/29471 ,  H01L2224/29472 ,  H01L2224/2948 ,  H01L2224/29484 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83825 ,  H01L2224/8384

Abstract: A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy.

Abstract translation: 任选使用固体或半固体有机粘合剂制备包含一种或多种金属，一种或多种金属合金或一种或多种金属和一种或多种金属合金的共混物的烧结膜。 有机粘合剂可具有助熔功能; 有机粘合剂可以是在组合物中金属或金属合金烧结时部分或完全分解的有机粘合剂。 在一个实施例中，烧结膜设置在诸如硅晶片或晶片的终端使用基板或金属电路板或箔上，或者烧结膜设置在诸如金属网的载体上。 通过将金属或金属合金分散在具有或不具有粘合剂的合适溶剂中并将组合物暴露于高温以蒸发掉溶剂并部分烧结金属或金属合金来实现制备。

公开(公告)号：US20150047878A1

公开(公告)日：2015-02-19

申请号：US14386707

申请日：2013-03-22

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi Tamaki ,  Yoshito Tanaka

IPC: H01B1/02 ,  H01B1/22

CPC classification number: H01B1/02 ,  B22F1/025 ,  C22C5/06 ,  C22C9/00 ,  C22C9/06 ,  C22C19/03 ,  H01B1/026 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  Y10T428/12181 ,  H01L2924/00

Abstract: An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided.

Abstract translation: 使用包含由铜或铜合金制成的导电层或银或银合金的导电颗粒以及在导电层上形成的由镍或镍合金制成的表面层。 通过使用得到的导电性粒子，使得表面被硬质镍覆盖，镍层的内侧是具有低电阻率的铜或银，可以获得低电阻和高可靠性。 提供具有低电阻和高可靠性的导电颗粒，包含导电颗粒的电路连接材料，使用电路连接材料的安装体以及用于制造安装体的方法。

公开(公告)号：US20140179065A1

公开(公告)日：2014-06-26

申请号：US14095000

申请日：2013-12-03

Applicant: Kil Yong LEE ,  Jae Sun HAN ,  Jong Hyuk EUN

Inventor： Kil Yong LEE ,  Jae Sun HAN ,  Jong Hyuk EUN

IPC: H01L23/00

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/32227 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/361 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device includes attaching a curable film to a first connection member including a first circuit terminal, attaching a conductive film to a second connection member including a second circuit terminal, and thermally compressing the first connection member to the second connection member, with the first connection member and the second connection member placed such that the curable film and the conductive film face each other.

Abstract translation: 一种制造半导体器件的方法，包括将固化膜附着到包括第一电路端子的第一连接构件，将导电膜附接到包括第二电路端子的第二连接构件，以及将第一连接构件热压到第二连接构件 其中第一连接件和第二连接件放置成使得可固化膜和导电膜彼此面对。

公开(公告)号：US20130168847A1

公开(公告)日：2013-07-04

申请号：US13728215

申请日：2012-12-27

Applicant: Young Woo PARK ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Joon Mo SEO ,  Kyung ll SUL ,  Dong Seon UH ,  Arum YU ,  Hyun Min CHOI

Inventor： Young Woo PARK ,  Nam Ju KIM ,  Kyoung Soo PARK ,  Joon Mo SEO ,  Kyung ll SUL ,  Dong Seon UH ,  Arum YU ,  Hyun Min CHOI

IPC: H01L23/538

CPC classification number: H01L23/538 ,  C08G59/226 ,  C08G59/245 ,  C08K2201/001 ,  C08K2201/011 ,  C09J9/02 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  C08L63/00 ,  C08K3/36 ,  C08K3/10

Abstract: An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

Abstract translation: 电子器件包括各向异性导电膜作为连接材料，各向异性导电膜由各向异性导电膜形成组合物形成。 各向异性导电膜形成组合物包括多环芳族环的环氧树脂，芴环氧树脂，纳米二氧化硅和导电颗粒。

公开(公告)号：US20130105841A1

公开(公告)日：2013-05-02

申请号：US13575786

申请日：2011-04-20

Applicant: Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

Inventor： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

IPC: H01B1/02 ,  H01L33/46 ,  H01B1/22

CPC classification number: H01B1/02 ,  C08G59/42 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05342 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.

Abstract translation: 用于通过各向异性导电连接将发光元件连接到布线板的用于各向异性导电粘合剂的光反射导电颗粒包括被金属材料覆盖的芯颗粒和由反光无机颗粒形成的光反射层，所述光反射层具有 核心颗粒表面的折射率为1.52或更大。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒和氧化铝颗粒。 芯粒子表面的光反射层的覆盖率为70％以上。

公开(公告)号：US20120292087A1

公开(公告)日：2012-11-22

申请号：US13519217

申请日：2010-12-22

Applicant: Minoru Ueshima ,  Minoru Toyoda

Inventor： Minoru Ueshima ,  Minoru Toyoda

IPC: B23K1/20 ,  H05K1/16

CPC classification number: H01L23/49582 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/08501 ,  H01L2224/29026 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29447 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2203/047 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/32145 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material.The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Abstract translation: 即使使用安装焊料将使用芯片焊接焊料形成的表面安装部件焊接在印刷电路板上也可防止芯片焊接焊料的熔化。 使用具有高熔点的（Sn-Sb）基焊料作为芯片焊盘的焊料形成的表面安装部件，（Sn-Sb）基焊料，其含有不超过规定量的Cu成分的Cu， 其主要成分为Sn，使用（Sn-Ag-Cu-Bi）基焊料作为安装焊料材料焊接在电路板的基板端子部分上，焊料材料被施加在端子部分上。 由于芯片焊接材料的固相线温度为243℃，并且安装焊料的液相线温度为约215〜220℃，因此即使在加热温度（240度）下也能够防止芯片焊接材料的熔融 C.或更小）的回流炉。

公开(公告)号：US20120175660A1

公开(公告)日：2012-07-12

申请号：US13496405

申请日：2010-07-22

Applicant: Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

Inventor： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

IPC: H01L33/60 ,  H01B1/22 ,  H01B1/00

CPC classification number: C09J9/02 ,  C08G59/42 ,  C08K3/08 ,  C08K9/02 ,  C08L23/02 ,  C08L63/00 ,  C09J11/04 ,  C09J123/02 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L33/60 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00011

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.

Abstract translation: 用于发光元件与布线基板的各向异性导电连接的各向异性导电粘合剂用的光反射性导电性粒子，具有涂覆有金属材料的芯粒子和由具有金属材料的光反射性无机粒子形成的光反射层， 核心颗粒表面的折射率为1.52以上。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒或氧化铝颗粒。

公开(公告)号：US20020149114A1

公开(公告)日：2002-10-17

申请号：US10083543

申请日：2002-02-27

Inventor： Tasao Soga ,  Toshiharu Ishida ,  Kazuma Miura ,  Hanae Hata ,  Masahide Okamoto ,  Tetsuya Nakatsuka

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L24/27 ,  B22F1/0003 ,  B23K1/0004 ,  B23K35/0244 ,  B23K35/282 ,  B23K2101/40 ,  C22C18/00 ,  C22C18/04 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29218 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/751 ,  H01L2224/75251 ,  H01L2224/75745 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01031 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a AlnullMgnullGenullZn alloy, said Al particles being connected to each other by said AlnullMgnullGenullZn alloy phase.

Abstract translation: 提供一种电子设备，其包括至少一个电子部件和其上安装有所述电子部件的基板，所述电子部件和所述基板通过包括Al相的相和Al-Mg-Ge的另一相的接合 -Zn合金，所述Al颗粒通过所述Al-Mg-Ge-Zn合金相彼此连接。

公开(公告)号：US5611884A

公开(公告)日：1997-03-18

申请号：US570030

申请日：1995-12-11

Applicant: Clayton R. Bearinger ,  Robert C. Camilletti ,  Jack S. Kilby ,  Loren A. Haluska ,  Keith W. Michael

Inventor： Clayton R. Bearinger ,  Robert C. Camilletti ,  Jack S. Kilby ,  Loren A. Haluska ,  Keith W. Michael

IPC: C09J9/02 ,  C09J183/00 ,  C09J183/04 ,  H01L21/60 ,  H05K3/32 ,  C09J4/00

CPC classification number: H01L24/81 ,  C09J183/04 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29291 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29344 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T428/2857 ,  Y10T428/31663

Abstract: A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.

Abstract translation: 一种用于通过在倒装芯片的有源侧和衬底之间施加粘合剂将倒装芯片相对于衬底相反地接合的方法和组合物。 粘合剂是含有（i）硅树脂，（ii）硅氧烷胶，（iii）导电颗粒材料和任选地（iv）过氧化物催化剂）的导电硅氧烷压敏粘合剂。 合适的导电颗粒材料是银包覆玻璃纤维; 球形金颗粒; 用银，金，镍或铜涂覆的球形中空玻璃微球; 或Sn / Cu，Pb / Sn或Au / Sn的金属合金的球形颗粒。 粘合剂可以作为球或凸块本身与焊球或凸块结合使用，或者以夹在倒装芯片和衬底之间的带的形式施加。