公开(公告)号：US20150047878A1

公开(公告)日：2015-02-19

申请号：US14386707

申请日：2013-03-22

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi Tamaki ,  Yoshito Tanaka

IPC: H01B1/02 ,  H01B1/22

CPC classification number: H01B1/02 ,  B22F1/025 ,  C22C5/06 ,  C22C9/00 ,  C22C9/06 ,  C22C19/03 ,  H01B1/026 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  Y10T428/12181 ,  H01L2924/00

Abstract: An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided.

Abstract translation: 使用包含由铜或铜合金制成的导电层或银或银合金的导电颗粒以及在导电层上形成的由镍或镍合金制成的表面层。 通过使用得到的导电性粒子，使得表面被硬质镍覆盖，镍层的内侧是具有低电阻率的铜或银，可以获得低电阻和高可靠性。 提供具有低电阻和高可靠性的导电颗粒，包含导电颗粒的电路连接材料，使用电路连接材料的安装体以及用于制造安装体的方法。