Patent search cpc:"H01L2224/29471" Page 1

1.

发明授权
Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same 有权
Title translation: 各向异性导电膜包括导电粘合剂层和与其相连的半导体器件

公开(公告)号：US09490228B2

公开(公告)日：2016-11-08

申请号：US14229003

申请日：2014-03-28

Applicant: Kyoung Soo Park , Soon Young Kwon , Ji Yeon Kim , Young Woo Park , Jae Sun Han , Ja Young Hwang

Inventor： Kyoung Soo Park , Soon Young Kwon , Ji Yeon Kim , Young Woo Park , Jae Sun Han , Ja Young Hwang

IPC: H01L23/00 , C09J9/02 , C09J7/00 , C09J11/00 , H05K3/32 , C08K7/16 , C08K9/02

CPC classification number: H01L24/29 , C08K7/16 , C08K9/02 , C09J7/00 , C09J7/10 , C09J9/02 , C09J11/00 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13013 , H01L2224/16225 , H01L2224/27003 , H01L2224/271 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29387 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/29466 , H01L2224/29471 , H01L2224/29499 , H01L2224/32225 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/07802 , H01L2924/15788 , H05K3/323 , Y10T428/24959 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , H01L2924/00 , H01L2924/00014 , H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径的导电粒子）。

2.

发明申请
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A METHOD FOR FORMING A PREFORM STRUCTURE FOR A SEMICONDUCTOR CHIP ARRANGEMENT, AND A METHOD FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT 审中-公开

公开(公告)号：US20170084567A1

公开(公告)日：2017-03-23

申请号：US15363947

申请日：2016-11-29

Applicant: Infineon Technologies AG

Inventor： Friedrich Kroener

IPC: H01L23/00 , B23K35/02 , B23K35/36 , B23K1/00

CPC classification number: H01L24/29 , B23K1/0016 , B23K35/007 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/32 , B23K35/36 , B23K2101/40 , B23K2103/172 , B32B15/14 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/03462 , H01L2224/04026 , H01L2224/05647 , H01L2224/05747 , H01L2224/05893 , H01L2224/06181 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27442 , H01L2224/2746 , H01L2224/276 , H01L2224/2908 , H01L2224/29082 , H01L2224/29083 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29157 , H01L2224/29193 , H01L2224/29247 , H01L2224/29271 , H01L2224/29393 , H01L2224/29447 , H01L2224/29471 , H01L2224/32013 , H01L2224/32014 , H01L2224/32057 , H01L2224/32058 , H01L2224/32245 , H01L2224/831 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83447 , H01L2224/83693 , H01L2224/8382 , H01L2224/83825 , H01L2924/0105 , H01L2924/0132 , H01L2924/014 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/351 , H01L2924/00014 , H01L2924/01006 , H01L2924/00012

Abstract: A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber composite sheet.

3.

发明申请
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND SEMICONDUCTOR DEVICE CONNECTED BY THE SAME 有权
Title translation: 包括导电粘合层和相关连接的半导体器件的各向异性导电膜

公开(公告)号：US20140291869A1

公开(公告)日：2014-10-02

申请号：US14229003

申请日：2014-03-28

Applicant: Kyoung Soo PARK , Soon Young KWON , Ji Yeon KIM , Young Woo PARK , Jae Sun HAN , Ja Young HWANG

Inventor： Kyoung Soo PARK , Soon Young KWON , Ji Yeon KIM , Young Woo PARK , Jae Sun HAN , Ja Young HWANG

IPC: H01L23/00 , C09J9/02

CPC classification number: H01L24/29 , C08K7/16 , C08K9/02 , C09J7/00 , C09J7/10 , C09J9/02 , C09J11/00 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13013 , H01L2224/16225 , H01L2224/27003 , H01L2224/271 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29387 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/29466 , H01L2224/29471 , H01L2224/29499 , H01L2224/32225 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/07802 , H01L2924/15788 , H05K3/323 , Y10T428/24959 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , H01L2924/00 , H01L2924/00014 , H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径的导电粒子）。

4.

发明申请
COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTICLES 审中-公开

公开(公告)号：US20180269128A1

公开(公告)日：2018-09-20

申请号：US15461033

申请日：2017-03-16

Applicant: Intel Corporation

Inventor： Ameya Limaye , Shubhada H. Sahasrabudhe , Nachiket R. Raravikar

IPC: H01L23/367 , H01L23/373 , H01L21/48 , H01L23/00

CPC classification number: H01L23/3737 , H01L23/42 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/271 , H01L2224/27334 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29471 , H01L2224/32245 , H01L2224/73253 , H01L2224/83191 , H01L2224/83203 , H01L2224/92225 , H01L2924/16235 , H01L2924/16251 , H01L2924/01062

Abstract: Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.

5.

发明申请
METAL SINTERING FILM COMPOSITIONS 审中-公开
Title translation: 金属烧结膜组合物

公开(公告)号：US20160151864A1

公开(公告)日：2016-06-02

申请号：US15017755

申请日：2016-02-08

Applicant: Henkel IP & Holding GmbH

Inventor： Louis P. Rector , Harry Richard Kuder , Juliet Grace Sanchez , Albert P. Perez , Kathryn Bearden

IPC: B23K35/30 , B23K35/362 , B23K35/26 , C22C38/52 , C22C9/00 , C22C38/04 , C22C38/02 , C22C38/00 , C22C13/00 , C22C5/06 , B23K35/02 , C22C38/06

CPC classification number: B23K35/3006 , B22F1/0025 , B22F1/0059 , B22F3/10 , B22F3/1003 , B22F3/1035 , B22F3/23 , B22F7/08 , B23K35/0233 , B23K35/262 , B23K35/302 , B23K35/3066 , B23K35/362 , B82Y30/00 , C22C1/0491 , C22C5/06 , C22C9/00 , C22C13/00 , C22C26/00 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/52 , C22C49/12 , C22C2026/002 , C23C24/106 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/2711 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/2932 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/29371 , H01L2224/29372 , H01L2224/2938 , H01L2224/29384 , H01L2224/29386 , H01L2224/29393 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29447 , H01L2224/29449 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29464 , H01L2224/29469 , H01L2224/29471 , H01L2224/29472 , H01L2224/2948 , H01L2224/29484 , H01L2224/29499 , H01L2224/32225 , H01L2224/83101 , H01L2224/83192 , H01L2224/83825 , H01L2224/8384

Abstract: A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy.

Abstract translation: 任选使用固体或半固体有机粘合剂制备包含一种或多种金属，一种或多种金属合金或一种或多种金属和一种或多种金属合金的共混物的烧结膜。有机粘合剂可具有助熔功能; 有机粘合剂可以是在组合物中金属或金属合金烧结时部分或完全分解的有机粘合剂。在一个实施例中，烧结膜设置在诸如硅晶片或晶片的终端使用基板或金属电路板或箔上，或者烧结膜设置在诸如金属网的载体上。通过将金属或金属合金分散在具有或不具有粘合剂的合适溶剂中并将组合物暴露于高温以蒸发掉溶剂并部分烧结金属或金属合金来实现制备。