公开(公告)号：US20140302643A1

公开(公告)日：2014-10-09

申请号：US14355852

申请日：2012-10-31

申请人： Dexerials Corporation

发明人： Takayuki Saito

IPC分类号： H01L23/00

CPC分类号： H01L24/742 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29471 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/069 ,  H01L2924/0635

摘要： A connection device includes a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted, a heat press head for heating and pressing the electronic component, a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component, and a support member that is disposed on a periphery of the electronic component and supports the first elastic body.

摘要翻译： 连接装置包括安装有热固性粘合剂层堆叠的电子部件的安装部，用于加热和加压电子部件的热压头，设置在电子部件与电子部件的按压面之间的第一弹性体 所述热压头按压所述电子部件的上表面，以及支撑部件，其设置在所述电子部件的周围并支撑所述第一弹性体。

公开(公告)号：US10280347B2

公开(公告)日：2019-05-07

申请号：US15532931

申请日：2016-02-05

申请人： DEXERIALS CORPORATION

发明人： Kenji Kubota ,  Takayuki Saito

IPC分类号： C09J163/08 ,  C09J7/00 ,  C09J133/04 ,  H01L23/00 ,  C09J133/16 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  C08G59/42 ,  C09J163/00 ,  H01L25/065 ,  H01L25/00

摘要： A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.

公开(公告)号：US09957411B2

公开(公告)日：2018-05-01

申请号：US14915734

申请日：2014-09-10

申请人： DEXERIALS CORPORATION

发明人： Takayuki Saito ,  Taichi Koyama ,  Hironobu Moriyama

IPC分类号： C09J7/00 ,  C09J163/00 ,  C09J133/08 ,  C09J133/10 ,  C09D163/00 ,  C09J133/04 ,  C09J163/08 ,  H01L21/683 ,  H01L23/29 ,  H01L21/56 ,  C09D133/06 ,  C09J133/06 ,  H01L23/31 ,  C08G59/42 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： C09D163/00 ,  C08G59/42 ,  C08L63/00 ,  C09D133/066 ,  C09J133/04 ,  C09J133/066 ,  C09J163/08 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/3142 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L21/78 ,  C08K5/14 ,  C08L33/10

摘要： An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50° C./min are in a range of 100° C. to 150° C. and in a range of 100 to 5000 Pa·s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

公开(公告)号：US09196599B2

公开(公告)日：2015-11-24

申请号：US14355852

申请日：2012-10-31

申请人： Dexerials Corporation

发明人： Takayuki Saito

IPC分类号： H01L21/44 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

CPC分类号： H01L24/742 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29471 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/069 ,  H01L2924/0635

摘要： A connection device includes a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted, a heat press head for heating and pressing the electronic component, a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component, and a support member that is disposed on a periphery of the electronic component and supports the first elastic body.

摘要翻译： 连接装置包括安装有热固性粘合剂层堆叠的电子部件的安装部，用于加热和加压电子部件的热压头，设置在电子部件与电子部件的按压面之间的第一弹性体 所述热压头按压所述电子部件的上表面，以及支撑部件，其设置在所述电子部件的周围并支撑所述第一弹性体。