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    PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES
    1.
    发明申请
    PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES 审中-公开
    基于羧酸和环氧化合物的压力敏感性粘合剂

    公开(公告)号：US20140349109A1

    公开(公告)日：2014-11-27

    申请号：US14363780

    申请日：2012-12-05

    Applicant: State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon ,  State University

    Inventor： Kaichang Li ,  Anlong Li

    IPC: C09J163/00 ,  C09J7/02 ,  B32B37/26 ,  C09J163/08

    CPC classification number: C09J163/00 ,  B32B37/26 ,  B32B2037/268 ,  C08G59/42 ,  C09J7/38 ,  C09J163/08 ,  C09J2463/00 ,  C09J2463/008 ,  Y10T428/287

    Abstract: A method for making a pressure sensitive adhesive comprising: (a) reacting (i) at least one dibasic acid or anhydride thereof with (ii) at least one epoxide having at least two epoxy groups, one diol or polyol, or one diamine at a stoichiometric molar excess of reactive carboxylic acid groups relative reactive epoxy groups, hydroxyl groups or amine groups to produce a thermoplastic prepolymer or oligomer capped with a carboxylic acid group at both prepolymer or oligomer chain ends, or a thermoplastic branched prepolymer or oligomer with at least two of the prepolymer or oligomer branches and chain ends capped with a carboxylic acid group; and (b) curing the resulting carboxylic acid-capped prepolymer or oligomer with at least one polyfunctional epoxy to produce a pressure sensitive adhesive, wherein the polyfunctional epoxy is not an epoxidized vegetable oil. A method for making a pressure sensitive adhesive comprising: (a) reacting at least one dibasic acid or anhydride thereof with at least one epoxide having at least two epoxy or oxirane groups at a stoichiometric molar excess of reactive epoxy or oxirane groups relative reactive carboxylic acid groups to produce a thermoplastic prepolymer or oligomer capped with an epoxy or an oxirane group at both prepolymer or oligomer chain ends, or a thermoplastic branched prepolymer or oligomer with at least two of the prepolymer or oligomer branches and chain ends capped with an epoxy or oxirane group; and (b) (i) curing the resulting epoxy-capped prepolymer or oligomer with at least one polybasic acid, or (ii) thermally curing the resulting epoxy-capped prepolymer or oligomer, to produce a pressure sensitive adhesive.

    Abstract translation: 一种制造压敏粘合剂的方法，包括：（i）使（i）至少一种二元酸或其酸酐与（ii）至少一种具有至少两个环氧基的环氧化物，一种二醇或多元醇或一种二胺在 化学计量摩尔过量的反应性羧酸基团相对于反应性环氧基，羟基或胺基，以产生在预聚物或低聚物链末端用羧酸基团封端的热塑性预聚物或低聚物，或具有至少两个的热塑性支链预聚物或低聚物 的预聚物或低聚物分支和用羧酸基团封端的链端; 和（b）用至少一种多官能环氧树脂固化得到的羧酸封端的预聚物或低聚物以制备压敏粘合剂，其中多官能环氧不是环氧化植物油。 一种制造压敏粘合剂的方法，包括：（a）使化学计量摩尔过量的反应性环氧或环氧乙烷基团的至少一种具有至少两个环氧基或环氧乙烷基团的至少一种二元酸或其酸酐与相对反应性羧酸 以产生在预聚物或低聚物链末端用环氧基或环氧乙烷基封端的热塑性预聚物或低聚物，或具有至少两个预聚物或低聚物分支的热塑性支链预聚物或低聚物，并且用环氧基或环氧乙烷封端的链端 组; 和（b）（i）用至少一种多元酸固化得到的环氧基封端的预聚物或低聚物，或（ii）热固化所得环氧树脂封端的预聚物或低聚物，以产生压敏粘合剂。

    Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
    6.
    发明授权
    Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers 失效
    用于由环氧化的单羟基化二烯聚合物制备UV可固化粘合剂和密封剂的非水溶剂自由法

    公开(公告)号：US5776998A

    公开(公告)日：1998-07-07

    申请号：US638476

    申请日：1996-04-26

    Applicant: Jeffrey George Southwick ,  Kathleen Suzanne Kiibler ,  James Robert Erickson

    Inventor： Jeffrey George Southwick ,  Kathleen Suzanne Kiibler ,  James Robert Erickson

    IPC: C08F2/50 ,  C08J3/20 ,  C08L63/08 ,  C09J153/02 ,  C09J163/08

    CPC classification number: C08J3/201 ,  C09J153/025 ,  C09J163/08 ,  C08J2363/00

    Abstract: The invention herein is a non-aqueous solvent free process for producing UV curable adhesive and sealant compositions comprising a tackifying resin and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethnically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves mixing the components with an insoluble photoinitiator under conditions of high shear and/or cavitation. The invention also relates to a film of 5 mils to one inch thick which is formed from the composition made according to the process above.

    Abstract translation: 本发明是用于生产UV可固化粘合剂和密封剂组合物的非水溶剂的方法，其包含增粘树脂和单羟基化环氧化聚二烯聚合物，其由至少两种可聚合的不饱和烃单体组成，其中至少一种是二烯单体， 产生适合于环氧化的不饱和度，并且其中聚合物每克聚合物含有0.1-7.0毫当量环氧树脂。 该方法包括在高剪切和/或空化条件下将组分与不溶性光引发剂混合。 本发明还涉及5密耳至1英寸厚的薄膜，其由根据上述方法制备的组合物形成。

    Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems
    7.
    发明授权
    Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems 失效
    具有双重固化体系的远端聚合物和异丙烯基聚二烯嵌段聚合物

    公开(公告)号：US5576388A

    公开(公告)日：1996-11-19

    申请号：US519885

    申请日：1995-08-28

    Applicant: David J. St. Clair ,  James R. Erickson

    Inventor： David J. St. Clair ,  James R. Erickson

    IPC: C09K3/10 ,  C08G18/62 ,  C08G18/69 ,  C08G59/18 ,  C08G59/34 ,  C08J3/24 ,  C08L53/00 ,  C09J4/06 ,  C09J119/00 ,  C09J153/00 ,  C09J161/34 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J201/02 ,  C08L53/02 ,  C08L33/08 ,  C08L67/02

    CPC classification number: C08G59/027 ,  C08G18/6208 ,  C08G18/69 ,  C08G18/698 ,  C08G59/18 ,  C08J3/243 ,  C09J119/006 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J4/06 ,  C08G2170/40 ,  C08G2190/00

    Abstract: Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.

    Abstract translation: 压敏结构粘合剂和密封剂组合物，其包含：（a）包含95至15重量％的遥爪聚合物和5至85重量％的异丙炔基聚合物的聚合物体系，其中至少一个其上的官能团相同 作为遥爪聚合物上的功能，和（b）双重固化系统，其中固化体系的一个元素固化遥爪聚合物，并且杂多聚乙烯聚合物上的共同官能团固化，而另一个元素固化在异极性聚合物上的功能，但不固化 在固化遥爪聚合物以形成结构粘合剂或密封剂组合物所需的条件下。 在一个优选的实施方案中，聚合物体系由羟基官能的遥爪二醇或多元醇聚合物组成，并且所述聚异戊烯聚合物是也具有环氧化烯烃官能团的单羟基化聚二烯烃聚合物。 双重固化体系优选由异氰酸酯固化剂组成，以在环境温度下固化通过羟基，以形成压敏粘合剂或密封剂和氨基树脂，以在烘烤时通过环氧官能团固化以形成结构粘合剂或密封剂。

    CURABLE COMPOSITIONS
    10.
    发明申请
    CURABLE COMPOSITIONS 审中-公开
    可固化组合物

    公开(公告)号：US20130059945A1

    公开(公告)日：2013-03-07

    申请号：US13696814

    申请日：2011-05-18

    Applicant: Maurice J. Marks ,  Roy V. Snelgrove

    Inventor： Maurice J. Marks ,  Roy V. Snelgrove

    IPC: C08K5/1515 ,  C09D163/08 ,  C09J163/08 ,  C08L63/08

    CPC classification number: C08G59/68 ,  C08G59/027 ,  C08G59/245 ,  C08G59/686

    Abstract: A curable divinylarene dioxide resin composition having a stoichiometric excess of divinylarene dioxides cured with amines, anhydrides, or polyphenols. The curable divinylarene dioxide resin composition includes (a) a stoichiometric excess of at least one divinylarene dioxide, (b) a co-reactive curing agent, and a catalyst. A process for making the above curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom are also disclosed. The curable divinylarene dioxide resin composition has a longer pot life prior to cure and produces a thermoset having a higher heat resistance after cure than analogous prior art compositions made using stoichiometric compositions. The curable compositions of the present invention are advantageously useful as thermoset materials, coatings, composites, and adhesives.

    Abstract translation: 用胺，酸酐或多酚固化的化学计量过量二乙烯基芳烃二氧化物的可固化二乙烯基芳烃二氧化物树脂组合物。 可固化的二乙烯基芳烃二氧化物树脂组合物包括（a）化学计量过量的至少一种二乙烯基芳烃二氧化物，（b）共反应性固化剂和催化剂。 制备上述可固化二乙烯基芳烃二氧化物树脂组合物的方法; 还公开了由其制成的固化二乙烯基芳烃二氧化物树脂组合物。 可固化的二乙烯基芳烃二氧化物树脂组合物在固化之前具有较长的适用期，并且产生具有比使用化学计量组合物制备的现有技术组合物的固化后更高的耐热性的热固性材料。 本发明的可固化组合物有利地用作热固性材料，涂料，复合材料和粘合剂。

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