公开(公告)号：US11683963B2

公开(公告)日：2023-06-20

申请号：US16249387

申请日：2019-01-16

申请人： Samsung Display Co., Ltd.

发明人： Chungseok Lee ,  Donghee Park ,  Cheolgeun An ,  Jihoon Oh ,  Euiyun Jang ,  Jeongho Hwang

IPC分类号： H01L27/32 ,  H01L23/00 ,  H01L51/00

CPC分类号： H01L27/3276 ,  H01L24/29 ,  H01L24/32 ,  H01L51/0096 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/271 ,  H01L2224/294 ,  H01L2224/29005 ,  H01L2224/29028 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/29293 ,  H01L2224/29391 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/743 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2251/5369 ,  H01L2924/07811 ,  H01L2924/1426 ,  H01L2224/29444 ,  H01L2924/00014 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29447 ,  H01L2924/00014 ,  H01L2224/29455 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29005 ,  H01L2924/00012 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83

摘要： An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

公开(公告)号：US20170338197A1

公开(公告)日：2017-11-23

申请号：US15674406

申请日：2017-08-10

申请人： Renesas Electronics Corporation

发明人： Shinya Suzuki

IPC分类号： H01L23/00 ,  G02F1/133 ,  H01L23/528 ,  H01L23/522 ,  H01L23/485 ,  H01L21/768 ,  H01L21/311 ,  H01L21/3105 ,  H01L21/02 ,  G02F1/1345 ,  G02F1/1343 ,  G02F1/1333 ,  H01L27/13 ,  H01L29/78 ,  G02F1/1368 ,  G02F1/1362

CPC分类号： H01L24/14 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/1345 ,  G02F1/13458 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/133302 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/768 ,  H01L21/76819 ,  H01L23/485 ,  H01L23/522 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L27/13 ,  H01L29/7833 ,  H01L2224/02122 ,  H01L2224/0345 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05075 ,  H01L2224/051 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/056 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13013 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13144 ,  H01L2224/14153 ,  H01L2224/16225 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/81 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/93 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2924/00

摘要： A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wiring to reduce irregularities caused by the wiring and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.

公开(公告)号：US20170196133A1

公开(公告)日：2017-07-06

申请号：US15314914

申请日：2015-05-22

申请人： Sharp Kabushiki Kaisha

发明人： Katsuhiro YAMAGUCHI ,  Nobuhiro NAKATA ,  Yukinori MASUDA ,  Tomoki TAKAHARA

IPC分类号： H05K13/04 ,  H05K3/00 ,  H01L23/00 ,  H05K1/11

CPC分类号： H05K13/0469 ,  G02F1/13454 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7525 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75312 ,  H01L2224/75744 ,  H01L2224/75981 ,  H01L2224/75985 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81234 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81466 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83234 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/111 ,  H05K3/0055 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

摘要： An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.

公开(公告)号：US09613934B2

公开(公告)日：2017-04-04

申请号：US14621936

申请日：2015-02-13

申请人： INTEL CORPORATION

发明人： Sandeep Razdan ,  Edward R. Prack ,  Sairam Agraharam ,  Robert L. Sankman ,  Shan Zhong ,  Robert M. Nickerson

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  C09J9/02 ,  H01L23/498 ,  H01L21/56 ,  H01L23/528 ,  H01L23/532 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L25/0657 ,  C09J9/02 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49866 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/5329 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/13005 ,  H01L2224/13025 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29078 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/73104 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13613 ,  H01L2924/014 ,  H01L2924/207 ,  H01L2924/0665 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.

公开(公告)号：US20160368103A1

公开(公告)日：2016-12-22

申请号：US15109115

申请日：2014-01-16

申请人： Ormet Circuitd, Inc.

发明人： Catherine A Shearer

IPC分类号： B23K35/26 ,  B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/264 ,  B23K35/266 ,  B23K35/268 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3033 ,  B23K35/3612 ,  B23K35/362 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29386 ,  H01L2224/29411 ,  H01L2224/29424 ,  H01L2224/29438 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29449 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/29473 ,  H01L2224/2948 ,  H01L2224/29484 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83825 ,  H01L2224/8384 ,  H05K3/3463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01052 ,  H01L2924/0108 ,  H01L2924/01034 ,  H01L2924/01084 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00012

摘要： Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.

摘要翻译： 本发明组合物是在高工作温度和步骤焊接应用中替代高熔点温度的焊膏和预制件。 在本发明的使用中，金属粉末的混合物在350摄氏度以下反应，形成不会在原始工艺温度下重熔的致密金属接头。

公开(公告)号：US09490228B2

公开(公告)日：2016-11-08

申请号：US14229003

申请日：2014-03-28

申请人： Kyoung Soo Park ,  Soon Young Kwon ,  Ji Yeon Kim ,  Young Woo Park ,  Jae Sun Han ,  Ja Young Hwang

发明人： Kyoung Soo Park ,  Soon Young Kwon ,  Ji Yeon Kim ,  Young Woo Park ,  Jae Sun Han ,  Ja Young Hwang

IPC分类号： H01L23/00 ,  C09J9/02 ,  C09J7/00 ,  C09J11/00 ,  H05K3/32 ,  C08K7/16 ,  C08K9/02

CPC分类号： H01L24/29 ,  C08K7/16 ,  C08K9/02 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13013 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29471 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K3/323 ,  Y10T428/24959 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

摘要翻译： 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。 在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径 的导电粒子）。

公开(公告)号：US09484240B2

公开(公告)日：2016-11-01

申请号：US14183823

申请日：2014-02-19

申请人： NITTO DENKO CORPORATION

发明人： Yuki Sugo ,  Yuta Kimura

IPC分类号： H01L21/683 ,  H01L23/48 ,  H01L21/50 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00 ,  C08G59/62 ,  C09J163/00 ,  C08K3/08

CPC分类号： H01L21/6836 ,  C08G59/621 ,  C08K3/02 ,  C08K3/08 ,  C08L33/06 ,  C09J7/20 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/50 ,  H01L23/48 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29424 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/1405 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.

摘要翻译： 本发明涉及一种包含热塑性树脂和导电颗粒的薄膜粘合剂，该膜粘合剂在40℃下将膜粘合剂粘贴到镜面硅晶片上之后，在25℃下测量的粘合强度为0.5N / 10毫米以上。

公开(公告)号：US09437346B2

公开(公告)日：2016-09-06

申请号：US14049243

申请日：2013-10-09

申请人： Kyoung Hun Shin ,  Do Hyun Park ,  Hyun Joo Seo ,  Young Ju Shin ,  Kyu Bong Kim ,  Woo Jun Lim

发明人： Kyoung Hun Shin ,  Do Hyun Park ,  Hyun Joo Seo ,  Young Ju Shin ,  Kyu Bong Kim ,  Woo Jun Lim

IPC分类号： H01B1/22 ,  H01L23/60 ,  H01L23/00

CPC分类号： H01B1/22 ,  C09J2201/602 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/32135 ,  H01L2224/32225 ,  H01L2224/81903 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

摘要： A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

摘要翻译： 使用各向异性导电粘合剂组合物连接的半导体器件，所述各向异性导电粘合剂组合物包含热固性聚合引发剂; （甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯，其中（甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯以组合物中总重量的1重量％至25重量％的量存在于组合物中 组合固体含量。

公开(公告)号：US09340710B2

公开(公告)日：2016-05-17

申请号：US14134578

申请日：2013-12-19

申请人： DEXERIALS CORPORATION

发明人： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

IPC分类号： H01L33/46 ,  H01L33/62 ,  C09J9/02 ,  C08L23/02 ,  C09J11/04 ,  C09J123/02 ,  H01L33/60 ,  C08G59/42 ,  C08L63/00 ,  C08K3/08 ,  C08K9/02 ,  H01L23/00

CPC分类号： C09J9/02 ,  C08G59/42 ,  C08K3/08 ,  C08K9/02 ,  C08L23/02 ,  C08L63/00 ,  C09J11/04 ,  C09J123/02 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L33/60 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00011

摘要： A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.

摘要翻译： 用于发光元件与布线基板的各向异性导电连接的各向异性导电粘合剂用的光反射性导电性粒子，具有涂覆有金属材料的芯粒子和由具有金属材料的光反射性无机粒子形成的光反射层， 核心颗粒表面的折射率为1.52以上。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒或氧化铝颗粒。

公开(公告)号：US20160126203A1

公开(公告)日：2016-05-05

申请号：US14993981

申请日：2016-01-12

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Shinya Suzuki

IPC分类号： H01L23/00 ,  H01L21/311 ,  H01L21/02 ,  H01L21/768 ,  H01L21/3105

CPC分类号： H01L24/14 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/1345 ,  G02F1/13458 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/133302 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/768 ,  H01L21/76819 ,  H01L23/485 ,  H01L23/522 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L27/13 ,  H01L29/7833 ,  H01L2224/02122 ,  H01L2224/0345 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05075 ,  H01L2224/051 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/056 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13013 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13144 ,  H01L2224/14153 ,  H01L2224/16225 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/81 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/93 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1426 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2924/00

摘要： A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.