公开(公告)号：US20180122786A1

公开(公告)日：2018-05-03

申请号：US15642599

申请日：2017-07-06

申请人： InnoLux Corporation

发明人： Yuan-Lin WU ,  Yu-Hsien WU ,  Kuan-Feng LEE ,  Tsung-Han TSAI

IPC分类号： H01L25/16 ,  H01L27/12 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00

CPC分类号： H01L25/167 ,  H01L24/29 ,  H01L25/075 ,  H01L25/0753 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1248 ,  H01L33/62 ,  H01L2224/29499 ,  H01L2224/32148 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2933/0033 ,  H01L2933/0066

摘要： A display device is provided. The display device includes a supporting film and a flexible substrate disposed on the supporting film. The display device also includes a driving layer disposed on the flexible substrate, and a conductive pad disposed on the driving layer. The display device further includes a light-emitting diode disposed on the conductive pad and electrically connected to the conductive pad, wherein the supporting film has a first hardness, the flexible substrate has a second hardness, and the first hardness is greater than or equal to the second hardness.

公开(公告)号：US09875992B2

公开(公告)日：2018-01-23

申请号：US14821767

申请日：2015-08-09

申请人： Junyeong Heo ,  Chajea Jo ,  Taeje Cho

发明人： Junyeong Heo ,  Chajea Jo ,  Taeje Cho

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/544 ,  H01L25/065 ,  H01L25/00 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2224/14505 ,  H01L2224/14519 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17177 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8113 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/3512 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/17136 ,  H01L2224/17179

摘要： An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip; and a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.

公开(公告)号：US20180019234A1

公开(公告)日：2018-01-18

申请号：US15644047

申请日：2017-07-07

申请人： InnoLux Corporation

发明人： Shun-Yuan HU

IPC分类号： H01L25/16 ,  H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12

CPC分类号： H01L25/167 ,  H01L24/03 ,  H01L24/09 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0753 ,  H01L27/1244 ,  H01L33/62 ,  H01L2224/16148 ,  H01L2224/1703 ,  H01L2224/32148 ,  H01L2224/73204 ,  H01L2224/9211 ,  H01L2924/12041 ,  H01L2924/13069 ,  H01L2933/0066

摘要： A display device is provided. The display device includes a first conductive pad disposed on a substrate, wherein the first conductive pad has a contact area that is adjacent to the substrate. The display device also includes a first bonding material disposed on the first conductive pad, wherein the first bonding material has a sectional area that is parallel to a surface of the substrate. The display device further includes a second conductive pad disposed on the first bonding material, and a first illumination structure disposed on the second conductive pad, wherein the sectional area of the first bonding material is smaller than the contact area of the first conductive pad.

公开(公告)号：US09653312B2

公开(公告)日：2017-05-16

申请号：US14559197

申请日：2014-12-03

申请人： Semiconductor Manufacturing International (Shanghai) Corporation

发明人： Yuankun Hou ,  Kuanchieh Yu ,  Yu Hua ,  Yuelin Zhao

IPC分类号： H01L23/544 ,  H01L21/308 ,  H01L25/00 ,  H01L23/10 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L21/56 ,  H01L21/30604 ,  H01L21/308 ,  H01L22/12 ,  H01L23/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/0612 ,  H01L2224/08145 ,  H01L2224/08148 ,  H01L2224/2761 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/30145 ,  H01L2224/32145 ,  H01L2224/32148 ,  H01L2224/80011 ,  H01L2224/80203 ,  H01L2224/80805 ,  H01L2224/8081 ,  H01L2224/80895 ,  H01L2224/83011 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00015 ,  H01L2924/0002 ,  H01L2924/163 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/80

摘要： A method of forming a sealing structure for a bonded wafer is provided. The method includes providing the lower wafer and the upper wafer, forming a sealing material layer on each of the lower wafer and the upper wafer, forming a mask layer on the sealing material layer on each of the lower wafer and the upper wafer, etching the sealing material layer using the mask layer as an etch mask, so as to form a first protrusion at an edge of the lower wafer and a second protrusion at an edge of the upper wafer, and bonding the first protrusion and the second protrusion together to form the sealing structure. The sealing structure encloses a gap between the lower wafer and the upper wafer at an edge of the bonded wafer, so as to form a hermetically sealed cavity at the edge of the bonded wafer.

公开(公告)号：US20150340341A1

公开(公告)日：2015-11-26

申请号：US14815071

申请日：2015-07-31

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Chia-Pao SHU ,  Chun-wen CHENG ,  Kuei-Sung CHANG ,  Hsin-Ting HUANG ,  Shang-Ying TSAI ,  Jung-Huei PENG

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/528 ,  H01L23/58 ,  H01L23/498

CPC分类号： H01L21/76838 ,  B81C1/00238 ,  B81C1/00269 ,  B81C2203/019 ,  H01L23/49838 ,  H01L23/528 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05617 ,  H01L2224/05638 ,  H01L2224/061 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29014 ,  H01L2224/29017 ,  H01L2224/2902 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/301 ,  H01L2224/32058 ,  H01L2224/321 ,  H01L2224/32106 ,  H01L2224/32148 ,  H01L2224/83203 ,  H01L2224/83365 ,  H01L2224/83805 ,  H01L2225/06527 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/01014 ,  H01L2924/01037 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/00014

摘要： A package system includes a first substrate; and a second substrate electrically coupled with the first substrate. The package system further includes a semiconductor material between the first substrate and the second substrate. The semiconductor material includes a pad, and at least one guard ring surrounding the pad and spaced from the pad. The package system further includes a metallic material bonded to the semiconductor material, wherein the metallic material at least partially fills at least one opening in at least one of the first substrate or the second substrate.

摘要翻译： 包装系统包括第一基板; 以及与所述第一基板电耦合的第二基板。 封装系统还包括在第一衬底和第二衬底之间的半导体材料。 半导体材料包括焊盘和围绕焊盘并与焊盘间隔开的至少一个保护环。 封装系统还包括结合到半导体材料的金属材料，其中金属材料至少部分地填充至少一个第一衬底或第二衬底中的一个开口。

公开(公告)号：US09171779B2

公开(公告)日：2015-10-27

申请号：US14472400

申请日：2014-08-29

申请人： Industrial Technology Research Institute

发明人： Jui-Ying Lin ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Yao-Jun Tsai ,  Yi-Chen Lin

IPC分类号： H01S5/024 ,  H01L23/48 ,  H01L21/306 ,  H01L27/02 ,  H01L33/20 ,  H01L33/62 ,  H01L21/768 ,  H01L23/00 ,  H01S5/02 ,  H01S5/026 ,  H01S5/34 ,  G02B6/12 ,  G02B6/34 ,  H01L29/861

CPC分类号： H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

摘要翻译： 提供半导体激光器结构。 半导体激光器包括中心热分流器，环形硅波导，连续热分流器，粘合剂层和激光元件。 中心热分流器位于具有围绕中心热分流的掩埋氧化物层的SOI衬底上。 环形硅波导位于掩埋氧化层上并围绕中心热分流。 环形硅波导包括p型材料部分的P-N结，n型材料部分和其间的耗尽区域。 连续的热分流器覆盖一部分掩埋的氧化物层并且环绕着环形硅波导。 粘合剂层覆盖环形硅波导和掩埋氧化物层。 激光元件覆盖中心热分流器，粘合剂层和相邻热分流器。

公开(公告)号：US09164342B2

公开(公告)日：2015-10-20

申请号：US13119713

申请日：2009-05-12

申请人： Hiroyuki Moriwaki

发明人： Hiroyuki Moriwaki

IPC分类号： H05K7/00 ,  G02F1/1368 ,  G02F1/1345 ,  H01L23/00 ,  H01L27/12

CPC分类号： G02F1/1368 ,  G02F1/13452 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L27/124 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32148 ,  H01L2224/83 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a circuit substrate which can integrate circuit elements without degrading wiring characteristics, and a display device including the circuit substrate. The circuit substrate of the present invention includes a transistor substrate (10) which is a support substrate (1) having a transistor (20) and an external connection terminal (50) mounted thereon, and an external member (60) attached on the transistor substrate (10). The external member (60) is connected physically and electrically to the external connection terminal (50) through a conductive member (3), and the transistor (20) and the external connection terminal (50) are arranged side by side.

摘要翻译： 提供一种电路基板，其可以集成电路元件而不降低布线特性，以及包括该电路基板的显示装置。 本发明的电路基板包括：晶体管（10），其是具有晶体管（20）的支撑基板（1）和安装在其上的外部连接端子（50）;以及外部部件（60），其安装在晶体管 基板（10）。 外部构件（60）通过导电构件（3）物理电连接到外部连接端子（50），并且晶体管（20）和外部连接端子（50）并排布置。

公开(公告)号：US09000578B2

公开(公告)日：2015-04-07

申请号：US12900718

申请日：2010-10-08

申请人： Chia-Pao Shu ,  Chun-wen Cheng ,  Kuei-Sung Chang

发明人： Chia-Pao Shu ,  Chun-wen Cheng ,  Kuei-Sung Chang

IPC分类号： H01L23/48 ,  H01L23/52 ,  B81C1/00 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L24/83 ,  B81C1/00238 ,  B81C1/00269 ,  B81C2203/019 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05617 ,  H01L2224/05638 ,  H01L2224/061 ,  H01L2224/26145 ,  H01L2224/29017 ,  H01L2224/2902 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/29291 ,  H01L2224/32058 ,  H01L2224/321 ,  H01L2224/32106 ,  H01L2224/32148 ,  H01L2224/83203 ,  H01L2224/83365 ,  H01L2224/83805 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461

摘要： A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.

摘要翻译： 封装系统包括第一基板和第二基板。 第二基板与第一基板电耦合。 第二基板包括至少一个第一开口。 至少一个电接合材料设置在第一基板和第二基板之间。 所述至少一个电接合材料的第一部分至少部分地填充在所述至少一个第一开口中。

公开(公告)号：US20150063745A1

公开(公告)日：2015-03-05

申请号：US14472390

申请日：2014-08-29

申请人： Industrial Technology Research Institute

发明人： Jui-Ying Lin ,  Chia-Hsin Chao ,  Shu-Mei Yang ,  Chun-Hsing Lee ,  Chien-Chun Lu

IPC分类号： G02B6/12 ,  G02B6/34

CPC分类号： H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light.

摘要翻译： 光耦合模块包括硅光子衬底和光波导模块。 硅光子衬底具有在第一表面上的第一表面和第一光栅，用于衍射通过光栅的光。 光波导模块设置在硅光子基板上，其中光波导模块包括光波导，该光波导具有与硅光子基板的第一光栅对应的端部。 否则，光波导模块具有耦合到光波导的端部并且适于反射从光栅出射或入射到光栅中的光的反射表面，以在硅光子基板和用于传输光的光波导之间形成光路。

公开(公告)号：US20150063386A1

公开(公告)日：2015-03-05

申请号：US14472400

申请日：2014-08-29

申请人： Industrial Technology Research Institute

发明人： Jui-Ying Lin ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Yao-Jun Tsai ,  Yi-Chen Lin

IPC分类号： H01S5/024 ,  H01S5/02 ,  H01S5/34 ,  H01S5/026

CPC分类号： H01L23/481 ,  G02B6/12 ,  G02B6/34 ,  G02B2006/12061 ,  H01L21/30604 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L25/167 ,  H01L27/0255 ,  H01L29/861 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29294 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48148 ,  H01L2224/48229 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2224/80805 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2933/0066 ,  H01S5/0208 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/34 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

摘要翻译： 提供半导体激光器结构。 半导体激光器包括中心热分流器，环形硅波导，连续热分流器，粘合剂层和激光元件。 中心热分流器位于具有围绕中心热分流的掩埋氧化物层的SOI衬底上。 环形硅波导位于掩埋氧化层上并围绕中心热分流。 环形硅波导包括p型材料部分的P-N结，n型材料部分和其间的耗尽区域。 连续的热分流器覆盖一部分掩埋的氧化物层并且环绕着环形硅波导。 粘合剂层覆盖环形硅波导和掩埋氧化物层。 激光元件覆盖中心热分流器，粘合剂层和相邻热分流器。