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164 条记录 (耗时 0.021 秒)

    Display device
    2.
    发明授权
    Display device 有权

    公开(公告)号：US12074144B2

    公开(公告)日：2024-08-27

    申请号：US18134666

    申请日：2023-04-14

    申请人： Seoul Semiconductor Co., Ltd.

    发明人： Motonobu Takeya

    IPC分类号： H01L25/075

    CPC分类号： H01L25/075 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

    摘要： A display apparatus including a substrate and having a first substrate electrode and a second substrate electrode, and light emitting sources disposed on the substrate and spaced apart from one another, the light emitting source including a light emitting structure having an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, a p-type electrode electrically connected to the p-type semiconductor layer, an n-type electrode electrically connected to the n-type semiconductor layer, in which the first substrate electrode extends from an upper surface of the substrate facing the light emitting sources to a lower surface thereof and is electrically connected to the p-type electrode, the first substrate electrode including an upper portion having a substantially flat top surface and disposed on the upper surface of the substrate and a lower portion disposed on the lower surface of the substrate.

    Electronic device
    3.
    发明授权
    Electronic device 有权

    公开(公告)号：US12067185B2

    公开(公告)日：2024-08-20

    申请号：US18149380

    申请日：2023-01-03

    申请人： InnoLux Corporation

    发明人： Kuan-Feng Lee ,  Yuan-Lin Wu ,  Yu-Hsien Wu

    IPC分类号： G06F3/041 ,  G06F3/044 ,  H01L25/075 ,  H05K1/18 ,  H10K59/40

    CPC分类号： G06F3/0416 ,  G06F3/0412 ,  G06F3/044 ,  H01L25/075 ,  H05K1/189 ,  H10K59/40

    摘要： A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.

    Light emitting diode transfer system and control method thereof
    5.
    发明授权
    Light emitting diode transfer system and control method thereof 有权

    公开(公告)号：US11715811B2

    公开(公告)日：2023-08-01

    申请号：US17133171

    申请日：2020-12-23

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh ,  Wonsik Choi

    IPC分类号： H01L33/00 ,  H01L25/075

    CPC分类号： H01L33/005 ,  H01L25/075 ,  H01L25/0753

    摘要： A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.

    Display device
    6.
    发明授权
    Display device 有权

    公开(公告)号：US11658161B2

    公开(公告)日：2023-05-23

    申请号：US17177050

    申请日：2021-02-16

    申请人： Seoul Semiconductor Co., Ltd.

    发明人： Motonobu Takeya

    IPC分类号： H01L25/075

    CPC分类号： H01L25/075 ,  H01L2933/005 ,  H01L2933/0033 ,  H01L2933/0066

    摘要： A method of manufacturing a display apparatus including the steps of providing a plurality of light emitting diode chips on a first manufacturing substrate, placing a transferring plate above the light emitting diode chips, bonding a plurality of adhesive transferring portions disposed on the transferring plate to a portion of the light emitting diode chips disposed on the first manufacturing substrate, separating the portion of the light emitting diode chips from the first manufacturing substrate, coupling the portion of the light emitting diode chips disposed on the transferring plate to a plurality of first and second substrate electrodes disposed on a substrate, and separating the transferring plate from the portion of the light emitting diode chips coupled to the substrate, in which the adhesive transferring portions are regularly arranged in rows and columns on the transferring plate.