公开(公告)号：US10210795B2

公开(公告)日：2019-02-19

申请号：US15814253

申请日：2017-11-15

申请人： LUMENS CO., LTD.

发明人： Jinmo Kim ,  Keunoh Kim ,  Junhyung Lim ,  Huikyeong Noh ,  Seongbok Yoon ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Kyujin Lee ,  Sol Han

IPC分类号： G09G3/32 ,  G02F1/133 ,  B41J2/45 ,  H01L27/15 ,  H01L25/075 ,  H04N13/337 ,  H05K1/02 ,  H01L33/48 ,  H01L27/32

摘要： An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

公开(公告)号：US10957682B2

公开(公告)日：2021-03-23

申请号：US16655538

申请日：2019-10-17

申请人： LUMENS CO., LTD.

发明人： Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Younghwan Shin ,  Jimin Her ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L25/00 ,  H01L25/075 ,  H01L25/16 ,  H01L33/50 ,  H01L23/00

摘要： An LED display module is disclosed. The LED display module includes: an active matrix substrate including a plurality of control units; a plurality of pairs of solder bumps arranged in a matrix on the active matrix substrate by transfer printing; a plurality of LED chips including pairs of electrodes connected to the corresponding plurality of pairs of solder bumps and arranged in a matrix on the active matrix substrate by transfer printing; grid barriers formed on the active matrix substrate to isolate the plurality of LED chips into individual chip units; and a multi-color cell layer including a plurality of color cells and aligned with the active matrix substrate such that the plurality of color cells match the plurality of LED chips in a one-to-one relationship. The plurality of color cells include first color cells, second color cells, and third color cells disposed consecutively in one direction.

公开(公告)号：US10468393B2

公开(公告)日：2019-11-05

申请号：US16059019

申请日：2018-08-08

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L27/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/683 ,  H01L33/00 ,  H01L23/00 ,  H01L33/60 ,  H01L21/677 ,  H01L27/15 ,  H01L33/36 ,  H01L21/67 ,  H01L33/08 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US10096586B2

公开(公告)日：2018-10-09

申请号：US15713633

申请日：2017-09-23

申请人： LUMENS CO., LTD.

发明人： Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Younghwan Shin ,  Jimin Her ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L25/16 ,  H01L33/50 ,  H01L25/00 ,  H01L25/075 ,  H01L23/00

摘要： An LED display module is disclosed. The LED display module includes: an active matrix substrate including a plurality of control units; a plurality of pairs of solder bumps arranged in a matrix on the active matrix substrate by transfer printing; a plurality of LED chips including pairs of electrodes connected to the corresponding plurality of pairs of solder bumps and arranged in a matrix on the active matrix substrate by transfer printing; grid barriers formed on the active matrix substrate to isolate the plurality of LED chips into individual chip units; and a multi-color cell layer including a plurality of color cells and aligned with the active matrix substrate such that the plurality of color cells match the plurality of LED chips in a one-to-one relationship. The plurality of color cells include first color cells, second color cells, and third color cells disposed consecutively in one direction.

公开(公告)号：US09941259B2

公开(公告)日：2018-04-10

申请号：US15793030

申请日：2017-10-25

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L27/32 ,  H01L25/075 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/30 ,  H01L33/32 ,  H01L33/06 ,  H01L33/08

CPC分类号： H01L25/0753 ,  H01L21/67144 ,  H01L21/677 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/60 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2221/68395 ,  H01L2224/1403 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/95001 ,  H01L2224/9511 ,  H01L2224/95115 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2933/0066

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US10756071B2

公开(公告)日：2020-08-25

申请号：US16717696

申请日：2019-12-17

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L21/683 ,  H01L23/00 ,  H01L21/677 ,  H01L27/15 ,  H01L33/36 ,  H01L21/67 ,  H01L33/00 ,  H01L33/60 ,  H01L33/08 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US10756070B2

公开(公告)日：2020-08-25

申请号：US16576263

申请日：2019-09-19

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L21/683 ,  H01L33/00 ,  H01L21/677 ,  H01L33/36 ,  H01L21/67 ,  H01L23/00 ,  H01L33/60 ,  H01L27/15 ,  H01L33/08 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US10468392B2

公开(公告)日：2019-11-05

申请号：US16059017

申请日：2018-08-08

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L27/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/683 ,  H01L33/00 ,  H01L23/00 ,  H01L33/60 ,  H01L21/677 ,  H01L27/15 ,  H01L33/36 ,  H01L21/67 ,  H01L33/08 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US10103131B2

公开(公告)日：2018-10-16

申请号：US15905556

申请日：2018-02-26

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L27/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/683 ,  H01L33/00 ,  H01L23/00 ,  H01L33/60 ,  H01L21/677 ,  H01L27/15 ,  H01L33/36 ,  H01L21/67 ,  H01L33/08 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

公开(公告)号：US10559554B2

公开(公告)日：2020-02-11

申请号：US15558192

申请日：2017-08-01

申请人： LUMENS CO., LTD.

发明人： Taekyung Yoo ,  Daewon Kim ,  Jinmo Kim ,  Jinwon Choi ,  Jimin Her ,  Younghwan Shin ,  Sol Han ,  Kyujin Lee

IPC分类号： H01L25/075 ,  H01L21/683 ,  H01L21/67 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L33/60 ,  H01L21/677 ,  H01L27/15 ,  H01L33/36 ,  H01L33/08 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30

摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.