-
公开(公告)号：US11715811B2
公开(公告)日：2023-08-01
申请号：US17133171
申请日：2020-12-23
发明人： Doyoung Kwag , Byungchul Kim , Sangmoo Park , Minsub Oh , Wonsik Choi
IPC分类号： H01L33/00 , H01L25/075
CPC分类号： H01L33/005 , H01L25/075 , H01L25/0753
摘要： A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.
-
公开(公告)号：US11264531B2
公开(公告)日：2022-03-01
申请号：US16688577
申请日：2019-11-19
发明人： Sangmoo Park , Doyoung Kwag , Eunhye Kim , Minsub Oh , Yoonsuk Lee
IPC分类号： H01L21/683 , H01L33/00 , H01L21/66 , H01L25/075 , B81C1/00
摘要： A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a plurality of LEDs arranged on a first substrate to a relay substrate; a memory configured to store characteristic information of each of the plurality of LEDs; and a processor configured to determine arrangement locations of each of the plurality of LEDs on the relay substrate based on the stored characteristic information, and control the transfer part to transfer the plurality of LEDs to the determined arrangement locations.
-
公开(公告)号：US12009452B2
公开(公告)日：2024-06-11
申请号：US17258061
申请日：2019-07-23
发明人： Doyoung Kwag , Byungchul Kim , Minsub Oh , Sangmoo Park , Eunhye Kim , Yoonsuk Lee
CPC分类号： H01L33/005 , H01L27/156
摘要： An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.
-
公开(公告)号：US11587974B2
公开(公告)日：2023-02-21
申请号：US16861728
申请日：2020-04-29
发明人： Byungchul Kim , Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
摘要： A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.
-
公开(公告)号：US11348821B2
公开(公告)日：2022-05-31
申请号：US16929311
申请日：2020-07-15
发明人： Doyoung Kwag , Byungchul Kim , Sangmoo Park , Minsub Oh
IPC分类号： H01L21/683 , B23K26/03 , B23K26/04 , B23K26/08 , H01L21/67 , H01L25/075 , H01L27/12 , H01L33/62
摘要： The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.
-
公开(公告)号：US11695092B2
公开(公告)日：2023-07-04
申请号：US17674520
申请日：2022-02-17
发明人： Yoonsuk Lee , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
CPC分类号： H01L33/0095 , H01L33/62
摘要： A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
-
公开(公告)号：US11450652B2
公开(公告)日：2022-09-20
申请号：US16882914
申请日：2020-05-26
发明人： Doyoung Kwag , Byungchul Kim , Sangmoo Park , Minsub Oh
IPC分类号： H01L25/16 , H01L33/50 , H01L25/075
摘要： A micro LED transferring method is provided. The transferring method includes selectively applying a color conversion material to a mono-color substrate, the mono-color substrate including first micro LEDs in a first color; obtaining a multi-color substrate based on a result of the applying, the multi-color substrate including the first micro LEDs in the first color and second micro LEDs in a second color different from the first color; and irradiating a laser beam toward the multi-color substrate to transfer the first micro LEDs and the second micro LEDs to a target substrate.
-
公开(公告)号：US11387384B2
公开(公告)日：2022-07-12
申请号：US16850645
申请日：2020-04-16
发明人： Sangmoo Park , Minsub Oh , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Dongyeob Lee , Yoonsuk Lee
IPC分类号： H01L33/00 , H01L33/24 , H01L25/075
摘要： A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.
-
公开(公告)号：US11251222B2
公开(公告)日：2022-02-15
申请号：US16426846
申请日：2019-05-30
发明人： Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh , Yoonsuk Lee
摘要： An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.
-
公开(公告)号：US11063174B2
公开(公告)日：2021-07-13
申请号：US16653449
申请日：2019-10-15
发明人： Doyoung Kwag , Masaru Wada , Jamyeong Koo , Eunhye Kim , Sangmoo Park , Seona Yang , Minsub Oh , Yoonsuk Lee , Youngkyong Jo
摘要： A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.
-
-
-
-
-
-
-
-
-
搜索结果
26 条记录 (耗时 0.023 秒)
