公开(公告)号：US20180004030A1

公开(公告)日：2018-01-04

申请号：US15543014

申请日：2016-01-08

申请人： Sharp Kabushiki Kaisha

发明人： Katsuhiro YAMAGUCHI ,  Nobuhiro NAKATA ,  Yukinori MASUDA ,  Tomoki TAKAHARA

IPC分类号： G02F1/1345 ,  H01L23/00 ,  H01L27/12 ,  G02F1/1362 ,  H01L23/544 ,  G02F1/1368

CPC分类号： G02F1/13452 ,  G02F1/136286 ,  G02F1/1368 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L27/1218 ,  H01L27/124 ,  H01L51/50 ,  H01L2223/54426 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29355 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81132 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81466 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/1426 ,  H05K1/0269 ,  H05K1/147 ,  H05K2203/166 ,  H01L2924/00014 ,  H01L2924/00

摘要： An array substrate includes a glass substrate GS, an alignment mark 29, and first traces 19. The glass substrate GS has a corner portion 30 having an outline defined by a first edge portion 11b1 and a second edge portion 11b2 crossing the first edge portion 11b1. The alignment mark 29 is disposed at the corner portion 30 and used as the positioning index in mounting a driver 21 and a flexible printed circuit board 13. The alignment mark 29 at least includes first and second side portions 29a, 29b parallel to the first and second edge portions 11b1, 11b2, respectively. One end of the second side portion 29b is continuous to one end of the first side portion 29a. The alignment mark 29 has an outline that is on a same plane with a reference line BL connecting other ends of the first side portion 29a and the second side portion 29b linearly. The first traces 19 include inclined portions 31 that are inclined with respect to the first and second side portions 29a, 29b along the reference line BL.

公开(公告)号：US20170196133A1

公开(公告)日：2017-07-06

申请号：US15314914

申请日：2015-05-22

申请人： Sharp Kabushiki Kaisha

发明人： Katsuhiro YAMAGUCHI ,  Nobuhiro NAKATA ,  Yukinori MASUDA ,  Tomoki TAKAHARA

IPC分类号： H05K13/04 ,  H05K3/00 ,  H01L23/00 ,  H05K1/11

CPC分类号： H05K13/0469 ,  G02F1/13454 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7525 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75312 ,  H01L2224/75744 ,  H01L2224/75981 ,  H01L2224/75985 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81234 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81466 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83234 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/111 ,  H05K3/0055 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

摘要： An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.