公开(公告)号：US11699632B2

公开(公告)日：2023-07-11

申请号：US17153706

申请日：2021-01-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K13/04 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H05K13/0465 ,  H01L2224/2936 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2224/29101 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/203 ,  H01L2924/0002

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US20180072923A1

公开(公告)日：2018-03-15

申请号：US15704456

申请日：2017-09-14

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： Yumi Matsuura

IPC: C09J9/02 ,  C09J101/28 ,  C09J11/04 ,  C09J11/06 ,  C09J5/06 ,  H01L23/00 ,  B23K35/02

CPC classification number: C09J9/02 ,  B23K35/025 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L1/28 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  C09J101/28 ,  C09J2401/00 ,  C09J2433/00 ,  H01L24/05 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/2747 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/32151 ,  H01L2224/32227 ,  H01L2224/83048 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83208 ,  H01L2224/83851 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/13072 ,  H01L2924/14 ,  C08L1/284 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/06

Abstract: The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

公开(公告)号：US09583453B2

公开(公告)日：2017-02-28

申请号：US13906317

申请日：2013-05-30

Applicant: Ormet Circuits, Inc.

Inventor： Catherine Shearer ,  Michael C Matthews ,  Peter A Matturi ,  Eunsook Barber ,  Richard Weaver

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L24/27 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05663 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/06181 ,  H01L2224/27003 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27438 ,  H01L2224/278 ,  H01L2224/27848 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29373 ,  H01L2224/2938 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/30181 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83447 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01004 ,  H01L2924/01048 ,  H01L2924/01052 ,  H01L2924/0108 ,  H01L2924/01034 ,  H01L2924/01084 ,  H01L2924/01076 ,  H01L2224/27 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2224/27436 ,  H01L2221/68381

Abstract: Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.

Abstract translation: 烧结芯片附着材料为现有技术的替代品提供了具有出色的电，热和机械性能的半导体封装的无铅解决方案。 晶片施加的烧结材料在半导体裸片和被粘物以及整个芯片附着接头处形成冶金结合，并且不会在原始工艺温度下重熔。 公开了应用于晶片的一侧或两侧以及粘贴薄膜应用。

公开(公告)号：US09165872B2

公开(公告)日：2015-10-20

申请号：US14523066

申请日：2014-10-24

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn Lien ,  Xing-Xiang Huang ,  Hsing-Tsai Huang ,  Hong-Zong Xu

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L21/44 ,  H01L21/48 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/00015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/48

Abstract: A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.

Abstract translation: 由于不含外部引脚引脚的新颖的芯片尺寸二极管封装小型化，像芯片尺寸外观，以提高尺寸精度，使得二极管封装由自动化设备适当地生产以获得自动批量生产; 所生成的二极管封装可以包含一个或多个二极管芯片，以增加在应用中更有用的通用功能，例如作为SMT二极管封装或阵列型SMT二极管制造的，以及由于不含含铅材料制成的本二极管封装 符合环保要求。

公开(公告)号：US20150069638A1

公开(公告)日：2015-03-12

申请号：US14337624

申请日：2014-07-22

Applicant: Kabushiki Kaisha Toshiba

Inventor： Daisuke HIRATSUKA ,  Tomohiro IGUCHI ,  Masayuki UCHIDA

IPC: B23K35/02 ,  H01L23/00 ,  B23K35/24

CPC classification number: B23K35/025 ,  B22F1/0003 ,  B22F1/0018 ,  B22F1/0074 ,  B22F2999/00 ,  B23K35/24 ,  B23K35/262 ,  B23K35/264 ,  B23K35/282 ,  B23K35/286 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/32 ,  B23K35/322 ,  B23K35/325 ,  B23K35/3601 ,  B23K35/362 ,  C22C1/0491 ,  C22C5/06 ,  H01L21/4867 ,  H01L23/3737 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0381 ,  H01L2224/04026 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/2744 ,  H01L2224/29006 ,  H01L2224/29294 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29372 ,  H01L2224/29373 ,  H01L2224/29376 ,  H01L2224/29378 ,  H01L2224/2938 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/8322 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/8384 ,  H01L2924/01102 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1067 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/0543 ,  H01L2924/01031 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  B22F1/0022

Abstract: According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.

Abstract translation: 根据一个实施方案，金属颗粒糊包括极性溶剂和分散在极性溶剂中并含有第一金属的颗粒。 与第一金属不同的第二金属溶解在极性溶剂中。

公开(公告)号：US08950652B2

公开(公告)日：2015-02-10

申请号：US13393032

申请日：2010-09-03

Applicant: Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

Inventor： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

IPC: B23K35/22 ,  B23K35/26 ,  B23K35/34 ,  B22F1/00 ,  B22F3/10 ,  B22F7/04 ,  B23K35/02 ,  B23K35/36 ,  B23K35/365 ,  H01L23/00

CPC classification number: B23K35/34 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

Abstract translation: 提供一种烧结方法，其允许组件以稳定的方式彼此接合，其中处理温度低于200℃，并且产生稳定的接触点，其具有低孔隙率和高导电性和高导热性。 接合部件的方法包括（a）提供具有至少（a1）一种组分1，（a2）一种组分2和（a3）位于组分1和组分2之间的金属糊剂的夹层结构，和（b）烧结 三明治安排。 金属糊含有（A）75-90重量％的至少一种以颗粒形式存在的至少一种金属，其具有包含至少一种有机化合物的涂层，（B）0-12重量％的至少一种金属前体，（C ）6-20重量％的至少一种溶剂，和（D）0.1-15重量％的至少一种选自以下的烧结剂：（i）有机过氧化物，（ii）无机过氧化物和（iii）无机酸 。

公开(公告)号：US20150021378A1

公开(公告)日：2015-01-22

申请号：US14508585

申请日：2014-10-07

Applicant: Heraeus Materials Technology GmbH & Co. KG

Inventor： Michael SCHÄFER ,  Wolfgang SCHMITT ,  Jian ZENG

IPC: B23K35/362 ,  B23K1/00 ,  B23K35/02 ,  B23K1/20

CPC classification number: B23K35/34 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

Abstract translation: 提供一种烧结方法，其允许组件以稳定的方式彼此接合，其中处理温度低于200℃，并且产生稳定的接触点，其具有低孔隙率和高导电性和高导热性。 接合部件的方法包括（a）提供具有至少（a1）一种组分1，（a2）一种组分2和（a3）位于组分1和组分2之间的金属糊剂的夹层结构，和（b）烧结 三明治安排。 金属糊含有（A）75-90重量％的至少一种以颗粒形式存在的至少一种金属，所述金属具有包含至少一种有机化合物的涂层，（B）0-12重量％的至少一种金属前体，（C ）6-20重量％的至少一种溶剂，和（D）0.1-15重量％的至少一种选自以下的烧结剂：（i）有机过氧化物，（ii）无机过氧化物和（iii）无机酸 。

公开(公告)号：US20140232015A1

公开(公告)日：2014-08-21

申请号：US13769769

申请日：2013-02-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Ralf Otremba ,  Josef H°glauer

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/28 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/03011 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05582 ,  H01L2224/05584 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16145 ,  H01L2224/29116 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2224/83805 ,  H01L2224/83862 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12031 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01023 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

Abstract: In accordance with an embodiment of the present invention, a semiconductor module includes a first semiconductor package having a first semiconductor die, which is disposed in a first encapsulant. An opening is disposed in the first encapsulant. A second semiconductor package including a second semiconductor die is disposed in a second encapsulant. The second semiconductor package is disposed at least partially within the opening in the first encapsulant.

Abstract translation: 根据本发明的实施例，半导体模块包括具有设置在第一密封剂中的第一半导体管芯的第一半导体封装。 开口设置在第一密封剂中。 包括第二半导体管芯的第二半导体封装设置在第二密封剂中。 第二半导体封装至少部分地设置在第一密封剂的开口内。

公开(公告)号：US08791033B2

公开(公告)日：2014-07-29

申请号：US13707941

申请日：2012-12-07

Applicant: Henkel Corporation

Inventor： Jeffrey Gasa ,  Dung Nghi Phan ,  Jeffrey Leon ,  Sharad Hajela ,  Shengqian Kong

IPC: H01L21/56

CPC classification number: C08L63/00 ,  C08G77/28 ,  C08L83/08 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/296 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2937 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.

Abstract translation: 用涂料组合物涂覆半导体晶片的方法包括用脉冲UV光固化涂层，从而防止回流操作期间的分层。 在一个具体实施方案中，涂料组合物包含环氧树脂和丙烯酸酯树脂。 环氧树脂可以热固化; 丙烯酸酯树脂通过UV照射固化。

公开(公告)号：US20140145319A1

公开(公告)日：2014-05-29

申请号：US13685529

申请日：2012-11-26

Applicant: INFINEON TECHNOLOGIES DRESDEN GMBH

Inventor： Dirk Meinhold ,  Frank Daeche ,  Thorsten Scharf

IPC: H01L21/56 ,  H01L23/495

CPC classification number: H01L23/492 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/3185 ,  H01L23/49562 ,  H01L23/522 ,  H01L24/05 ,  H01L24/06 ,  H01L24/19 ,  H01L2224/0346 ,  H01L2224/04105 ,  H01L2224/05005 ,  H01L2224/05011 ,  H01L2224/05013 ,  H01L2224/05017 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05096 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05559 ,  H01L2224/05571 ,  H01L2224/0615 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014

Abstract: In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.

Abstract translation: 根据本发明的实施例，半导体器件包括具有第一侧和相对的第二侧的半导体芯片，以及设置在半导体芯片的第一侧上的芯片接触焊盘。 绝缘衬垫设置在半导体芯片上。 电介质衬垫包括在芯片接触焊盘上方的多个开口。 互连通过芯片接触焊盘处的多个开口接触半导体芯片。