公开(公告)号：US20180072923A1

公开(公告)日：2018-03-15

申请号：US15704456

申请日：2017-09-14

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： Yumi Matsuura

IPC: C09J9/02 ,  C09J101/28 ,  C09J11/04 ,  C09J11/06 ,  C09J5/06 ,  H01L23/00 ,  B23K35/02

CPC classification number: C09J9/02 ,  B23K35/025 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L1/28 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  C09J101/28 ,  C09J2401/00 ,  C09J2433/00 ,  H01L24/05 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/2747 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/32151 ,  H01L2224/32227 ,  H01L2224/83048 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83208 ,  H01L2224/83851 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/13072 ,  H01L2924/14 ,  C08L1/284 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/06

Abstract: The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

公开(公告)号：US20180090622A1

公开(公告)日：2018-03-29

申请号：US15560278

申请日：2016-03-03

Applicant: Nokia Technologies Oy

Inventor： Katri POHJONEN ,  Sami KALLIOINEN ,  Markku ROUVALA

IPC: H01L29/786 ,  H01L21/683 ,  H01L29/16 ,  H01L29/66 ,  H01L29/778 ,  H01L51/05

CPC classification number: H01L29/78636 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L27/0694 ,  H01L29/1606 ,  H01L29/66045 ,  H01L29/66742 ,  H01L29/778 ,  H01L29/78603 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0203 ,  H01L31/028 ,  H01L31/035209 ,  H01L31/112 ,  H01L51/0558 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/13072 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  Y02E10/547

Abstract: A method and apparatus wherein the method comprises: providing at least one electrode within a semiconductor layer wherein the semiconductor layer is provided on a first side of a wafer; thinning the wafer to produce a thinned wafer; providing graphene on a second side of the thinned wafer; attaching the semiconductor layer to an electrical interface on the first side of the thinned wafer; and providing at least one electrical connection from the graphene to the electrical interface so as to form a transistor comprising the at least one electrode and the graphene.