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1.发明申请ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND SEMICONDUCTOR DEVICE CONNECTED BY THE SAME 有权包括导电粘合层和相关连接的半导体器件的各向异性导电膜公开(公告)号：US20140291869A1
公开(公告)日：2014-10-02
申请号：US14229003
申请日：2014-03-28
Applicant: Kyoung Soo PARK , Soon Young KWON , Ji Yeon KIM , Young Woo PARK , Jae Sun HAN , Ja Young HWANG
Inventor： Kyoung Soo PARK , Soon Young KWON , Ji Yeon KIM , Young Woo PARK , Jae Sun HAN , Ja Young HWANG
CPC classification number: H01L24/29 , C08K7/16 , C08K9/02 , C09J7/00 , C09J7/10 , C09J9/02 , C09J11/00 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13013 , H01L2224/16225 , H01L2224/27003 , H01L2224/271 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29387 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/29466 , H01L2224/29471 , H01L2224/29499 , H01L2224/32225 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/07802 , H01L2924/15788 , H05K3/323 , Y10T428/24959 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).
Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。 在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径 的导电粒子）。
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2.发明授权Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same 有权各向异性导电膜包括导电粘合剂层和与其相连的半导体器件公开(公告)号：US09490228B2
公开(公告)日：2016-11-08
申请号：US14229003
申请日：2014-03-28
Applicant: Kyoung Soo Park , Soon Young Kwon , Ji Yeon Kim , Young Woo Park , Jae Sun Han , Ja Young Hwang
Inventor： Kyoung Soo Park , Soon Young Kwon , Ji Yeon Kim , Young Woo Park , Jae Sun Han , Ja Young Hwang
CPC classification number: H01L24/29 , C08K7/16 , C08K9/02 , C09J7/00 , C09J7/10 , C09J9/02 , C09J11/00 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13013 , H01L2224/16225 , H01L2224/27003 , H01L2224/271 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29387 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/29466 , H01L2224/29471 , H01L2224/29499 , H01L2224/32225 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/07802 , H01L2924/15788 , H05K3/323 , Y10T428/24959 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).
Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。 在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径 的导电粒子）。
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3.发明授权Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods 有权各向异性导电膜组合物，各向异性导电膜及其相关方法公开(公告)号：US08034261B2
公开(公告)日：2011-10-11
申请号：US12289963
申请日：2008-11-07
Applicant: Hyoun Young Kim , Dong Seon Uh , Jeong Ku Kang , Young Hoon Kim , Jae Sun Han , Ja Young Hwang , Gyu Ho Lee , Tae Hyun Lee
Inventor： Hyoun Young Kim , Dong Seon Uh , Jeong Ku Kang , Young Hoon Kim , Jae Sun Han , Ja Young Hwang , Gyu Ho Lee , Tae Hyun Lee
CPC classification number: H05K3/323 , C08J5/18 , C08J2363/00
Abstract: An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles.
Abstract translation: 各向异性导电膜组合物包括聚合物树脂，包含双酚环氧树脂，酚醛环氧树脂，缩水甘油环氧树脂，脂族环氧树脂和脂环族环氧树脂中的至少一种的第一环氧树脂，包括 缩醛环氧树脂，环氧树脂固化剂和导电颗粒。
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4.发明申请Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods 有权各向异性导电膜组合物，各向异性导电膜及其相关方法公开(公告)号：US20090140216A1
公开(公告)日：2009-06-04
申请号：US12289963
申请日：2008-11-07
Applicant: Hyoun Young Kim , Dong Seon Uh , Jeong Ku Kang , Young Hoon Kim , Jae Sun Han , Ja Young Hwang , Gyu Ho Lee , Tae Hyun Lee
Inventor： Hyoun Young Kim , Dong Seon Uh , Jeong Ku Kang , Young Hoon Kim , Jae Sun Han , Ja Young Hwang , Gyu Ho Lee , Tae Hyun Lee
CPC classification number: H05K3/323 , C08J5/18 , C08J2363/00
Abstract: An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles.
Abstract translation: 各向异性导电膜组合物包括聚合物树脂，包含双酚环氧树脂，酚醛环氧树脂，缩水甘油环氧树脂，脂族环氧树脂和脂环族环氧树脂中的至少一种的第一环氧树脂，包括 缩醛环氧树脂，环氧树脂固化剂和导电颗粒。
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