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公开(公告)号：US20230369142A1
公开(公告)日：2023-11-16
申请号：US18181171
申请日：2023-03-09
发明人： Motohito HORI , Yoshinari IKEDA , Takaaki TANAKA , Qichen WANG
IPC分类号： H01L21/66 , H01L23/049 , H01L23/373 , H01L23/00 , H01L25/18 , H01L25/07 , G01R31/28
CPC分类号： H01L22/32 , G01R31/2851 , H01L23/049 , H01L23/3735 , H01L24/48 , H01L25/072 , H01L25/18 , H01L2224/48139 , H01L2924/12031 , H01L2924/12032 , H01L2924/13055 , H01L2924/13091
摘要： A semiconductor device includes a first input conductive plate on which a plurality of first semiconductor chips arranged in a first direction, a first output conductive plate extending in the first direction and being provided adjacent to the first input conductive plate, a case having first to fourth side walls for accommodating the first input conductive plate and the first output conductive plate, first main current wiring members, each of which connects one of the first output electrodes to a front surface of the first output conductive plate, a first detection terminal disposed in the first side wall, and a first detection wiring member connecting the front surface of the first output conductive plate to the first detection terminal. The first output conductive plate is disposed closer to the first side wall than is the first input conductive plate.
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公开(公告)号：US20230197539A1
公开(公告)日：2023-06-22
申请号：US17644695
申请日：2021-12-16
发明人： David Abraham , John Michael Cotte
IPC分类号： H01L23/049 , H01L23/498 , H01L23/16 , H01L23/13 , H01L23/06 , H01L23/552 , H01L21/52
CPC分类号： H01L23/049 , H01L23/49888 , H01L23/16 , H01L23/13 , H01L23/06 , H01L23/552 , H01L21/52
摘要： Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.
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公开(公告)号：US20230092403A1
公开(公告)日：2023-03-23
申请号：US17685253
申请日：2022-03-02
发明人： Hisashi TOMITA
IPC分类号： H01L23/049 , H01L23/373 , H01L23/473 , H01L23/50
摘要： According to one embodiment, a semiconductor device includes a first container and a second container. The second container is inside the first container. A semiconductor element is inside the second container. The second container is formed of a lower portion, a side portion fixed to the lower portion, and an upper portion fixed to the side portion and the first container. The side portion is a first metal material covered with a first insulator. The lower portion and the side portion of the second container are spaced from the first container. The semiconductor device may be used as a power module or the like in some instances, and the semiconductor element may be one or more transistors of the like.
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公开(公告)号：US11348851B2
公开(公告)日：2022-05-31
申请号：US17106636
申请日：2020-11-30
发明人： Yasutaka Shimizu
IPC分类号： H01L23/48 , H01L23/34 , H01L21/00 , H05K7/00 , H05K5/00 , H01L23/049 , H01L23/10 , H01L23/367 , H01L21/56 , H01L21/48 , H01L23/31 , H01L23/373 , H01L23/055 , H01L23/053 , B23K3/047
摘要： An object is to provide a technology for enabling reduction in the time and cost taken to manufacture a die to be used for molding a case that surrounds semiconductor elements. A semiconductor device includes a base plate, a cooling plate, an insulating substrate, a semiconductor element, a case, a lead frame formed integrally with the case and including a terminal formed on one end portion of the lead frame and protruding outward, and a sealant. The case includes a pair of first case components arranged to face each other, and a pair of second case components arranged to face each other and crossing the pair of first case components. Joining end portions of the first case components to end portions of the pair of second case components forms the case.
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5.发明申请公开(公告)号：US20220068789A1
公开(公告)日：2022-03-03
申请号：US17333313
申请日：2021-05-28
发明人： Jens Pohl , Frank Pueschner
IPC分类号： H01L23/498 , H01L23/047 , H01L23/049 , H01L23/16 , H01L21/52
摘要： A package including a frame having an opening for receiving a sensor module, wherein the frame comprises at least one electrical connection which is directed into the opening and which is arranged on an insulation layer applied to the frame, and wherein the insulation layer is connected to the frame at an insertion side of the frame, from which side the sensor module is to be inserted into the opening, and is bent along the inner side of the frame proceeding from the insertion side, such that the at least one electrical connection directed to the opening is electrically couplable to the associated sensor module connection in an arrangement.
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公开(公告)号：US11233037B2
公开(公告)日：2022-01-25
申请号：US16492307
申请日：2018-04-18
申请人： ROHM CO., LTD.
IPC分类号： H01L25/07 , H01L23/049 , H01L23/29 , H01L23/31 , H01L23/373 , H01L23/00
摘要： The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer. The moisture-resistant layer is held in contact with the mounting layer and the side surface so as to be spanned between the mounting layer and the side surface in the thickness direction.
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公开(公告)号：US11114836B2
公开(公告)日：2021-09-07
申请号：US15094469
申请日：2016-04-08
发明人： Rei Yoneyama , Fumitaka Tametani , Manabu Matsumoto , Haruhiko Takemoto , Hiroshi Yoshida , Motonobu Joko
IPC分类号： H02H3/00 , H02H3/08 , H02H5/04 , H02M7/00 , H02H7/10 , H02H7/22 , H01L23/049 , H01L23/31 , H01L23/498 , H01L27/02 , H01L29/16 , H01L29/20 , H01L29/739 , H01L29/861 , H02H3/20 , H02M1/32 , H02M7/5387 , H02M1/08
摘要： The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.
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公开(公告)号：US20210043605A1
公开(公告)日：2021-02-11
申请号：US16939130
申请日：2020-07-27
IPC分类号： H01L25/065 , H01L23/538 , H01L23/00 , H01L23/367 , H01L23/64 , H01L23/049
摘要： A semiconductor module arrangement includes a housing, a first semiconductor substrate arranged inside the housing, a second semiconductor substrate arranged inside the housing, a first plurality of controllable semiconductor elements, and a second plurality of controllable semiconductor elements. During operation of the semiconductor module arrangement, each controllable semiconductor element of the first plurality of controllable semiconductor elements generates switching losses and conduction losses, the switching losses being greater than the conduction losses. Further during operation of the semiconductor module arrangement, each controllable semiconductor element of the second plurality of controllable semiconductor elements generates switching losses and conduction losses, the conduction losses being greater than the switching losses. At least a first sub-group of the first plurality of controllable semiconductor elements is arranged on the first semiconductor substrate, and at least a first sub-group of the second plurality of controllable semiconductor elements is arranged on the second semiconductor substrate.
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公开(公告)号：US10897093B2
公开(公告)日：2021-01-19
申请号：US16459514
申请日：2019-07-01
发明人： Takahiro Mitsumoto
IPC分类号： H01L23/049 , H01R4/30 , H01L23/00 , H01L23/538 , H01L25/07 , H01L25/18
摘要： In order to prevent breakage of a nut holder that holds a nut, a semiconductor apparatus includes a main terminal connected to an external conductor by a screw, a nut into which a tip of the screw is screwed, and a nut holder. The nut holder includes a recess holding the nut therein, and a peripheral wall surrounding the recess and having an opening. The peripheral wall is discontinuous at a position at which the opening is formed.
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公开(公告)号：US20200328178A1
公开(公告)日：2020-10-15
申请号：US16818515
申请日：2020-03-13
发明人： Hiroyuki MASUMOTO
IPC分类号： H01L23/00 , H01L25/07 , H01L25/18 , H01L23/049 , H01L23/373 , H01L21/48 , H01L25/00
摘要： A semiconductor device includes an insulation substrate including a circuit pattern, semiconductor chips mounted on the circuit pattern, a wire connecting between the semiconductor chips and between the semiconductor chip and the circuit pattern, and a conductive material serving as a conductor formed integrally with the wire.
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