公开(公告)号：US11948893B2

公开(公告)日：2024-04-02

申请号：US17557551

申请日：2021-12-21

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US11804414B2

公开(公告)日：2023-10-31

申请号：US17568626

申请日：2022-01-04

申请人： Mitsubishi Electric Corporation

发明人： Kazuhisa Osada ,  Yuki Yano ,  Satoru Ishikawa ,  Shohei Ogawa

IPC分类号： H01L23/047

CPC分类号： H01L23/047

摘要： An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.

公开(公告)号：US11791251B2

公开(公告)日：2023-10-17

申请号：US17388499

申请日：2021-07-29

申请人： Qorvo US, Inc.

发明人： Dylan Murdock

IPC分类号： H01L23/34 ,  H01L23/498 ,  H01L25/16 ,  H01L23/057 ,  H01L23/00 ,  H01L23/047 ,  H01L23/373

CPC分类号： H01L23/49822 ,  H01L23/49811 ,  H01L23/49838 ,  H01L25/162 ,  H01L25/165 ,  H01L23/047 ,  H01L23/057 ,  H01L23/3735 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/48155 ,  H01L2224/73265

摘要： The present disclosure relates to a package capable of handling high radio frequency (RF) power, which includes a carrier, a ring structure attached to a top surface of the carrier, an RF die attached to the top surface of the carrier within an opening of the ring structure and electrically connected to the ring structure, a heat spreader attached to a top surface of the ring structure, and an output signal lead configured to send out RF output signals generated by the RF die. Herein, the heat spreader covers a portion of the top surface of the ring structure at an output side of the package, and the output signal lead is attached to a top surface of the heat spreader. As such, the RF output signals are capable of being transmitted from the RF die to the output signal lead through the ring structure and the heat spreader.

公开(公告)号：US11742302B2

公开(公告)日：2023-08-29

申请号：US17078456

申请日：2020-10-23

申请人： Wolfspeed, Inc.

发明人： Arthur Pun ,  Basim Noori

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/495 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/047

CPC分类号： H01L23/564 ,  H01L21/4817 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/047 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/66 ,  H01L2223/6683

摘要： A method of packaging a radio frequency (RF) transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.

公开(公告)号：US20230096381A1

公开(公告)日：2023-03-30

申请号：US17878800

申请日：2022-08-01

申请人： Fuji Electric Co., Ltd.

发明人： Hiroaki ICHIKAWA

IPC分类号： H01L23/367 ,  H01L23/047 ,  H01L23/373 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L21/48

摘要： A semiconductor device includes: an electrically conductive plate; a semiconductor chip on the electrically conductive plate, the semiconductor chip having a front main electrode on a front surface thereof and a back main electrode on a back surface thereof, the back main electrode being bonded to the electrically conductive plate; and a heat radiating member that is bonded to the front main electrode via a conductive adhesive.

公开(公告)号：US20230076573A1

公开(公告)日：2023-03-09

申请号：US17984908

申请日：2022-11-10

申请人： SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.

发明人： Ikuo NAKASHIMA ,  Shingo INOUE

IPC分类号： H01L23/66 ,  H01P3/08 ,  H03H7/38 ,  H01L23/00 ,  H01L23/047

摘要： Disclosed is a package for a semiconductor device including a semiconductor die. The package includes a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess in its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.

公开(公告)号：US20230008663A1

公开(公告)日：2023-01-12

申请号：US17752073

申请日：2022-05-24

申请人： FUJI ELECTRIC CO., LTD.

发明人： Tadahiko SATO ,  Norihiro NASHIDA

IPC分类号： H01L23/047 ,  H01L21/48

摘要： A semiconductor module includes first and second semiconductor chips including first and second main electrodes, respectively; first and second connection terminals electrically connected to the first and second main electrodes, respectively; and an insulating sheet. The first connection terminal includes a first conductor portion including a first peripheral edge and a first terminal portion extending from the first peripheral edge in plan view, and the second connection terminal includes a second conductor portion including a second peripheral edge. A part of the first conductor portion overlap a part of the second conductor portion in plan view. The insulating sheet includes an insulating portion layered between the first and second conductor portions, and a first protruding portion positioned between a tip portion of the first terminal portion and the second peripheral edge in plan view, the first protruding portion forming an angle relative to a surface of the first terminal portion.

公开(公告)号：US11505131B2

公开(公告)日：2022-11-22

申请号：US16871918

申请日：2020-05-11

申请人： Apple Inc.

发明人： Christopher D. Prest ,  Stephen P. Zadesky ,  Trent Weber ,  Lucy E. Browning

IPC分类号： B60R7/04 ,  A45C11/00 ,  B60R11/02 ,  G06F1/18 ,  H01L23/043 ,  H01L23/047 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H05K5/00 ,  H05K13/00 ,  G06F1/16 ,  H05K5/02 ,  H05K5/04 ,  H05K5/06 ,  B60R11/00

摘要： An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

公开(公告)号：US20220223511A1

公开(公告)日：2022-07-14

申请号：US17372226

申请日：2021-07-09

申请人： Mitsubishi Electric Corporation

发明人： Yoshitaka KIMURA ,  Hiroyuki MASUMOTO

IPC分类号： H01L23/498 ,  H01L23/047 ,  H01L23/00

摘要： A semiconductor device includes: an insulating substrate including a circuit pattern; a semiconductor chip mounted on the insulating substrate and connected to the circuit pattern; and an overcurrent interruption mechanism constituted with a same material as material of the circuit pattern, connected to the circuit pattern in series, wherein when an overcurrent flows, the overcurrent interruption mechanism melts and is cut.

公开(公告)号：US20210398880A1

公开(公告)日：2021-12-23

申请号：US17242812

申请日：2021-04-28

申请人： FUJI ELECTRIC CO., LTD.

发明人： Naoyuki KANAI ,  Yuichiro HINATA

IPC分类号： H01L23/49 ,  H01L23/047 ,  H01L23/31 ,  H01L23/373 ,  H01L23/50 ,  H01L21/48 ,  H01L21/56

摘要： Provided are a semiconductor module capable of easily connecting extraction pin with a wiring board and having reliable connections, and a method for manufacturing the same. A semiconductor module includes: a multilayer board having a semiconductor device mounted thereon, the multilayer board electrically connecting to the semiconductor device; an extraction pin electrically connecting to one of the semiconductor device and the multilayer board; and a wiring board bonded to the extraction pin for electrical connection. The extraction pin has a press-fit. The wiring board has a hole portion bonded with the press-fit of the extraction pin. The base materials of the press-fit of the extraction pin and the hole portion of the wiring board are copper (Cu). A bonded portion between the base materials of press-fit and the corresponding hole portion of the wiring board includes a CuSnNi alloy layer.