公开(公告)号：US11948893B2

公开(公告)日：2024-04-02

申请号：US17557551

申请日：2021-12-21

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US20170229368A1

公开(公告)日：2017-08-10

申请号：US15231922

申请日：2016-08-09

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Craig Steinbeiser ,  Oleh Krutko ,  John Beall

IPC分类号： H01L23/367 ,  H01L23/552 ,  H01L21/48 ,  H01L23/66 ,  H01L23/055 ,  H01L21/52

CPC分类号： H01L23/3675 ,  H01L23/055 ,  H01L23/49827 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16153 ,  H01L2924/00014

摘要： Top-side cooling of Radio Frequency (RF) products in air cavity packages is provided. According to one aspect, an air cavity package comprises a substrate, a RF component mounted to the substrate, and a lid structure comprising a first material and being mounted to the substrate that covers the RF component such that a cavity is formed within the lid structure and about the RF component. At least one opening is provided in a top portion of the lid. The air cavity package also comprises a heat transfer structure comprising a second material and comprising a heat path extending from the top surface of the substrate through the opening(s) in the lid to the top outer surface of the air cavity package to provide a top-side thermal interface. In one embodiment, the lid is comprised of a molded material that absorbs RF signals and the heat transfer structure is metal.

公开(公告)号：US12087656B2

公开(公告)日：2024-09-10

申请号：US18303152

申请日：2023-04-19

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Robert Charles Dry ,  Mihir Roy

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

CPC分类号： H01L23/367 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/18161

摘要： The present disclosure relates to a package architecture and a method for making the same. The disclosed package architecture includes a package carrier, a first device die and a second device die mounted on the package carrier, and a heat spreader. The first device die includes a first device body with a thickness between 5 μm and 130 μm, a die carrier, and an attachment section between the first device body and the die carrier, while the second device die includes a second device body. The first device body and the second device body are formed of different materials. A top surface of the die carrier of the first device die and a top surface of the second device body of the second device die are substantially coplanar. The heat spreader resides over the top surface of the die carrier and the top surface of the second device body.

公开(公告)号：US11637050B2

公开(公告)日：2023-04-25

申请号：US17219189

申请日：2021-03-31

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Robert Charles Dry ,  Mihir Roy

IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L21/78 ,  H01L25/07

摘要： The present disclosure relates to a package architecture and a method for making the same. The disclosed package architecture includes a package carrier, a first device die and a second device die mounted on the package carrier, and a heat spreader. The first device die includes a first device body with a thickness between 5 μm and 130 μm, a die carrier, and an attachment section between the first device body and the die carrier, while the second device die includes a second device body. The first device body and the second device body are formed of different materials. A top surface of the die carrier of the first device die and a top surface of the second device body of the second device die are substantially coplanar. The heat spreader resides over the top surface of the die carrier and the top surface of the second device body.

公开(公告)号：US20220319945A1

公开(公告)日：2022-10-06

申请号：US17219189

申请日：2021-03-31

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Robert Charles Dry ,  Mihir Roy

IPC分类号： H01L23/367 ,  H01L25/07 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

摘要： The present disclosure relates to a package architecture and a method for making the same. The disclosed package architecture includes a package carrier, a first device die and a second device die mounted on the package carrier, and a heat spreader. The first device die includes a first device body with a thickness between 5 μm and 130 μm, a die carrier, and an attachment section between the first device body and the die carrier, while the second device die includes a second device body. The first device body and the second device body are formed of different materials. A top surface of the die carrier of the first device die and a top surface of the second device body of the second device die are substantially coplanar. The heat spreader resides over the top surface of the die carrier and the top surface of the second device body.

公开(公告)号：US10177064B2

公开(公告)日：2019-01-08

申请号：US15364752

申请日：2016-11-30

申请人： Qorvo US, Inc.

发明人： Kevin J. Anderson ,  Anthony Chiu ,  Tarak A. Railkar

IPC分类号： H01L23/367 ,  H01L23/66 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498

摘要： The present disclosure relates to an air-cavity package, which includes a substrate, a base, and a semiconductor die. The substrate includes a substrate body, thermal vias extending through the substrate body, and a metal trace on a bottom side of the substrate body and separate from the thermal vias. The base includes a base body, a perimeter wall extending about a perimeter of the base body, and a signal via structure. Herein, the bottom side of the substrate body resides on the perimeter wall to form a cavity, and the signal via structure extends through the perimeter wall and is electrically coupled to the metal trace. The semiconductor die is mounted on the bottom side of the substrate body, exposed to the cavity, and electrically coupled to the metal trace. The thermal vias conduct heat generated from the semiconductor die toward a top side of the substrate body.

公开(公告)号：US20240250041A1

公开(公告)日：2024-07-25

申请号：US18592693

申请日：2024-03-01

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US20230298958A1

公开(公告)日：2023-09-21

申请号：US18303152

申请日：2023-04-19

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Robert Charles Dry ,  Mihir Roy

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L25/07

CPC分类号： H01L23/367 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/18161

摘要： The present disclosure relates to a package architecture and a method for making the same. The disclosed package architecture includes a package carrier, a first device die and a second device die mounted on the package carrier, and a heat spreader. The first device die includes a first device body with a thickness between 5 µm and 130 µm, a die carrier, and an attachment section between the first device body and the die carrier, while the second device die includes a second device body. The first device body and the second device body are formed of different materials. A top surface of the die carrier of the first device die and a top surface of the second device body of the second device die are substantially coplanar. The heat spreader resides over the top surface of the die carrier and the top surface of the second device body.

公开(公告)号：US20220310471A1

公开(公告)日：2022-09-29

申请号：US17213974

申请日：2021-03-26

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Bror Peterson ,  Andrew Ketterson

IPC分类号： H01L23/367 ,  H01L25/18 ,  H01L23/48 ,  H01L23/66 ,  H01L23/373 ,  H01L49/02 ,  H01L23/00

摘要： The disclosure is directed to an integrated circuit (IC) die stacked with a backer die, including capacitors and thermal vias. The backer die includes a substrate material to contain and electrically insulate one or more capacitors at a back of the IC die. The backer die further includes a thermal material that is more thermally conductive than the substrate material for thermal spreading and increased heat dissipation. In particular, the backer die electrically couples capacitors to the IC die in a stacked configuration while also spreading and dissipating heat from the IC die. Such a configuration reduces an overall footprint of the electronic device, resulting in decreased integrated circuits (IC) packages and module sizes. In other words, instead of placing the capacitors next to the IC die, the capacitors are stacked on top of the IC die, thereby reducing an overall surface area of the package.

公开(公告)号：US20240297116A1

公开(公告)日：2024-09-05

申请号：US18442937

申请日：2024-02-15

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Terry Joe Hon

IPC分类号： H01L23/528 ,  H01L21/60 ,  H01L21/768 ,  H01L23/14

CPC分类号： H01L23/5283 ,  H01L21/60 ,  H01L21/7688 ,  H01L23/142 ,  H01L23/5286

摘要： An integrated packaging device is provided. The integrated device includes a base layer, an insulating layer over and in contact with the base layer, and a conductive layer over and in contact with the insulating layer. The conductive layer includes a conductive pattern. The integrated device also includes an opening extending from the conductive layer to the base layer. The conductive pattern surrounds the opening.