公开(公告)号：US20240250041A1

公开(公告)日：2024-07-25

申请号：US18592693

申请日：2024-03-01

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US20230197629A1

公开(公告)日：2023-06-22

申请号：US17557551

申请日：2021-12-21

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US11948893B2

公开(公告)日：2024-04-02

申请号：US17557551

申请日：2021-12-21

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US20180130722A1

公开(公告)日：2018-05-10

申请号：US15605587

申请日：2017-05-25

申请人： Qorvo US, Inc.

发明人： Larry Wall ,  Christopher Sanabria

IPC分类号： H01L23/495 ,  H01L29/20 ,  H01L29/16 ,  H01L23/31

CPC分类号： H01L23/49513 ,  H01L23/043 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49861 ,  H01L23/58 ,  H01L24/00 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1608 ,  H01L29/20 ,  H01L29/2003

摘要： The present disclosure relates to a semiconductor package with at least one grounded fence to inhibit dendrites of die-attach materials. The semiconductor package includes a carrier, a die-attach material, and a wire-bonded die. The carrier includes a die pad and a negative carrier contact. The wire-bonded die includes a die body, a negative die contact, a grounded fence, and a bonding wire. A bottom surface of the die body is coupled to the die pad by the die-attach material. The negative die contact and the grounded fence reside over a top surface of the die body. The grounded fence, which has a same DC potential as the die pad, extends between the negative die contact and a periphery of the top surface of the die body. The bonding wire extends from the negative die contact to the negative carrier contact.

公开(公告)号：US20230170340A1

公开(公告)日：2023-06-01

申请号：US17538517

申请日：2021-11-30

申请人： Qorvo US, Inc.

发明人： Matthew Essar ,  Curtis Miller ,  Christopher Sanabria ,  Zhunming Du

IPC分类号： H01L25/16 ,  H01L23/492 ,  H01L23/00 ,  H01L23/498 ,  H01L23/64 ,  H01L23/66 ,  H01L23/043

CPC分类号： H01L25/165 ,  H01L23/492 ,  H01L24/32 ,  H01L24/29 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/66 ,  H01L24/48 ,  H01L23/043 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/29144 ,  H01L2224/29111 ,  H01L2223/6683 ,  H01L2224/48195 ,  H01L2224/83801

摘要： The disclosure is directed to an electronic package with an interposer between integrated circuit dies. At least one inner capacitor (e.g., single layer capacitor) is mounted to the interposer. The electronic package further includes an input passive circuit substrate and an output passive circuit substrate mechanically coupled to the metal base. Use of an interposer to be simultaneously solder attached with integrated circuit dies provides a configuration that improves linearity performance and/or wide video bandwidth of the electronic package (e.g., packages that use epoxy and laminate interposers). Further, such configuration facilitates efficient manufacturing of the electronic package at high volumes.

公开(公告)号：US10186476B2

公开(公告)日：2019-01-22

申请号：US15605587

申请日：2017-05-25

申请人： Qorvo US, Inc.

发明人： Larry Wall ,  Christopher Sanabria

IPC分类号： H01L29/15 ,  H01L23/495 ,  H01L29/20 ,  H01L29/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/00 ,  H01L23/043

摘要： The present disclosure relates to a semiconductor package with at least one grounded fence to inhibit dendrites of die-attach materials. The semiconductor package includes a carrier, a die-attach material, and a wire-bonded die. The carrier includes a die pad and a negative carrier contact. The wire-bonded die includes a die body, a negative die contact, a grounded fence, and a bonding wire. A bottom surface of the die body is coupled to the die pad by the die-attach material. The negative die contact and the grounded fence reside over a top surface of the die body. The grounded fence, which has a same DC potential as the die pad, extends between the negative die contact and a periphery of the top surface of the die body. The bonding wire extends from the negative die contact to the negative carrier contact.